KR20100051039A - Rfid 시스템용 칩 모듈 - Google Patents
Rfid 시스템용 칩 모듈 Download PDFInfo
- Publication number
- KR20100051039A KR20100051039A KR1020097019846A KR20097019846A KR20100051039A KR 20100051039 A KR20100051039 A KR 20100051039A KR 1020097019846 A KR1020097019846 A KR 1020097019846A KR 20097019846 A KR20097019846 A KR 20097019846A KR 20100051039 A KR20100051039 A KR 20100051039A
- Authority
- KR
- South Korea
- Prior art keywords
- rfid
- adhesive
- aluminum
- film
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007041752A DE102007041752A1 (de) | 2007-09-04 | 2007-09-04 | Chipmodul für ein RFID-System |
| DE102007041752.9 | 2007-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100051039A true KR20100051039A (ko) | 2010-05-14 |
Family
ID=40158664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097019846A Ceased KR20100051039A (ko) | 2007-09-04 | 2008-09-03 | Rfid 시스템용 칩 모듈 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8371509B2 (enExample) |
| EP (1) | EP2183705B1 (enExample) |
| JP (1) | JP5377493B2 (enExample) |
| KR (1) | KR20100051039A (enExample) |
| CN (1) | CN101663678B (enExample) |
| CA (1) | CA2696119A1 (enExample) |
| DE (1) | DE102007041752A1 (enExample) |
| WO (1) | WO2009030463A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101531383B1 (ko) * | 2014-07-07 | 2015-06-24 | 주식회사 에이티앤씨 | 스티커형 안테나 제조방법 |
| KR20160063214A (ko) * | 2014-11-26 | 2016-06-03 | 김우중 | 갈바닉 내부식특성을 향상시킨 이동통신 단말기용 안테나의 제작방법, 이에 의해 제조된 이동통신 단말기용 케이스 및 이를 갖는 이동통신 단말기 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006052517A1 (de) * | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
| DE102007026720A1 (de) * | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
| EP2432074A1 (de) * | 2010-09-21 | 2012-03-21 | Printechnologics GmbH | Baugruppe mit wenigstens einer UHF-Dipol-Antenne |
| DE102010056055A1 (de) * | 2010-12-23 | 2012-06-28 | Schreiner Group Gmbh & Co. Kg | Etikett mit einem elektronischen Funktionselement |
| BR112013024446A2 (pt) * | 2011-03-24 | 2019-09-24 | Tagsys Sas | conjunto de etiqueta para fixar uma etiqueta rfid, método de fixação de uma etiqueta rfid, processo para produzir um rótulo rfid, processo para fixar uma etiqueta rfid, conjunto de rótulo rfid fundível por calor, conjunto de etiqueta ou rótulo, e, método de froduzir o mesmo |
| WO2013128299A1 (en) * | 2012-03-02 | 2013-09-06 | Usta Kutluhan | Enhanced antenna structure for rfid tags |
| DE102013215706A1 (de) * | 2013-08-08 | 2015-02-12 | Bielomatik Leuze Gmbh + Co. Kg | Transfer-Stanzen |
| DE102014102519A1 (de) | 2014-02-26 | 2015-08-27 | Schreiner Group Gmbh & Co. Kg | Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat |
| WO2016072301A1 (ja) * | 2014-11-07 | 2016-05-12 | 株式会社村田製作所 | キャリアテープ及びその製造方法、並びにrfidタグの製造方法 |
| JP7377490B2 (ja) * | 2019-11-19 | 2023-11-10 | 大王製紙株式会社 | Rfidタグ |
| JP7457519B2 (ja) * | 2020-02-18 | 2024-03-28 | 株式会社ブリヂストン | 航空機用タイヤ |
| WO2022224002A1 (en) * | 2021-04-22 | 2022-10-27 | Sml Brand Identification Solutionslimited | Extensible and modular rfid device |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10293828A (ja) * | 1997-04-18 | 1998-11-04 | Omron Corp | データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法 |
| US6297727B1 (en) * | 1997-05-05 | 2001-10-02 | George N. Nelson, Jr. | Transponder identification and record assembly |
| DE19837689A1 (de) * | 1998-08-19 | 2000-02-24 | Baumer Ident Gmbh | Anordnung zur Kennzeichnung von Objekten |
| DE10016037B4 (de) * | 2000-03-31 | 2005-01-05 | Interlock Ag | Verfahren zur Herstellung eines Etiketts oder einer Chipkarte |
| US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
| WO2002089338A2 (en) * | 2001-04-30 | 2002-11-07 | Bnc Ip Switzerland Gmbh | Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| JP2002352206A (ja) * | 2001-05-30 | 2002-12-06 | Toppan Forms Co Ltd | データ送受信体の製造方法 |
| JP2003030612A (ja) * | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Icチップ実装体 |
| JP2003037427A (ja) * | 2001-07-24 | 2003-02-07 | Dainippon Printing Co Ltd | アンテナパターンの製造方法 |
| HUP0402519A2 (hu) * | 2001-12-21 | 2005-05-30 | Giesecke & Devrient Gmbh | Lapanyag, berendezés, valamint eljárás a lapanyag előállítására és feldolgozására |
| DE10229168A1 (de) * | 2002-06-28 | 2004-01-29 | Infineon Technologies Ag | Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht |
| JP4236974B2 (ja) * | 2003-03-28 | 2009-03-11 | トッパン・フォームズ株式会社 | 非接触型情報記録媒体 |
