KR20080058147A - 본딩 장치 및 본딩 장치의 회로 기판 흡착 방법 - Google Patents

본딩 장치 및 본딩 장치의 회로 기판 흡착 방법 Download PDF

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Publication number
KR20080058147A
KR20080058147A KR20070074435A KR20070074435A KR20080058147A KR 20080058147 A KR20080058147 A KR 20080058147A KR 20070074435 A KR20070074435 A KR 20070074435A KR 20070074435 A KR20070074435 A KR 20070074435A KR 20080058147 A KR20080058147 A KR 20080058147A
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KR
South Korea
Prior art keywords
vacuum
circuit board
heat block
vacuum suction
suction
Prior art date
Application number
KR20070074435A
Other languages
English (en)
Korean (ko)
Inventor
노보루 후지노
야스시 사토
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20080058147A publication Critical patent/KR20080058147A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR20070074435A 2006-12-21 2007-07-25 본딩 장치 및 본딩 장치의 회로 기판 흡착 방법 KR20080058147A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006343696A JP2008159644A (ja) 2006-12-21 2006-12-21 ボンディング装置及びボンディング装置における回路基板の吸着方法
JPJP-P-2006-00343696 2006-12-21

Publications (1)

Publication Number Publication Date
KR20080058147A true KR20080058147A (ko) 2008-06-25

Family

ID=39660269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20070074435A KR20080058147A (ko) 2006-12-21 2007-07-25 본딩 장치 및 본딩 장치의 회로 기판 흡착 방법

Country Status (3)

Country Link
JP (1) JP2008159644A (ja)
KR (1) KR20080058147A (ja)
TW (1) TW200828456A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150116286A (ko) * 2014-04-07 2015-10-15 한화테크윈 주식회사 진공 블록 제어 방법
CN105093844A (zh) * 2014-05-08 2015-11-25 恩斯克科技有限公司 曝光方法和曝光装置
CN110087402A (zh) * 2018-01-26 2019-08-02 韩华精密机械株式会社 部件贴装装置
KR102298277B1 (ko) * 2021-04-21 2021-09-06 (주)에이티에스 캐리어 모듈 고정장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462215B (zh) * 2010-03-29 2014-11-21 Dainippon Screen Mfg 基板處理裝置、轉換方法、及轉移方法
TWI484879B (zh) * 2013-11-07 2015-05-11 Nan Ya Printed Circuit Board 調整基板曲度的方法與製具
JP6569091B2 (ja) * 2017-05-23 2019-09-04 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP6899314B2 (ja) * 2017-11-17 2021-07-07 浜松ホトニクス株式会社 吸着方法
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN113658910A (zh) * 2021-08-31 2021-11-16 中国电子科技集团公司第五十五研究所 一种微波功放载板的全自动球形键合装置及其工作方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150116286A (ko) * 2014-04-07 2015-10-15 한화테크윈 주식회사 진공 블록 제어 방법
CN105093844A (zh) * 2014-05-08 2015-11-25 恩斯克科技有限公司 曝光方法和曝光装置
CN105093844B (zh) * 2014-05-08 2017-09-22 株式会社V技术 曝光方法和曝光装置
CN110087402A (zh) * 2018-01-26 2019-08-02 韩华精密机械株式会社 部件贴装装置
KR102298277B1 (ko) * 2021-04-21 2021-09-06 (주)에이티에스 캐리어 모듈 고정장치

Also Published As

Publication number Publication date
TW200828456A (en) 2008-07-01
JP2008159644A (ja) 2008-07-10

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E601 Decision to refuse application