KR20090117978A - 절삭 블레이드 - Google Patents

절삭 블레이드 Download PDF

Info

Publication number
KR20090117978A
KR20090117978A KR1020090030796A KR20090030796A KR20090117978A KR 20090117978 A KR20090117978 A KR 20090117978A KR 1020090030796 A KR1020090030796 A KR 1020090030796A KR 20090030796 A KR20090030796 A KR 20090030796A KR 20090117978 A KR20090117978 A KR 20090117978A
Authority
KR
South Korea
Prior art keywords
circular
cutting
cutting blade
base
hub
Prior art date
Application number
KR1020090030796A
Other languages
English (en)
Korean (ko)
Inventor
유지 나카니시
히로아키 야마다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20090117978A publication Critical patent/KR20090117978A/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/003Sawing machines or sawing devices with circular saw blades or with friction saw discs for particular purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/26Sawing machines or sawing devices with circular saw blades or with friction saw discs with high-speed cutting discs, performing the cut by frictional heat melting the material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02Circular saw blades
    • B23D61/025Details of saw blade body

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020090030796A 2008-05-12 2009-04-09 절삭 블레이드 KR20090117978A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008124396A JP2009269158A (ja) 2008-05-12 2008-05-12 切削ブレード
JPJP-P-2008-124396 2008-05-12

Publications (1)

Publication Number Publication Date
KR20090117978A true KR20090117978A (ko) 2009-11-17

Family

ID=41362137

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090030796A KR20090117978A (ko) 2008-05-12 2009-04-09 절삭 블레이드

Country Status (4)

Country Link
JP (1) JP2009269158A (zh)
KR (1) KR20090117978A (zh)
CN (1) CN101579750B (zh)
TW (1) TW200946307A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010017820A (ja) * 2008-07-11 2010-01-28 Asahi Diamond Industrial Co Ltd ハブ付きブレード
JP2011173221A (ja) * 2010-02-25 2011-09-08 Disco Corp 切削ブレード
TWI508803B (zh) * 2013-01-30 2015-11-21 Mgi Zhou Co Ltd 切削刀具的製造方法
JP6069122B2 (ja) * 2013-07-22 2017-02-01 株式会社ディスコ 切削装置
JP2017087353A (ja) * 2015-11-10 2017-05-25 株式会社ディスコ 電着砥石の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3270879B2 (ja) * 1994-06-13 2002-04-02 ソニー株式会社 高誘電体薄膜の形成方法
JP2001044145A (ja) * 1999-08-03 2001-02-16 Mitsubishi Materials Corp ダイシングブレード及びブレード保持装置
JP4559094B2 (ja) * 2004-02-16 2010-10-06 株式会社ディスコ 切削ブレード装着装置,切削装置
JP4408399B2 (ja) * 2004-07-08 2010-02-03 株式会社ディスコ 切削ブレードの製造方法
JP4682592B2 (ja) * 2004-11-12 2011-05-11 株式会社ジェイテクト 砥石車

Also Published As

Publication number Publication date
JP2009269158A (ja) 2009-11-19
CN101579750B (zh) 2012-11-28
CN101579750A (zh) 2009-11-18
TW200946307A (en) 2009-11-16

Similar Documents

Publication Publication Date Title
US7384859B2 (en) Cutting method for substrate and cutting apparatus therefor
US20040124413A1 (en) Wafer support plate
KR20150007944A (ko) 웨이퍼의 가공 방법
KR20090117978A (ko) 절삭 블레이드
JP5068705B2 (ja) 加工装置のチャックテーブル
JP2013022713A (ja) 切削装置
JP2007103582A (ja) ウエーハの加工方法および研削装置
JP5340832B2 (ja) マウントフランジの端面修正方法
KR20050031927A (ko) 반도체 웨이퍼의 가공 방법
JP5384193B2 (ja) 被加工物の保持ユニット
JP2012064617A (ja) 切削方法
JP2010021330A (ja) ウエーハの加工方法
JP2004349275A (ja) チップ製造方法
KR20190007390A (ko) 드레서 보드, 드레싱 방법
KR20190001912A (ko) 환상의 지석
JP2019136845A (ja) 切削ブレードの整形方法
JP2011173221A (ja) 切削ブレード
JP2009126006A (ja) ワークの切削加工方法
CN110707017A (zh) 被加工物的干燥方法和切削装置
JP5809047B2 (ja) ドレッシングボード、ドレッシングボードの製造方法及びドレッシング方法
JP5635807B2 (ja) 切削加工装置
KR20180104566A (ko) 피가공물의 가공 방법
KR102631705B1 (ko) 블레이드 커버
JP2009124036A (ja) ダイシング方法
JP5518587B2 (ja) 切削工具の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application