KR20100075761A - 와이어 소 및 와이어 소 시스템 - Google Patents

와이어 소 및 와이어 소 시스템 Download PDF

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Publication number
KR20100075761A
KR20100075761A KR1020090130467A KR20090130467A KR20100075761A KR 20100075761 A KR20100075761 A KR 20100075761A KR 1020090130467 A KR1020090130467 A KR 1020090130467A KR 20090130467 A KR20090130467 A KR 20090130467A KR 20100075761 A KR20100075761 A KR 20100075761A
Authority
KR
South Korea
Prior art keywords
workpiece
wire saw
holding
holding member
guide
Prior art date
Application number
KR1020090130467A
Other languages
English (en)
Korean (ko)
Inventor
시게오 코바야시
히토시 구시켄
Original Assignee
코마츠 엔티씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코마츠 엔티씨 가부시끼가이샤 filed Critical 코마츠 엔티씨 가부시끼가이샤
Publication of KR20100075761A publication Critical patent/KR20100075761A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020090130467A 2008-12-25 2009-12-24 와이어 소 및 와이어 소 시스템 KR20100075761A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-331528 2008-12-25
JP2008331528A JP4825867B2 (ja) 2008-12-25 2008-12-25 ワイヤソーシステム

Publications (1)

Publication Number Publication Date
KR20100075761A true KR20100075761A (ko) 2010-07-05

Family

ID=42510806

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090130467A KR20100075761A (ko) 2008-12-25 2009-12-24 와이어 소 및 와이어 소 시스템

Country Status (4)

Country Link
JP (1) JP4825867B2 (zh)
KR (1) KR20100075761A (zh)
CN (1) CN101774149B (zh)
TW (1) TWI481489B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113102A (ko) * 2014-01-29 2016-09-28 고오슈우하네쓰렌 가부시기가이샤 와이어 삽입 장치, 세장형 작업부재 권취 장치, 및 와이어 삽입 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2477955B (en) * 2010-02-19 2015-01-28 Belron Hungary Kft Zug Branch Wire handling for vehicle glazing panel cut out
WO2012031900A1 (en) * 2010-09-06 2012-03-15 Meyer Burger Ag Method and transfer appliance for loading and unloading a wire saw cutting machine
JP5016122B1 (ja) * 2011-03-07 2012-09-05 コマツＮｔｃ株式会社 測定用治具、ワイヤソー、及びワーク装着方法
JP5041613B1 (ja) * 2011-03-28 2012-10-03 コマツＮｔｃ株式会社 ワイヤソー用リフター
JP5996308B2 (ja) 2012-07-10 2016-09-21 コマツＮｔｃ株式会社 ワイヤソー
JP7372097B2 (ja) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 ワイヤソー及びワイヤソーのワークの搬入出方法
JP7372098B2 (ja) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 ワイヤソー及びワイヤソーのワークの搬入出方法
CN113941939B (zh) * 2021-10-28 2022-06-24 连云港福东正佑照明电器有限公司 一种基于双面打磨机构的加工设备及其加工工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3178653B2 (ja) * 1996-10-25 2001-06-25 株式会社東京精密 ワイヤソー
JPH10202499A (ja) * 1997-01-14 1998-08-04 Tokyo Seimitsu Co Ltd ワイヤソー
JPH1070172A (ja) * 1997-08-21 1998-03-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11188600A (ja) * 1997-12-26 1999-07-13 Nippei Toyama Corp ワイヤソー及びワーク搬入出方法
JPH11262852A (ja) * 1998-03-19 1999-09-28 Shin Etsu Handotai Co Ltd 切断終了検知装置付ワイヤーソー装置 及びワークの切断方法
JP3976556B2 (ja) * 2001-11-30 2007-09-19 Ｄｏｗａホールディングス株式会社 ワイヤソー
JP4053800B2 (ja) * 2002-03-25 2008-02-27 東京エレクトロン株式会社 基板処理装置
JP4901550B2 (ja) * 2007-03-30 2012-03-21 トーヨーエイテック株式会社 ワイヤソー
JP2009282514A (ja) * 2008-04-24 2009-12-03 Kobe Steel Ltd 表示装置用Ａｌ合金膜、表示装置およびスパッタリングターゲット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113102A (ko) * 2014-01-29 2016-09-28 고오슈우하네쓰렌 가부시기가이샤 와이어 삽입 장치, 세장형 작업부재 권취 장치, 및 와이어 삽입 방법

Also Published As

Publication number Publication date
CN101774149A (zh) 2010-07-14
JP2010149248A (ja) 2010-07-08
JP4825867B2 (ja) 2011-11-30
TWI481489B (zh) 2015-04-21
TW201024056A (en) 2010-07-01
CN101774149B (zh) 2014-08-13

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