KR20080070675A - Ｃｍｐ를 위한 마찰 감소 보조재 - Google Patents

Ｃｍｐ를 위한 마찰 감소 보조재 Download PDF

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Publication number
KR20080070675A
KR20080070675A KR1020087012131A KR20087012131A KR20080070675A KR 20080070675 A KR20080070675 A KR 20080070675A KR 1020087012131 A KR1020087012131 A KR 1020087012131A KR 20087012131 A KR20087012131 A KR 20087012131A KR 20080070675 A KR20080070675 A KR 20080070675A
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KR
South Korea
Prior art keywords
polishing
substrate
abrasive
polishing system
water
Prior art date
Application number
KR1020087012131A
Other languages
English (en)
Korean (ko)
Inventor
케빈 제이. 뫼겐보르그
필립 더블유. 카터
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐보트 마이크로일렉트로닉스 코포레이션 filed Critical 캐보트 마이크로일렉트로닉스 코포레이션
Publication of KR20080070675A publication Critical patent/KR20080070675A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020087012131A 2005-11-22 2006-10-24 Ｃｍｐ를 위한 마찰 감소 보조재 KR20080070675A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/287,039 US20070117497A1 (en) 2005-11-22 2005-11-22 Friction reducing aid for CMP
US11/287,039 2005-11-22

Publications (1)

Publication Number Publication Date
KR20080070675A true KR20080070675A (ko) 2008-07-30

Family

ID=38054171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087012131A KR20080070675A (ko) 2005-11-22 2006-10-24 Ｃｍｐ를 위한 마찰 감소 보조재

Country Status (6)

Country Link
US (1) US20070117497A1 (ja)
JP (1) JP2009516928A (ja)
KR (1) KR20080070675A (ja)
CN (1) CN101313388A (ja)
TW (1) TWI311091B (ja)
WO (1) WO2007149113A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180004019A (ko) * 2016-07-01 2018-01-10 버슘머트리얼즈 유에스, 엘엘씨 배리어 화학적 기계적 평탄화용 첨가제
KR20210103587A (ko) * 2019-10-03 2021-08-23 닛산 가가쿠 가부시키가이샤 양이온을 포함하는 레이저마크 주변의 융기를 해소하기 위한 연마용 조성물

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US9228257B2 (en) * 2011-05-24 2016-01-05 Rohm And Haas Company Quality multi-spectral zinc sulfide
JP6329909B2 (ja) * 2011-12-28 2018-05-23 インテグリス・インコーポレーテッド 窒化チタンを選択的にエッチングするための組成物および方法
CN102775916B (zh) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 一种提高蓝宝石表面质量的抛光组合物
US9259818B2 (en) * 2012-11-06 2016-02-16 Sinmat, Inc. Smooth diamond surfaces and CMP method for forming
JP6007094B2 (ja) * 2012-12-18 2016-10-12 花王株式会社 サファイア板用研磨液組成物
JP6622963B2 (ja) * 2013-01-04 2019-12-18 株式会社フジミインコーポレーテッド 合金材料の研磨方法及び合金材料の製造方法
WO2014132641A1 (ja) * 2013-02-28 2014-09-04 株式会社フジミインコーポレーテッド コバルト除去のための研磨スラリー
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
CN103589344B (zh) * 2013-11-14 2015-06-10 上海新安纳电子科技有限公司 一种氧化铝抛光液的制备方法
JPWO2016043089A1 (ja) * 2014-09-16 2017-08-10 山口精研工業株式会社 サファイア基板用研磨剤組成物
KR102447178B1 (ko) 2015-09-01 2022-09-26 삼성전자주식회사 반도체 장치의 제조 방법
JP6974336B2 (ja) * 2016-02-16 2021-12-01 シーエムシー マテリアルズ，インコーポレイティド Ｉｉｉ−ｖ族材料の研磨方法
DE102017110198A1 (de) * 2017-05-11 2018-11-15 Walter Maschinenbau Gmbh Schleif- und/oder Erodiermaschine sowie Verfahren zur Vermessung und/oder Referenzierung der Maschine
US11161751B2 (en) 2017-11-15 2021-11-02 Saint-Gobain Ceramics & Plastics, Inc. Composition for conducting material removal operations and method for forming same
CN110358454A (zh) * 2019-07-20 2019-10-22 大连理工大学 一种通用化学机械抛光液
US11879094B2 (en) 2022-06-03 2024-01-23 Halliburton Energy Services, Inc. Enhancing friction reduction and protection of wellbore equipment during hydraulic fracturing

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DE3902753A1 (de) * 1989-01-31 1990-08-02 Henkel Kgaa Verfahren zur hydrothermalen herstellung von kaliumsilikatloesungen mit hohem si0(pfeil abwaerts)2(pfeil abwaerts):k(pfeil abwaerts)2(pfeil abwaerts)0-molverhaeltnis
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180004019A (ko) * 2016-07-01 2018-01-10 버슘머트리얼즈 유에스, 엘엘씨 배리어 화학적 기계적 평탄화용 첨가제
KR20210103587A (ko) * 2019-10-03 2021-08-23 닛산 가가쿠 가부시키가이샤 양이온을 포함하는 레이저마크 주변의 융기를 해소하기 위한 연마용 조성물

Also Published As

Publication number Publication date
TW200734117A (en) 2007-09-16
WO2007149113A3 (en) 2008-04-10
TWI311091B (en) 2009-06-21
WO2007149113A2 (en) 2007-12-27
CN101313388A (zh) 2008-11-26
JP2009516928A (ja) 2009-04-23
WO2007149113A9 (en) 2008-02-28
US20070117497A1 (en) 2007-05-24

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