KR20100110803A - 뒤틀림 데이터로부터의 피드백을 사용하는 나노 형상 제어 및 최적화 - Google Patents

뒤틀림 데이터로부터의 피드백을 사용하는 나노 형상 제어 및 최적화 Download PDF

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Publication number
KR20100110803A
KR20100110803A KR1020107014398A KR20107014398A KR20100110803A KR 20100110803 A KR20100110803 A KR 20100110803A KR 1020107014398 A KR1020107014398 A KR 1020107014398A KR 20107014398 A KR20107014398 A KR 20107014398A KR 20100110803 A KR20100110803 A KR 20100110803A
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South Korea
Prior art keywords
wafer
grinding
ground
grinding machine
double
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Ceased
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KR1020107014398A
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English (en)
Korean (ko)
Inventor
수미트 에스. 바가바트
롤랜드 알. 밴담
도모미 고무라
도모히꼬 가네꼬
다꾸또 가자마
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
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Publication of KR20100110803A publication Critical patent/KR20100110803A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020107014398A 2007-12-31 2008-12-29 뒤틀림 데이터로부터의 피드백을 사용하는 나노 형상 제어 및 최적화 Ceased KR20100110803A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/967,743 US7930058B2 (en) 2006-01-30 2007-12-31 Nanotopography control and optimization using feedback from warp data
US11/967,743 2007-12-31

Publications (1)

Publication Number Publication Date
KR20100110803A true KR20100110803A (ko) 2010-10-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107014398A Ceased KR20100110803A (ko) 2007-12-31 2008-12-29 뒤틀림 데이터로부터의 피드백을 사용하는 나노 형상 제어 및 최적화

Country Status (7)

Country Link
US (2) US7930058B2 (https=)
EP (1) EP2225070B1 (https=)
JP (1) JP2011507719A (https=)
KR (1) KR20100110803A (https=)
CN (1) CN101909817A (https=)
TW (1) TWI446992B (https=)
WO (1) WO2009088832A1 (https=)

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TWI763112B (zh) * 2020-04-22 2022-05-01 財團法人工業技術研究院 研磨拋光模擬方法、系統及研磨拋光製程轉移方法
CN112071765B (zh) * 2020-08-18 2024-07-30 中环领先(徐州)半导体材料有限公司 确定晶圆加工参数的方法和晶圆的加工方法
CN112259442B (zh) * 2020-09-11 2024-05-24 中环领先(徐州)半导体材料有限公司 晶圆双面减薄的方法和装置、存储介质
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CN115194639B (zh) * 2022-06-30 2023-12-29 江西兆驰半导体有限公司 一种蓝宝石衬底片切割后的分类加工方法及外延片
CN117577512A (zh) * 2022-08-08 2024-02-20 万华化学集团电子材料有限公司 一种12寸研磨片波纹度的可视化检测方法及硅片研磨方法
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Also Published As

Publication number Publication date
EP2225070A1 (en) 2010-09-08
US20110045740A1 (en) 2011-02-24
CN101909817A (zh) 2010-12-08
WO2009088832A1 (en) 2009-07-16
TWI446992B (zh) 2014-08-01
US20080166948A1 (en) 2008-07-10
JP2011507719A (ja) 2011-03-10
EP2225070B1 (en) 2014-02-12
TW200946284A (en) 2009-11-16
US8145342B2 (en) 2012-03-27
US7930058B2 (en) 2011-04-19

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