KR20080070675A - Ｃｍｐ를 위한 마찰 감소 보조재 - Google Patents

Ｃｍｐ를 위한 마찰 감소 보조재 Download PDF

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Publication number
KR20080070675A
KR20080070675A KR1020087012131A KR20087012131A KR20080070675A KR 20080070675 A KR20080070675 A KR 20080070675A KR 1020087012131 A KR1020087012131 A KR 1020087012131A KR 20087012131 A KR20087012131 A KR 20087012131A KR 20080070675 A KR20080070675 A KR 20080070675A
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KR
South Korea
Prior art keywords
polishing
substrate
abrasive
polishing system
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087012131A
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English (en)
Korean (ko)
Inventor
케빈 제이. 뫼겐보르그
필립 더블유. 카터
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐보트 마이크로일렉트로닉스 코포레이션 filed Critical 캐보트 마이크로일렉트로닉스 코포레이션
Publication of KR20080070675A publication Critical patent/KR20080070675A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020087012131A 2005-11-22 2006-10-24 Ｃｍｐ를 위한 마찰 감소 보조재 Withdrawn KR20080070675A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/287,039 US20070117497A1 (en) 2005-11-22 2005-11-22 Friction reducing aid for CMP
US11/287,039 2005-11-22

Publications (1)

Publication Number Publication Date
KR20080070675A true KR20080070675A (ko) 2008-07-30

Family

ID=38054171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087012131A Withdrawn KR20080070675A (ko) 2005-11-22 2006-10-24 Ｃｍｐ를 위한 마찰 감소 보조재

Country Status (6)

Country Link
US (1) US20070117497A1 (enrdf_load_stackoverflow)
JP (1) JP2009516928A (enrdf_load_stackoverflow)
KR (1) KR20080070675A (enrdf_load_stackoverflow)
CN (1) CN101313388A (enrdf_load_stackoverflow)
TW (1) TWI311091B (enrdf_load_stackoverflow)
WO (1) WO2007149113A2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180004019A (ko) * 2016-07-01 2018-01-10 버슘머트리얼즈 유에스, 엘엘씨 배리어 화학적 기계적 평탄화용 첨가제
KR20210103587A (ko) * 2019-10-03 2021-08-23 닛산 가가쿠 가부시키가이샤 양이온을 포함하는 레이저마크 주변의 융기를 해소하기 위한 연마용 조성물

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8162723B2 (en) * 2006-03-09 2012-04-24 Cabot Microelectronics Corporation Method of polishing a tungsten carbide surface
JP2012240192A (ja) * 2011-05-24 2012-12-10 Rohm & Haas Co 向上した品質の多スペクトル硫化亜鉛
JP6329909B2 (ja) * 2011-12-28 2018-05-23 インテグリス・インコーポレーテッド 窒化チタンを選択的にエッチングするための組成物および方法
CN102775916B (zh) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 一种提高蓝宝石表面质量的抛光组合物
US9259818B2 (en) * 2012-11-06 2016-02-16 Sinmat, Inc. Smooth diamond surfaces and CMP method for forming
JP6007094B2 (ja) * 2012-12-18 2016-10-12 花王株式会社 サファイア板用研磨液組成物
WO2014106944A1 (ja) * 2013-01-04 2014-07-10 株式会社 フジミインコーポレーテッド 合金材料の研磨方法及び合金材料の製造方法
DE112014001038T5 (de) * 2013-02-28 2015-11-26 Fujimi Incorporated Polieraufschlämmung zur Kobaltentfernung
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
CN103589344B (zh) * 2013-11-14 2015-06-10 上海新安纳电子科技有限公司 一种氧化铝抛光液的制备方法
WO2016043089A1 (ja) * 2014-09-16 2016-03-24 山口精研工業株式会社 サファイア基板用研磨剤組成物
KR102447178B1 (ko) 2015-09-01 2022-09-26 삼성전자주식회사 반도체 장치의 제조 방법
WO2017142885A1 (en) * 2016-02-16 2017-08-24 Cabot Microelectronics Corporation Method of polishing group iii-v materials
DE102017110198A1 (de) * 2017-05-11 2018-11-15 Walter Maschinenbau Gmbh Schleif- und/oder Erodiermaschine sowie Verfahren zur Vermessung und/oder Referenzierung der Maschine
JP7071495B2 (ja) 2017-11-15 2022-05-19 サン－ゴバン セラミックス アンド プラスティクス，インコーポレイティド 材料除去操作を行うための組成物及びその形成方法
CN110358454A (zh) * 2019-07-20 2019-10-22 大连理工大学 一种通用化学机械抛光液
US11879094B2 (en) 2022-06-03 2024-01-23 Halliburton Energy Services, Inc. Enhancing friction reduction and protection of wellbore equipment during hydraulic fracturing

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2710997C3 (de) * 1977-03-14 1980-08-14 Dr. Karl Thomae Gmbh, 7950 Biberach 4-Alkoxy carbonylamino-phenyläthanolamine, deren Herstellung und deren Verwendung als Arzneimittel
JPH0228112A (ja) * 1988-04-21 1990-01-30 Kaken Pharmaceut Co Ltd 点眼用眼圧調整剤
US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
DE3902753A1 (de) * 1989-01-31 1990-08-02 Henkel Kgaa Verfahren zur hydrothermalen herstellung von kaliumsilikatloesungen mit hohem si0(pfeil abwaerts)2(pfeil abwaerts):k(pfeil abwaerts)2(pfeil abwaerts)0-molverhaeltnis
DE3938789A1 (de) * 1989-11-23 1991-05-29 Henkel Kgaa Verfahren zur hydrothermalen herstellung von kaliumsilikatloesungen
DE19643592A1 (de) * 1996-10-22 1998-04-23 Bayer Ag Verfahren zur Herstellung von alpha-Alkoxy-alpha-trifluormethyl-arylessigsäureestern und -arylessigsäuren
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
AU7147798A (en) * 1997-04-23 1998-11-13 Advanced Chemical Systems International, Inc. Planarization compositions for cmp of interlayer dielectrics
TW593331B (en) * 1997-07-25 2004-06-21 Inspire Pharmaceuticals Inc Method for large-scale production of di(uridine 5')-tetraphosphate and salts thereof
US6051605A (en) * 1997-08-08 2000-04-18 Warner-Lambert Company Method of treating psychosis and schizophrenia
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
CO5070714A1 (es) * 1998-03-06 2001-08-28 Nalco Chemical Co Proceso para la preparacion de silice coloidal estable
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
US6276996B1 (en) * 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
JP3941284B2 (ja) * 1999-04-13 2007-07-04 株式会社日立製作所 研磨方法
EP1244670B1 (en) * 1999-12-21 2006-03-08 MGI GP, Inc. Hydantoin derivative compounds, pharmaceutical compositions, and methods of using same
US6602117B1 (en) * 2000-08-30 2003-08-05 Micron Technology, Inc. Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
US6551935B1 (en) * 2000-08-31 2003-04-22 Micron Technology, Inc. Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
US6709316B1 (en) * 2000-10-27 2004-03-23 Applied Materials, Inc. Method and apparatus for two-step barrier layer polishing
US20030032078A1 (en) * 2001-01-23 2003-02-13 Board Of Regents, The University Of Texas System Methods and compositions for the treatment of macular and retinal degenerations
JP3945745B2 (ja) * 2001-03-09 2007-07-18 三井金属鉱業株式会社 セリウム系研摩材及び研摩材スラリー並びにセリウム系研摩材の製造方法
US6656241B1 (en) * 2001-06-14 2003-12-02 Ppg Industries Ohio, Inc. Silica-based slurry
US6800218B2 (en) * 2001-08-23 2004-10-05 Advanced Technology Materials, Inc. Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
JP4008219B2 (ja) * 2001-09-27 2007-11-14 触媒化成工業株式会社 研磨材
JP4278020B2 (ja) * 2001-10-30 2009-06-10 日揮触媒化成株式会社 研磨用粒子および研磨材の製造方法
PA8557501A1 (es) * 2001-11-12 2003-06-30 Pfizer Prod Inc Benzamida, heteroarilamida y amidas inversas
US6685755B2 (en) * 2001-11-21 2004-02-03 Saint-Gobain Abrasives Technology Company Porous abrasive tool and method for making the same
US6827639B2 (en) * 2002-03-27 2004-12-07 Catalysts & Chemicals Industries Co., Ltd. Polishing particles and a polishing agent
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP2004128112A (ja) * 2002-10-01 2004-04-22 Renesas Technology Corp 半導体装置の製造方法
US20040242704A1 (en) * 2003-03-14 2004-12-02 University Of Washington, Techtransfer - Invention Licensing Stabilized mutant opsin proteins
JP2005007520A (ja) * 2003-06-19 2005-01-13 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法並びに研磨方法
US7485241B2 (en) * 2003-09-11 2009-02-03 Cabot Microelectronics Corporation Chemical-mechanical polishing composition and method for using the same
US20050136670A1 (en) * 2003-12-19 2005-06-23 Ameen Joseph G. Compositions and methods for controlled polishing of copper
US7566808B2 (en) * 2004-02-17 2009-07-28 President And Fellows Of Harvard College Management of ophthalmologic disorders, including macular degeneration
US20060252107A1 (en) * 2005-02-22 2006-11-09 Acucela, Inc. Compositions and methods for diagnosing and treating retinal diseases
US20070039926A1 (en) * 2005-08-17 2007-02-22 Cabot Microelectronics Corporation Abrasive-free polishing system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180004019A (ko) * 2016-07-01 2018-01-10 버슘머트리얼즈 유에스, 엘엘씨 배리어 화학적 기계적 평탄화용 첨가제
KR20210103587A (ko) * 2019-10-03 2021-08-23 닛산 가가쿠 가부시키가이샤 양이온을 포함하는 레이저마크 주변의 융기를 해소하기 위한 연마용 조성물

Also Published As

Publication number Publication date
US20070117497A1 (en) 2007-05-24
WO2007149113A9 (en) 2008-02-28
JP2009516928A (ja) 2009-04-23
WO2007149113A2 (en) 2007-12-27
TW200734117A (en) 2007-09-16
CN101313388A (zh) 2008-11-26
WO2007149113A3 (en) 2008-04-10
TWI311091B (en) 2009-06-21

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20080521

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid