KR20080098455A - 전기적 접속장치 - Google Patents
전기적 접속장치 Download PDFInfo
- Publication number
- KR20080098455A KR20080098455A KR1020087023513A KR20087023513A KR20080098455A KR 20080098455 A KR20080098455 A KR 20080098455A KR 1020087023513 A KR1020087023513 A KR 1020087023513A KR 20087023513 A KR20087023513 A KR 20087023513A KR 20080098455 A KR20080098455 A KR 20080098455A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- region
- reference mark
- block
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (9)
- 윗면 및 아래면을 갖는 지지기판과,아래쪽으로 향하는 설치면을 갖는 블록으로서 최소한 상기 설치면이 상기 지지기판보다 아래쪽에 위치하는 상태로 상기 지지기판에 설치된 블록과,복수의 접촉자가 배치된 접촉자 영역과 상기 접촉자 영역의 주위의 바깥쪽 영역을 갖는 가요성의 회로기판으로서 최소한 상기 접촉자 영역이 상기 블록의 상기 설치면에 대향된 상태로 상기 바깥쪽 영역의 일부에서 상기 지지기판의 아래면에 설치된 회로기판과,하단면 및 상기 하단면에 설치된 위치 결정을 위한 기준마크를 갖는 기준마크 부재로서 상기 하단면이 상기 회로기판의 아래쪽으로 노출된 상태로 상기 블록에 설치된 기준마크 부재를 포함하는 전기적 접속장치.
- 제1항에 있어서, 상기 기준마크 부재의 최소한 하단부는 상기 회로기판을 관통하고 있는 전기적 접속장치.
- 제2항에 있어서, 상기 회로기판은 상기 접촉자 영역으로부터 반경방향 바깥쪽으로 연장하는 복수의 배선을 갖춘 전기적 접속장치.
- 제1항에 있어서, 상기 하단면이 상기 회로기판의 상기 접촉자 영역을 사이로 하여 이간한 최소한 한 쌍의 상기 기준마크 부재를 포함하는 전기적 접속장치.
- 제1항에 있어서, 상기 기준마크 부재는 핀 부재를 포함하는 전기적 접속장치.
- 제4항에 있어서, 상기 핀 부재는 상부에서 상기 블록에 설치되어 있고, 또 하단부를 상기 회로기판의 아래쪽으로 돌출시키고 있는 전기적 접속장치.
- 제1항에 있어서, 상기 회로기판의 상기 외주영역은, 상기 접촉자 영역의 주위의 중간영역과, 상기 중간영역의 주위에 간격을 두고 상기 중간영역으로부터 반경방향으로 연장하는 복수의 연재부를 갖추고,상기 블록은, 상기 설치면과, 상기 설치면의 주위에 이어지는 중간면과, 상기 중간면의 주위에 이어지는 경사면에 의해 형성된 절두 다각추 형상의 하향면을 갖고,상기 접촉자 영역은 상기 설치면에 대향되고, 상기 중간영역은 상기 설치면의 주위의 면영역에 대향되어 있고, 상기 연재부의 최소한 일부는 상기 경사면에 대향되어 있고,각 기준마크 부재는, 상기 블록의 경사면으로부터 아래쪽으로 돌출하여 상기 회로기판의 상기 연재부를 관통하고 있는 전기적 접속장치.
- 제1항에 있어서, 상기 접촉자 영역은 상기 설치면에 접착되어 있는 전기적 접속장치.
- 제1항에 있어서, 상기 기준마크 부재의 하단면은 상기 접촉자 영역보다도 위쪽으로 후퇴되어 있는 전기적 접속장치.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2006-00105924 | 2006-04-07 | ||
| JP2006105924A JP4902248B2 (ja) | 2006-04-07 | 2006-04-07 | 電気的接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080098455A true KR20080098455A (ko) | 2008-11-07 |
| KR101004254B1 KR101004254B1 (ko) | 2011-01-03 |
Family
ID=38581090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087023513A Expired - Fee Related KR101004254B1 (ko) | 2006-04-07 | 2007-03-22 | 전기적 접속장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7934944B2 (ko) |
| JP (1) | JP4902248B2 (ko) |
| KR (1) | KR101004254B1 (ko) |
| TW (1) | TW200804825A (ko) |
| WO (1) | WO2007116795A1 (ko) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4884821B2 (ja) | 2006-04-14 | 2012-02-29 | 株式会社日本マイクロニクス | プローブシートおよび電気的接続装置 |
| JP4841298B2 (ja) * | 2006-04-14 | 2011-12-21 | 株式会社日本マイクロニクス | プローブシートの製造方法 |
| JP2008082912A (ja) * | 2006-09-28 | 2008-04-10 | Micronics Japan Co Ltd | 電気的接続装置 |
| JP5124877B2 (ja) * | 2008-04-04 | 2013-01-23 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP5416986B2 (ja) | 2009-02-19 | 2014-02-12 | 株式会社日本マイクロニクス | 電気的接続装置 |
| TWI414793B (zh) * | 2009-09-15 | 2013-11-11 | Mpi Corp | High frequency probe card |
| JP2013130400A (ja) * | 2011-12-20 | 2013-07-04 | Micronics Japan Co Ltd | プローブ組立体及びこれを含むプローブカード並びにこれらの製造方法 |
| JP5847663B2 (ja) * | 2012-08-01 | 2016-01-27 | 日本電子材料株式会社 | プローブカード用ガイド板の製造方法 |
| US9435855B2 (en) | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
| US9594114B2 (en) | 2014-06-26 | 2017-03-14 | Teradyne, Inc. | Structure for transmitting signals in an application space between a device under test and test electronics |
| JP6653996B2 (ja) * | 2015-04-27 | 2020-02-26 | 日本電子材料株式会社 | プローブカード |
| CN206096201U (zh) * | 2016-07-21 | 2017-04-12 | 梁永焯 | 用于半导体晶圆测试的系统、切线探针卡及其探头组件 |
| US9977052B2 (en) | 2016-10-04 | 2018-05-22 | Teradyne, Inc. | Test fixture |
| JP2019109101A (ja) * | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | 検査治具 |
| JP2019149420A (ja) * | 2018-02-26 | 2019-09-05 | 富士通株式会社 | 基板 |
| US10677815B2 (en) | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
| US11363746B2 (en) | 2019-09-06 | 2022-06-14 | Teradyne, Inc. | EMI shielding for a signal trace |
| JP7590820B2 (ja) * | 2020-06-17 | 2024-11-27 | 株式会社ヨコオ | プローブカード |
| US11862901B2 (en) | 2020-12-15 | 2024-01-02 | Teradyne, Inc. | Interposer |
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| US5136470A (en) * | 1990-06-29 | 1992-08-04 | Loral/Rolm Mil-Spec Computers | Printed circuit board vibration stiffener |
| US5264787A (en) * | 1991-08-30 | 1993-11-23 | Hughes Aircraft Company | Rigid-flex circuits with raised features as IC test probes |
| US5461326A (en) * | 1993-02-25 | 1995-10-24 | Hughes Aircraft Company | Self leveling and self tensioning membrane test probe |
| US5468917A (en) * | 1994-03-23 | 1995-11-21 | International Business Machines Corporation | Circuitized structure including flexible circuit with elastomeric member bonded thereto |
| EP0779989A4 (en) | 1994-09-09 | 1998-01-07 | Micromodule Systems Inc | CONTROL OF MEMBRANE INTEGRATED CIRCUITS |
| JPH08327658A (ja) * | 1995-03-31 | 1996-12-13 | Tokyo Electron Ltd | 基板検査装置 |
| EP0839321B1 (en) | 1996-05-17 | 2006-01-11 | FormFactor, Inc. | Contact tip structures for microelectronic interconnection elements and methods of making same |
| US5729896A (en) * | 1996-10-31 | 1998-03-24 | International Business Machines Corporation | Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder |
| KR100244580B1 (ko) * | 1997-06-24 | 2000-02-15 | 윤종용 | 금속 범프를 갖는 회로 기판의 제조 방법 및 그를 이용한 반도체 칩 패키지의 제조 방법 |
| JPH1144708A (ja) | 1997-07-24 | 1999-02-16 | Mitsubishi Materials Corp | コンタクトプローブおよびその製造方法 |
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| JP4004241B2 (ja) * | 2001-04-16 | 2007-11-07 | 株式会社日本マイクロニクス | 電気的接続装置 |
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| JP4841298B2 (ja) | 2006-04-14 | 2011-12-21 | 株式会社日本マイクロニクス | プローブシートの製造方法 |
| JP2007285800A (ja) | 2006-04-14 | 2007-11-01 | Micronics Japan Co Ltd | フレキシブル配線基板および電気的接続装置 |
| JP4884821B2 (ja) | 2006-04-14 | 2012-02-29 | 株式会社日本マイクロニクス | プローブシートおよび電気的接続装置 |
| JP2008082912A (ja) | 2006-09-28 | 2008-04-10 | Micronics Japan Co Ltd | 電気的接続装置 |
| JP5147227B2 (ja) * | 2006-12-19 | 2013-02-20 | 株式会社日本マイクロニクス | 電気的接続装置の使用方法 |
-
2006
- 2006-04-07 JP JP2006105924A patent/JP4902248B2/ja active Active
-
2007
- 2007-03-22 KR KR1020087023513A patent/KR101004254B1/ko not_active Expired - Fee Related
- 2007-03-22 WO PCT/JP2007/056751 patent/WO2007116795A1/ja not_active Ceased
- 2007-03-22 US US12/296,430 patent/US7934944B2/en not_active Expired - Fee Related
- 2007-03-26 TW TW096110316A patent/TW200804825A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US7934944B2 (en) | 2011-05-03 |
| TW200804825A (en) | 2008-01-16 |
| WO2007116795A1 (ja) | 2007-10-18 |
| TWI325961B (ko) | 2010-06-11 |
| JP4902248B2 (ja) | 2012-03-21 |
| JP2007278859A (ja) | 2007-10-25 |
| US20100029099A1 (en) | 2010-02-04 |
| KR101004254B1 (ko) | 2011-01-03 |
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