| NL1025869C2 (nl) * | 2004-04-02 | 2005-10-05 | Capturetech Benelux B V | Samenstel van kluis en daarbij te gebruiken verzegelbare flexibele waardehouders. |
| JP2005311179A (ja) * | 2004-04-23 | 2005-11-04 | Dainippon Printing Co Ltd | 非接触データキャリア用導電部材製造方法および非接触データキャリア用導電部材製造装置 |
| US20060044769A1 (en) * | 2004-09-01 | 2006-03-02 | Forster Ian J | RFID device with magnetic coupling |
| JP2006157705A (ja) * | 2004-11-30 | 2006-06-15 | Oubiken:Kk | 電磁波吸収部材および携帯電話機用アンテナ |
| JP4541246B2 (ja) * | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | 非接触icモジュール |
| CN101262957B (zh) * | 2005-08-24 | 2011-06-29 | A.M.兰普股份有限公司 | 生产具有导电涂层的制品的方法 |
| DE202005021190U1 (de) * | 2005-08-31 | 2007-04-26 | Krones Ag | Herstellung von Etiketten und Etikettierung |
| DE102005042444B4 (de) * | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Anordnung für eine RFID - Transponder - Antenne |
| JP2007080766A (ja) * | 2005-09-16 | 2007-03-29 | Dainippon Printing Co Ltd | 導電性パターン形成用金属箔シート |
| US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
| DE102006052517A1 (de) | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
| DE102007026720A1 (de) | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
| JP2009075687A (ja) * | 2007-09-19 | 2009-04-09 | Hitachi Ltd | Rfidタグ |
| US20100001862A1 (en) * | 2008-07-03 | 2010-01-07 | James Charles Wilson | Method for authenticating radio frequency identification |
-
2007
- 2007-09-04 DE DE102007041752A patent/DE102007041752A1/de not_active Withdrawn
-
2008
- 2008-09-03 JP JP2010523318A patent/JP5377493B2/ja not_active Expired - Fee Related
- 2008-09-03 WO PCT/EP2008/007171 patent/WO2009030463A1/de not_active Ceased
- 2008-09-03 KR KR1020097019846A patent/KR20100051039A/ko not_active Ceased
- 2008-09-03 US US12/602,415 patent/US8371509B2/en not_active Expired - Fee Related
- 2008-09-03 CN CN2008800124990A patent/CN101663678B/zh not_active Expired - Fee Related
- 2008-09-03 EP EP08801804.9A patent/EP2183705B1/de not_active Not-in-force
- 2008-09-03 CA CA2696119A patent/CA2696119A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101531383B1 (ko) * | 2014-07-07 | 2015-06-24 | 주식회사 에이티앤씨 | 스티커형 안테나 제조방법 |
| KR20160063214A (ko) * | 2014-11-26 | 2016-06-03 | 김우중 | 갈바닉 내부식특성을 향상시킨 이동통신 단말기용 안테나의 제작방법, 이에 의해 제조된 이동통신 단말기용 케이스 및 이를 갖는 이동통신 단말기 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101663678B (zh) | 2013-05-22 |
| EP2183705B1 (de) | 2016-11-23 |
| DE102007041752A1 (de) | 2009-03-05 |
| US8371509B2 (en) | 2013-02-12 |
| WO2009030463A1 (de) | 2009-03-12 |
| CA2696119A1 (en) | 2009-03-12 |
| JP2010538556A (ja) | 2010-12-09 |
| EP2183705A1 (de) | 2010-05-12 |
| JP5377493B2 (ja) | 2013-12-25 |
| CN101663678A (zh) | 2010-03-03 |
| US20100187316A1 (en) | 2010-07-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20100051039A (ko) | Rfid 시스템용 칩 모듈 | |
| CA2563936C (en) | Method and device for continuously producing electronic film components, and an electronic film component | |
| JP2010538556A5 (enExample) | ||
| JP4659904B2 (ja) | 転写テープ取付方法 | |
| US8745852B2 (en) | Method of making a self-adhering RFID antenna | |
| US9324017B2 (en) | Chip module for an RFID system | |
| CN101375463A (zh) | 含有射频(rf)天线的元件及其制造方法 | |
| CN113077034B (zh) | 一种rfid电子标签的生产工艺 | |
| KR20100051040A (ko) | Rfid 라벨의 제조 방법 및 장치 | |
| US20080047130A1 (en) | Method for fabricating antenna units | |
| JP2012533901A (ja) | 部品のパッケージ化又は実装方法 | |
| JP2005223470A (ja) | 転写式銅箔アンテナ | |
| US20060290498A1 (en) | Incorporation of RFID devices into labels | |
| EP2850633B1 (en) | Low-current fuse stamping method | |
| JP4637499B2 (ja) | インターポーザ付シートの巻体およびicタグ | |
| US10238018B1 (en) | Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same | |
| JP4101013B2 (ja) | フレキブルフラット配線体の製造方法 | |
| JP5040551B2 (ja) | 非接触型データキャリア用導電部材とその製造方法及び装置 | |
| JP2009031958A (ja) | 非接触型データキャリア用導電部材の製造方法および装置 | |
| JP2009075863A (ja) | 非接触型データキャリア用導電部材の製造方法および装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20090923 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20130829 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140531 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20141126 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20151005 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20160201 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20151005 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20141126 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20140531 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |