Classifications

• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
  • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
  • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]

Definitions

• the invention relates to a chip module for an RFID system, an RFID system with the chip module and a self-adhesive RFID tag and a method for its production.
• chip modules which have an RFID microchip and electrical connection contacts, with which they are connected to an antenna.
• German patent application 10 2006 052 517 describes a generic chip module in which a RFID chip and a coupling antenna which is electrically, in particular galvanically connected, to the RFID-chip are arranged on a web-shaped carrier material.
• RFID tags are produced in which a chip module arranged on a carrier film is adhesively bonded to a flat secondary antenna such that the coupling antenna and the RFID antenna are inductively coupled.
• the invention has for its object to provide a generic chip module that allows the production of an environmentally friendly RFID system with predominantly recyclable materials such as aluminum and paper.
• the web or sheet-shaped carrier material an adhesive material with a support layer of paper.
• the coupling antenna can be cut from an aluminum foil, in particular punching, as claimed in claim 3.
• the printing of the coupling antenna with an aluminum-containing ink is possible.
• the claims 5 to 9 contain preferred, as particularly advantageous embodiments of an RFID system, in which the coupling antenna and a secondary antenna of the system are inductively coupled.
• the secondary antenna is made of recyclable aluminum, and the antenna film for the secondary antenna is an adhesive material with a base layer of recyclable paper. This also simplifies the production of the system as the number of materials used is limited.
• the self-adhesive RFID tag according to claim 10 can advantageously be produced in a simplified manner, since the same material is used for the inlay material, including its pressure-sensitive adhesive layer, as for the cover material with the associated pressure-sensitive adhesive layer of the label.
• an RFID label according to claim 11 produce in which for all substrates an adhesive material with a support layer of paper is used, the paper can be recycled environmentally friendly.
• the claims 12 and 13 contain particularly advantageous method for producing a chip module according to the invention.
• FIG. 1 shows a chip module which is fastened on a carrier foil and whose
• FIG. 2 a schematically shows a method for producing the coupling antennas for the chip module.
• Figure 2b shows schematically an alternative method.
• FIG. 3 a shows a top view of the individual stages of production of the
• FIG. 3b shows the production steps in the alternative methods according to FIG.
• Figure 4 shows the structure of the aluminum adhesive composite material from which the
• Coupling antennas are manufactured.
• FIG. 5 shows the punching out of the coupling antennas.
• FIG. 6 shows a section through a chip module.
• Figure 7a shows the section C-C of Figure 6 in a first embodiment.
• FIG. 7b shows the section C-C of FIG. 6 in a second embodiment.
• FIG. 8 shows the strip-shaped arrangement of the coupling antennas before the
• Chip is attached to them.
• FIG. 1 shows two chip modules 1, each of which contains a coupling antenna 2 and an RFID chip 3 arranged on the coupling antenna 2.
• the RFID chip 3 is connected electrically, in particular galvanically, to the coupling antenna.
• the coupling antenna 2 with the RFID chip 3 is on the top of a web or arcuate carrier material 4 is arranged.
• the support material 4 has on its underside a pressure-sensitive adhesive layer 10, which is covered by a peelable, web or sheet-shaped release material 6, preferably a silicone paper.
• the coupling antenna 2 consists of an aluminum layer with a thickness of 1 .mu.m-20 .mu.m, in particular of 3 .mu.m-12 .mu.m. In the exemplary embodiment, the thickness of the aluminum layer is about 10 microns.
• the coupling antenna 2 is cut out of an aluminum foil 7 of corresponding thickness. This can be done by punching, as shown in the example, or by cutting with a laser beam. Alternatively, it is also possible to print the coupling antenna 2 on the substrate 4 with an aluminum-containing color.
• the carrier material 4 contains a carrier layer, which is preferably made of paper. Likewise, the carrier material 4 can be made of a plastic such as PP or PE.
• the preferred starting material for the production of the chip module is a sheet-like or arcuate aluminum adhesive composite whose structure is shown in FIG. 4:
• an aluminum foil 7 is glued by means of an adhesive layer 9.
• a release film made of silicone paper 6 is peelable by means of an adhesive layer 10.
• the aluminum adhesive composite material consists of an aluminum foil 7 with a thickness of 1 .mu.m-20 .mu.m, in particular 3 .mu.m-12 .mu.m, in the example about 10 .mu.m, a support material made of paper having a thickness between 50 g / m 2 -90 g / m 2 , in the example 70 microns, and a release film of silicone paper with a thickness of 50 microns - 60 microns.
• the adhesive layer 9 below the aluminum foil 7 has a thickness of 3 ⁇ m-7 ⁇ m, in the example about 5 ⁇ m, and the adhesive layer 10 on the underside of the carrier foil 4 made of paper has a thickness between 15 ⁇ m and 25 ⁇ m, in the example of FIG microns.
• the aluminum adhesive composite material is withdrawn from a roll 11 by means of preferred rollers 12 and fed to a subsequent punch hole 13.
• the inner contour 14 of the coupling antenna 2 is punched out with a passing through all layers of the aluminum adhesive composite material section.
• the inner contour 14 of the coupling antenna 2 is punched out with a passing through all layers of the aluminum adhesive composite material section.
• the cutting waste produced during punching is removed, in the example sucked off.
• the contact point 16a for the RFI D chip is subsequently punched out.
• the cut extends at least through the aluminum foil 7 and the adhesive layer 9 underneath, wherein the carrier material 4 is not completely severed.
• This punching step has the task to separate the previously self-contained coupling antenna 2 by means of a separating cut, so that no electrical short circuit occurs.
• a non-conductive zone is cut out of the aluminum foil 7, in which so-called supporting bumps of the chip 3 can be arranged. The uncovered in this punching process in the aluminum foil 7 areas are shown in Figure 7a.
• a further punching device 18a is arranged, by means of which the outer contour 19 of the coupling antenna 2 is cut out.
• the cut extends as far as the release film 6.
• FIG. 2a the punching operations for the contact point and for the outer contour are shown in two steps. However, the two punching operations can also be performed with a single rotating tool, as shown in Figure 5.
• the punching tool 20 then contains two punching blades 21, 22 of different depths, the punching blade 21 cutting the contact point 16 with a cut reaching the paper 4 used as the carrier material, and the punching blade 22 cutting the outer contour with a cut that extends as far as the Release film 6 is enough.
• the stamped grid is removed and wound onto a roll 23.
• the release film 6 with the coupling antennas 2 located thereon is wound into a roll 24.
• the coupling antennas 2 are arranged at a distance one behind the other on the separating film 6. This is in turn constructed in strip form, so that the coupling antennas 2 can be supplied in a plurality of tracks and each successive subsequent processing.
• an RFID chip 3 is attached to each coupling antenna 2, as shown in FIG.
• FIG. 2 b shows an alternative method in which the inner contour 14 and the outer contour 19 of the coupling antenna 2 are punched out in a section that extends as far as the separating film 6.
• the inner contour 14 is taken along by the punching cylinder 18b and sucked off and can then be disposed of.
• the punching device 15 the contact point 16 for the RFID chip 3 is punched out, which according to this exemplary embodiment-as shown in FIGS. 3 b and 7 b-forms a straight parting line 16 b as a straight cut.
• the aluminum foil 7 in the uppermost layer represents the conductor track of the coupling antenna 2.
• the chip feet designated as “bumps” 17 are inserted into the aluminum foil 7 and optionally into the latter This results in a certain form fit for the galvanic contacting of the bumps 17.
• an adhesive 25 is applied prior to assembly, which holds the chip 3.
• the adhesive 25 is usually more expensive conductive Adhesive with silver particles as a conductive substance.
• FIG. 7 a shows an embodiment in which the contact point 16 a contains an approximately semicircular recess punched out of the aluminum foil 7.
• the contact of the aluminum foil 7 with the RFID chip via the lower bumps 17 a, to avoid an electrical short circuit through a further separating section 16a in the aluminum foil 7 are electrically separated from each other.
• FIG. 7b shows an advantageous alternative possibility of designing the contact point 16 between the coupling antenna 2 punched out of the aluminum foil 7 and the RFID chip 3.
• the two upper bumps 17 have only a function supporting the chip 3, they are not electrically connected to the chip 3.
• the electrical contact is made via the two lower bumps 17a.
• the two contact bumps 17a are electrically separated from one another by a rectilinear section 16b.
• punching the straight section 16b the two edges of the film 7 are crimped apart, so that forms a parting line that avoids contact safely.
• an insulating adhesive can be additionally pressed into the parting line 16b, which keeps the two edges of the film 7 after curing safe distance.
• This plastic can advantageously be used simultaneously to secure the bumps 17 and thus the RFID chip 3 securely on the film 7.
• the invention makes it possible to replace the adhesive 25 by a non-conductive, inexpensive adhesive. It should be noted that a possibly occurring oxide layer of aluminum at the contact points of the coupling antenna 2 does not interfere with the electrical contact. In order to prevent the occurrence of a disturbing oxide layer from the outset, a wafer-thin layer of protective lacquer can be applied over the aluminum foil 7 as an oxidation protection.
• the protective lacquer is selected by its consistency and its adhesion to the aluminum so that it breaks during contact, so when placing the chip 3 on the contact points of the coupling antenna 2, and releases an unoxidized contact surface for a galvanic connection.
• the chip module 1 with the chip 3 can already be used in a very close proximity as an RFID system, since the coupling antenna 2 acts as a UHF antenna.
• the chip module 1 with its carrier material 4 on a flat secondary antenna 26 is adhesively positioned so that the coupling antenna 2 and the secondary antenna 26 are inductively coupled.
• the secondary antennas 26 are arranged on the upper side of a carrier material, wherein as carrier material preferably an adhesive material with a support layer made of paper is used. Alternatively, a plastic such as PE or PP can be used for the base layer.
• the pressure-sensitive adhesive layer of the carrier material is covered by a sheet-like or sheet-like separating material 27.
• the secondary antennas 26 are thus arranged on the upper side of the separating material 27.
• the secondary antenna 26 is made of an aluminum layer with a thickness of 1 .mu.m-20 .mu.m, in particular of 3 .mu.m-12 .mu.m, in the example about 10 microns.
• the secondary antenna 26 is preferably cut from a correspondingly thick aluminum foil, in particular punched out.
• an adhesive material having a base layer of paper is used to keep the number of materials used small and to use the same materials as needed.
• an RFID system is arranged as an RFID inlay between a web-shaped or arcuate cover material provided on the underside with a pressure-sensitive adhesive layer and a web-shaped or sheet-shaped carrier material which can be removed from the pressure-sensitive adhesive layer.
• the same material is used as the carrier material for the RFID inlay, including its pressure-sensitive adhesive layer, as for the cover material with the pressure-sensitive adhesive layer of the label.
• an adhesive material with a carrier layer made of paper is used for all carrier materials. Thus, only paper and aluminum are used to make the RFI D label, the latter for the antennas.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Details Of Aerials (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=40158664

Family Applications (1)

Country Status (8)

Families Citing this family (14)

Citations (1)

Family Cites Families (25)

• 2007
  • 2007-09-04 DE DE102007041752A patent/DE102007041752A1/de not_active Withdrawn
• 2008
  • 2008-09-03 EP EP08801804.9A patent/EP2183705B1/de not_active Not-in-force
  • 2008-09-03 CA CA2696119A patent/CA2696119A1/en not_active Abandoned
  • 2008-09-03 CN CN2008800124990A patent/CN101663678B/zh not_active Expired - Fee Related
  • 2008-09-03 US US12/602,415 patent/US8371509B2/en not_active Expired - Fee Related
  • 2008-09-03 JP JP2010523318A patent/JP5377493B2/ja not_active Expired - Fee Related
  • 2008-09-03 WO PCT/EP2008/007171 patent/WO2009030463A1/de not_active Ceased
  • 2008-09-03 KR KR1020097019846A patent/KR20100051039A/ko not_active Ceased

Patent Citations (1)

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