KR20080049626A - 배선 기판 및 그 제조 방법 - Google Patents

배선 기판 및 그 제조 방법 Download PDF

Info

Publication number
KR20080049626A
KR20080049626A KR1020070118269A KR20070118269A KR20080049626A KR 20080049626 A KR20080049626 A KR 20080049626A KR 1020070118269 A KR1020070118269 A KR 1020070118269A KR 20070118269 A KR20070118269 A KR 20070118269A KR 20080049626 A KR20080049626 A KR 20080049626A
Authority
KR
South Korea
Prior art keywords
layer
wiring layer
pad
wiring
uppermost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020070118269A
Other languages
English (en)
Korean (ko)
Inventor
시게츠구 무라마츠
야스히코 구사마
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20080049626A publication Critical patent/KR20080049626A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020070118269A 2006-11-30 2007-11-20 배선 기판 및 그 제조 방법 Withdrawn KR20080049626A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00324126 2006-11-30
JP2006324126A JP2008140886A (ja) 2006-11-30 2006-11-30 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
KR20080049626A true KR20080049626A (ko) 2008-06-04

Family

ID=39186976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070118269A Withdrawn KR20080049626A (ko) 2006-11-30 2007-11-20 배선 기판 및 그 제조 방법

Country Status (5)

Country Link
US (2) US8037596B2 (https=)
EP (1) EP1928220A3 (https=)
JP (1) JP2008140886A (https=)
KR (1) KR20080049626A (https=)
TW (1) TW200833200A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022086295A1 (ko) * 2020-10-22 2022-04-28 엘지이노텍 주식회사 회로 기판

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037738A1 (ja) * 2007-09-18 2009-03-26 Fujitsu Limited 引出し配線方法、引出し配線プログラムおよび引出し配線装置
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
JP5113114B2 (ja) * 2009-04-06 2013-01-09 新光電気工業株式会社 配線基板の製造方法及び配線基板
JP5248449B2 (ja) * 2009-05-14 2013-07-31 シャープ株式会社 発光装置
JP5479233B2 (ja) * 2010-06-04 2014-04-23 新光電気工業株式会社 配線基板及びその製造方法
JP5566200B2 (ja) * 2010-06-18 2014-08-06 新光電気工業株式会社 配線基板及びその製造方法
JP5547594B2 (ja) 2010-09-28 2014-07-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
TWI495051B (zh) * 2011-07-08 2015-08-01 欣興電子股份有限公司 無核心層之封裝基板及其製法
KR101296996B1 (ko) 2011-07-25 2013-08-14 니혼도꾸슈도교 가부시키가이샤 배선기판
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
JP5341227B1 (ja) * 2012-05-16 2013-11-13 日本特殊陶業株式会社 配線基板
CN103582304B (zh) * 2012-07-30 2016-08-03 富葵精密组件(深圳)有限公司 透明印刷电路板及其制作方法
JP2015090894A (ja) * 2013-11-05 2015-05-11 イビデン株式会社 プリント配線板

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2059020C (en) * 1991-01-09 1998-08-18 Kohji Kimbara Polyimide multilayer wiring board and method of producing same
JP2587548B2 (ja) * 1991-05-27 1997-03-05 富山日本電気株式会社 印刷配線板の製造方法
US5305519A (en) * 1991-10-24 1994-04-26 Kawasaki Steel Corporation Multilevel interconnect structure and method of manufacturing the same
DE59309575D1 (de) * 1992-06-15 1999-06-17 Heinze Dyconex Patente Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung
US5486492A (en) * 1992-10-30 1996-01-23 Kawasaki Steel Corporation Method of forming multilayered wiring structure in semiconductor device
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
JPH10107446A (ja) * 1996-09-27 1998-04-24 Tokyo Ohka Kogyo Co Ltd 多層配線板の製造方法
US6010956A (en) * 1996-02-29 2000-01-04 Tokyo Ohka Kogyo Co., Ltd. Process for producing multilayer wiring boards
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
JP3143408B2 (ja) * 1997-04-01 2001-03-07 イビデン株式会社 プリント配線板の製造方法
JP2001109162A (ja) * 1997-04-01 2001-04-20 Ibiden Co Ltd プリント配線板の製造方法
JP2000286362A (ja) 1999-03-30 2000-10-13 Mitsubishi Gas Chem Co Inc 極薄ｂｇａタイプ半導体プラスチックパッケージ用プリント配線板
JP4260275B2 (ja) * 1999-03-18 2009-04-30 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
JP2000294678A (ja) 1999-04-05 2000-10-20 Mitsubishi Gas Chem Co Inc 高熱放散型ボールグリッドアレイタイプ半導体プラスチックパッケージ用プリント配線板
JP3592129B2 (ja) * 1999-04-15 2004-11-24 新光電気工業株式会社 多層配線基板の製造方法
JP2001007240A (ja) 1999-06-17 2001-01-12 Mitsubishi Gas Chem Co Inc 高熱放散型ボールグリッドアレイタイプ半導体プラスチックパッケージ用プリント配線板
JP3606769B2 (ja) * 1999-07-13 2005-01-05 新光電気工業株式会社 半導体装置
US6316351B1 (en) * 2000-05-31 2001-11-13 Taiwan Semiconductor Manufacturing Company Inter-metal dielectric film composition for dual damascene process
JP4509437B2 (ja) * 2000-09-11 2010-07-21 Ｈｏｙａ株式会社 多層配線基板の製造方法
TWI300971B (en) * 2002-04-12 2008-09-11 Hitachi Ltd Semiconductor device
US20030204949A1 (en) * 2002-05-01 2003-11-06 Ultratera Corporation Method of forming connections on a conductor pattern of a printed circuit board
JP2003234578A (ja) * 2003-01-20 2003-08-22 Ibiden Co Ltd プリント配線板の製造方法
KR100520961B1 (ko) * 2003-05-30 2005-10-17 엘지전자 주식회사 인쇄회로기판의 제조방법
JP4479180B2 (ja) * 2003-07-25 2010-06-09 凸版印刷株式会社 多層回路板の製造方法
JP3999720B2 (ja) 2003-09-16 2007-10-31 沖電気工業株式会社 半導体装置およびその製造方法
US20060226202A1 (en) * 2005-04-11 2006-10-12 Ho-Ching Yang PCB solder masking process
JP5032001B2 (ja) 2005-05-19 2012-09-26 株式会社東芝 燃料電池
JP4769022B2 (ja) 2005-06-07 2011-09-07 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022086295A1 (ko) * 2020-10-22 2022-04-28 엘지이노텍 주식회사 회로 기판
US12452999B2 (en) 2020-10-22 2025-10-21 Lg Innotek Co., Ltd. Circuit board

Also Published As

Publication number Publication date
JP2008140886A (ja) 2008-06-19
US8222532B2 (en) 2012-07-17
EP1928220A2 (en) 2008-06-04
EP1928220A3 (en) 2009-09-30
TW200833200A (en) 2008-08-01
US20110253422A1 (en) 2011-10-20
US20080251279A1 (en) 2008-10-16
US8037596B2 (en) 2011-10-18

Similar Documents

Publication Publication Date Title
KR20080049626A (ko) 배선 기판 및 그 제조 방법
US8575495B2 (en) Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
CN100583423C (zh) 多层配线基板及其制造方法
US7098407B2 (en) Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate
US8508050B2 (en) Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
US9293406B2 (en) Semiconductor package and manufacturing method thereof
TWI413461B (zh) 佈線板之製造方法
KR100688385B1 (ko) 배선기판 및 반도체장치
US9386695B2 (en) Wiring substrate having multiple core substrates
KR20080106097A (ko) 배선 기판 및 그 제조 방법
KR20070120449A (ko) 배선 기판, 그 제조 방법 및 반도체 장치
KR20100059227A (ko) 다층 인쇄회로기판 및 그 제조방법
US20080223612A1 (en) Wiring substrate and manufacturing method thereof
JPWO2008044537A1 (ja) 半導体パッケージおよび半導体パッケージの製造方法
JP7077005B2 (ja) 配線基板及びその製造方法
CN100435302C (zh) 芯片内置基板的制造方法
US7795722B2 (en) Substrate strip and substrate structure and method for manufacturing the same
US20220369457A1 (en) Printed wiring board
CN119626905B (zh) 一种封装基板结构及其制备方法
US7560650B2 (en) Substrate structure and method for manufacturing the same
JP2011249819A (ja) 配線基板及びその製造方法
KR100425728B1 (ko) 인쇄회로기판의 홀 충진방법 및 그 장치 및인쇄회로기판의 제조방법
CN112992840B (zh) 封装结构及其制造方法
JP2011061035A (ja) 半導体装置の製造方法及びマスク
JP2000232092A (ja) 半導体装置の製造方法および半導体装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20071120

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid