KR20100051039A - Rfid 시스템용 칩 모듈 - Google Patents

Rfid 시스템용 칩 모듈 Download PDF

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Publication number
KR20100051039A
KR20100051039A KR1020097019846A KR20097019846A KR20100051039A KR 20100051039 A KR20100051039 A KR 20100051039A KR 1020097019846 A KR1020097019846 A KR 1020097019846A KR 20097019846 A KR20097019846 A KR 20097019846A KR 20100051039 A KR20100051039 A KR 20100051039A
Authority
KR
South Korea
Prior art keywords
rfid
adhesive
aluminum
film
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097019846A
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English (en)
Korean (ko)
Inventor
마르틴 본
Original Assignee
비엘로마틱 로이쩨 게엠베하 운트 코 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 비엘로마틱 로이쩨 게엠베하 운트 코 카게 filed Critical 비엘로마틱 로이쩨 게엠베하 운트 코 카게
Publication of KR20100051039A publication Critical patent/KR20100051039A/ko
Ceased legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082Partial cutting bonded sandwich [e.g., grooving or incising]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
KR1020097019846A 2007-09-04 2008-09-03 Rfid 시스템용 칩 모듈 Ceased KR20100051039A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007041752A DE102007041752A1 (de) 2007-09-04 2007-09-04 Chipmodul für ein RFID-System
DE102007041752.9 2007-09-04

Publications (1)

Publication Number Publication Date
KR20100051039A true KR20100051039A (ko) 2010-05-14

Family

ID=40158664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097019846A Ceased KR20100051039A (ko) 2007-09-04 2008-09-03 Rfid 시스템용 칩 모듈

Country Status (8)

Country Link
US (1) US8371509B2 (enExample)
EP (1) EP2183705B1 (enExample)
JP (1) JP5377493B2 (enExample)
KR (1) KR20100051039A (enExample)
CN (1) CN101663678B (enExample)
CA (1) CA2696119A1 (enExample)
DE (1) DE102007041752A1 (enExample)
WO (1) WO2009030463A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101531383B1 (ko) * 2014-07-07 2015-06-24 주식회사 에이티앤씨 스티커형 안테나 제조방법
KR20160063214A (ko) * 2014-11-26 2016-06-03 김우중 갈바닉 내부식특성을 향상시킨 이동통신 단말기용 안테나의 제작방법, 이에 의해 제조된 이동통신 단말기용 케이스 및 이를 갖는 이동통신 단말기

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006052517A1 (de) * 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chipmodul für ein RFID-System
DE102007026720A1 (de) * 2007-06-06 2008-12-11 Bielomatik Leuze Gmbh + Co.Kg Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung
EP2432074A1 (de) * 2010-09-21 2012-03-21 Printechnologics GmbH Baugruppe mit wenigstens einer UHF-Dipol-Antenne
DE102010056055A1 (de) * 2010-12-23 2012-06-28 Schreiner Group Gmbh & Co. Kg Etikett mit einem elektronischen Funktionselement
BR112013024446A2 (pt) * 2011-03-24 2019-09-24 Tagsys Sas conjunto de etiqueta para fixar uma etiqueta rfid, método de fixação de uma etiqueta rfid, processo para produzir um rótulo rfid, processo para fixar uma etiqueta rfid, conjunto de rótulo rfid fundível por calor, conjunto de etiqueta ou rótulo, e, método de froduzir o mesmo
WO2013128299A1 (en) * 2012-03-02 2013-09-06 Usta Kutluhan Enhanced antenna structure for rfid tags
DE102013215706A1 (de) * 2013-08-08 2015-02-12 Bielomatik Leuze Gmbh + Co. Kg Transfer-Stanzen
DE102014102519A1 (de) 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
WO2016072301A1 (ja) * 2014-11-07 2016-05-12 株式会社村田製作所 キャリアテープ及びその製造方法、並びにrfidタグの製造方法
JP7377490B2 (ja) * 2019-11-19 2023-11-10 大王製紙株式会社 Rfidタグ
JP7457519B2 (ja) * 2020-02-18 2024-03-28 株式会社ブリヂストン 航空機用タイヤ
WO2022224002A1 (en) * 2021-04-22 2022-10-27 Sml Brand Identification Solutionslimited Extensible and modular rfid device

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JPH10293828A (ja) * 1997-04-18 1998-11-04 Omron Corp データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法
US6297727B1 (en) * 1997-05-05 2001-10-02 George N. Nelson, Jr. Transponder identification and record assembly
DE19837689A1 (de) * 1998-08-19 2000-02-24 Baumer Ident Gmbh Anordnung zur Kennzeichnung von Objekten
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
WO2002089338A2 (en) * 2001-04-30 2002-11-07 Bnc Ip Switzerland Gmbh Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
JP2002352206A (ja) * 2001-05-30 2002-12-06 Toppan Forms Co Ltd データ送受信体の製造方法
JP2003030612A (ja) * 2001-07-19 2003-01-31 Oji Paper Co Ltd Icチップ実装体
JP2003037427A (ja) * 2001-07-24 2003-02-07 Dainippon Printing Co Ltd アンテナパターンの製造方法
HUP0402519A2 (hu) * 2001-12-21 2005-05-30 Giesecke & Devrient Gmbh Lapanyag, berendezés, valamint eljárás a lapanyag előállítására és feldolgozására
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
JP4236974B2 (ja) * 2003-03-28 2009-03-11 トッパン・フォームズ株式会社 非接触型情報記録媒体
NL1025869C2 (nl) * 2004-04-02 2005-10-05 Capturetech Benelux B V Samenstel van kluis en daarbij te gebruiken verzegelbare flexibele waardehouders.
JP2005311179A (ja) * 2004-04-23 2005-11-04 Dainippon Printing Co Ltd 非接触データキャリア用導電部材製造方法および非接触データキャリア用導電部材製造装置
US20060044769A1 (en) * 2004-09-01 2006-03-02 Forster Ian J RFID device with magnetic coupling
JP2006157705A (ja) * 2004-11-30 2006-06-15 Oubiken:Kk 電磁波吸収部材および携帯電話機用アンテナ
JP4541246B2 (ja) * 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 非接触icモジュール
CN101262957B (zh) * 2005-08-24 2011-06-29 A.M.兰普股份有限公司 生产具有导电涂层的制品的方法
DE202005021190U1 (de) * 2005-08-31 2007-04-26 Krones Ag Herstellung von Etiketten und Etikettierung
DE102005042444B4 (de) * 2005-09-06 2007-10-11 Ksw Microtec Ag Anordnung für eine RFID - Transponder - Antenne
JP2007080766A (ja) * 2005-09-16 2007-03-29 Dainippon Printing Co Ltd 導電性パターン形成用金属箔シート
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102006052517A1 (de) 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chipmodul für ein RFID-System
DE102007026720A1 (de) 2007-06-06 2008-12-11 Bielomatik Leuze Gmbh + Co.Kg Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung
JP2009075687A (ja) * 2007-09-19 2009-04-09 Hitachi Ltd Rfidタグ
US20100001862A1 (en) * 2008-07-03 2010-01-07 James Charles Wilson Method for authenticating radio frequency identification

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101531383B1 (ko) * 2014-07-07 2015-06-24 주식회사 에이티앤씨 스티커형 안테나 제조방법
KR20160063214A (ko) * 2014-11-26 2016-06-03 김우중 갈바닉 내부식특성을 향상시킨 이동통신 단말기용 안테나의 제작방법, 이에 의해 제조된 이동통신 단말기용 케이스 및 이를 갖는 이동통신 단말기

Also Published As

Publication number Publication date
CN101663678B (zh) 2013-05-22
EP2183705B1 (de) 2016-11-23
DE102007041752A1 (de) 2009-03-05
US8371509B2 (en) 2013-02-12
WO2009030463A1 (de) 2009-03-12
CA2696119A1 (en) 2009-03-12
JP2010538556A (ja) 2010-12-09
EP2183705A1 (de) 2010-05-12
JP5377493B2 (ja) 2013-12-25
CN101663678A (zh) 2010-03-03
US20100187316A1 (en) 2010-07-29

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