KR20100083146A - 경화성 실리콘 조성물 및 이의 경화물 - Google Patents

경화성 실리콘 조성물 및 이의 경화물 Download PDF

Info

Publication number
KR20100083146A
KR20100083146A KR1020107008091A KR20107008091A KR20100083146A KR 20100083146 A KR20100083146 A KR 20100083146A KR 1020107008091 A KR1020107008091 A KR 1020107008091A KR 20107008091 A KR20107008091 A KR 20107008091A KR 20100083146 A KR20100083146 A KR 20100083146A
Authority
KR
South Korea
Prior art keywords
component
curable silicone
silicone composition
groups
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020107008091A
Other languages
English (en)
Korean (ko)
Inventor
요시츠구 모리타
히로시 우에키
Original Assignee
다우 코닝 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20100083146A publication Critical patent/KR20100083146A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107008091A 2007-10-16 2008-10-06 경화성 실리콘 조성물 및 이의 경화물 Abandoned KR20100083146A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-269034 2007-10-16
JP2007269034A JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物

Publications (1)

Publication Number Publication Date
KR20100083146A true KR20100083146A (ko) 2010-07-21

Family

ID=40567912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107008091A Abandoned KR20100083146A (ko) 2007-10-16 2008-10-06 경화성 실리콘 조성물 및 이의 경화물

Country Status (8)

Country Link
US (1) US8563666B2 (https=)
EP (1) EP2201068B1 (https=)
JP (1) JP5422109B2 (https=)
KR (1) KR20100083146A (https=)
CN (1) CN101827891B (https=)
AT (1) ATE514751T1 (https=)
TW (1) TW200934826A (https=)
WO (1) WO2009051084A2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
US20130146118A1 (en) * 2011-12-12 2013-06-13 Dow Corning Corporation Silicone Junction Box and Assemblies
CN104955905B (zh) 2013-02-27 2017-11-28 株式会社朝日橡胶 白色反射膜用油墨、粉体涂料、白色反射膜及其制造方法、光源支架及照明器具遮光罩
WO2014156905A1 (ja) * 2013-03-25 2014-10-02 大日本印刷株式会社 電池用包装材料
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
WO2016098305A1 (ja) * 2014-12-18 2016-06-23 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法
CN104774470B (zh) * 2015-03-25 2017-07-07 清华大学深圳研究生院 一种用于大功率led的密封剂及大功率led
JP6736844B2 (ja) * 2015-07-16 2020-08-05 凸版印刷株式会社 化粧シート及び化粧板
WO2017094703A1 (ja) * 2015-11-30 2017-06-08 住友理工株式会社 電子写真機器用弾性ロールおよびその製造方法
JP6847597B2 (ja) * 2016-06-22 2021-03-24 株式会社ダイセル シルセスキオキサン
JP6610491B2 (ja) * 2016-10-03 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
KR20200035408A (ko) * 2017-07-31 2020-04-03 다우 글로벌 테크놀로지스 엘엘씨 아이스-포빅 코팅
US11326059B2 (en) 2017-09-07 2022-05-10 Dow Global Technologies Llc Thermally conductive ice-phobic coatings
CN108276777A (zh) * 2018-01-23 2018-07-13 苏州矽美科导热科技有限公司 一种高弹力导热硅胶片及其制备方法
KR102565878B1 (ko) 2018-02-16 2023-08-10 가부시끼가이샤 레조낙 열전도 시트 및 열전도 시트를 사용한 방열 장치
CN108727831A (zh) * 2018-05-23 2018-11-02 湖南博隽生物医药有限公司 一种医用抗菌硅胶材料及其制备方法
EP4249461A4 (en) * 2020-11-20 2024-11-20 Shin-Etsu Chemical Co., Ltd. Phenol compound, electroconductive paste composition, method for producing electroconductive paste composition, and electroconductive wiring line and production method therefor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP2705519B2 (ja) 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
EP0620242B1 (en) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxy group-containing silicone resin and compositions based thereon
JP3466239B2 (ja) 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US6140445A (en) * 1998-04-17 2000-10-31 Crompton Corporation Silane functional oligomer
JP3773022B2 (ja) 1999-02-12 2006-05-10 信越化学工業株式会社 フリップチップ型半導体装置
US6225704B1 (en) * 1999-02-12 2001-05-01 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) * 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

Also Published As

Publication number Publication date
EP2201068B1 (en) 2011-06-29
CN101827891A (zh) 2010-09-08
ATE514751T1 (de) 2011-07-15
JP5422109B2 (ja) 2014-02-19
EP2201068A2 (en) 2010-06-30
JP2009096865A (ja) 2009-05-07
WO2009051084A3 (en) 2009-06-25
US20100213404A1 (en) 2010-08-26
TW200934826A (en) 2009-08-16
CN101827891B (zh) 2012-05-23
WO2009051084A2 (en) 2009-04-23
US8563666B2 (en) 2013-10-22

Similar Documents

Publication Publication Date Title
EP2201068B1 (en) Curable silicone composition and cured product thereof
JP5004433B2 (ja) 硬化性シリコーン組成物およびその硬化物
EP2061839B1 (en) Curable silicone composition and electronic component
CN101563425B (zh) 可固化的硅氧烷组合物和电子组件
JP5166677B2 (ja) 硬化性シリコーン組成物および電子部品
JP4799848B2 (ja) 硬化性シリコーン組成物およびその硬化物
KR20090099059A (ko) 경화성 실리콘 조성물
JP4931366B2 (ja) 硬化性シリコーン組成物および電子部品
JP5285838B2 (ja) 硬化性シリコーン組成物およびその硬化物
JP5388409B2 (ja) 硬化性シリコーン組成物およびその硬化物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100414

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20130902

Comment text: Request for Examination of Application

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20140813

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee