KR20080037702A - 계조를 갖는 포토마스크 및 그 제조 방법 - Google Patents
계조를 갖는 포토마스크 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20080037702A KR20080037702A KR1020087005601A KR20087005601A KR20080037702A KR 20080037702 A KR20080037702 A KR 20080037702A KR 1020087005601 A KR1020087005601 A KR 1020087005601A KR 20087005601 A KR20087005601 A KR 20087005601A KR 20080037702 A KR20080037702 A KR 20080037702A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- light shielding
- shielding film
- photomask
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/46—Antireflective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
- H10P76/2043—Photolithographic processes using an anti-reflective coating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005273601 | 2005-09-21 | ||
| JPJP-P-2005-00273601 | 2005-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080037702A true KR20080037702A (ko) | 2008-04-30 |
Family
ID=37888972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087005601A Ceased KR20080037702A (ko) | 2005-09-21 | 2006-09-19 | 계조를 갖는 포토마스크 및 그 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8124301B2 (https=) |
| KR (1) | KR20080037702A (https=) |
| CN (1) | CN101268417A (https=) |
| TW (1) | TW200717176A (https=) |
| WO (1) | WO2007034930A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8784672B2 (en) | 2010-12-13 | 2014-07-22 | Samsung Electronics Co., Ltd. | Photomasks and methods of manufacturing the same |
| TWI502623B (zh) * | 2010-01-07 | 2015-10-01 | Hoya股份有限公司 | 光罩之製造方法、光罩、及顯示裝置之製造方法 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI446105B (zh) * | 2007-07-23 | 2014-07-21 | Hoya Corp | 光罩之製造方法、圖案轉印方法、光罩以及資料庫 |
| CN101393385B (zh) * | 2007-09-21 | 2013-09-11 | 北京京东方光电科技有限公司 | 可调节透射率的半色调掩模版及其制造方法 |
| JP4934237B2 (ja) * | 2007-09-29 | 2012-05-16 | Hoya株式会社 | グレートーンマスクの製造方法及びグレートーンマスク、並びにパターン転写方法 |
| US8685596B2 (en) * | 2007-12-04 | 2014-04-01 | Sharp Laboratories Of America, Inc. | Semi-transparent film grayscale mask |
| JP5108551B2 (ja) * | 2008-02-15 | 2012-12-26 | Hoya株式会社 | 多階調フォトマスク及びそれを用いたパターン転写方法 |
| KR101079161B1 (ko) * | 2008-12-22 | 2011-11-02 | 엘지이노텍 주식회사 | 하프톤 마스크 및 그 제조방법 |
| EP2738791B1 (en) * | 2009-02-16 | 2015-08-19 | Dai Nippon Printing Co., Ltd. | Method for correcting a photomask |
| CN101990058A (zh) * | 2009-07-30 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 晶圆级相机模组的镀膜方法及晶圆级相机模组 |
| DE102009046878A1 (de) * | 2009-07-31 | 2011-02-03 | Advanced Mask Technology Center Gmbh & Co. Kg | Verringerung der lonenwanderung von Absorbermaterialien von Lithographiemasken durch Chrompassivierung |
| CN102103323B (zh) * | 2009-12-21 | 2012-10-10 | 北京京东方光电科技有限公司 | 半色调掩模板及其制作方法 |
| WO2012005524A2 (en) | 2010-07-08 | 2012-01-12 | Lg Innotek Co., Ltd. | The printed circuit board and the method for manufacturing the same |
| JP6021365B2 (ja) * | 2012-03-12 | 2016-11-09 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| KR102046729B1 (ko) * | 2013-09-24 | 2019-11-19 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조방법 |
| CN104155810B (zh) * | 2014-07-22 | 2017-01-25 | 京东方科技集团股份有限公司 | 一种掩膜板 |
| KR102157644B1 (ko) * | 2014-08-13 | 2020-09-21 | (주)에스앤에스텍 | 다계조 포토 마스크 및 그의 제조 방법 |
| KR102286886B1 (ko) * | 2014-11-18 | 2021-08-09 | 삼성디스플레이 주식회사 | 포토 마스크 및 이의 제조 방법 |
| KR102502202B1 (ko) | 2015-06-29 | 2023-02-21 | 삼성디스플레이 주식회사 | 발광 표시 장치 및 그 제조 방법 |
| GB201517273D0 (en) * | 2015-09-30 | 2015-11-11 | Univ Manchester | Resist composition |
| US20170147652A1 (en) * | 2015-11-19 | 2017-05-25 | Institute For Information Industry | Search servers, end devices, and search methods for use in a distributed network |
| CN107145035A (zh) * | 2017-03-30 | 2017-09-08 | 惠科股份有限公司 | 光罩及其主动开关阵列基板的制造方法 |
| KR20200015775A (ko) * | 2017-07-17 | 2020-02-12 | 에이에스엠엘 네델란즈 비.브이. | 정보 결정 장치 및 방법 |
| WO2019016224A1 (en) * | 2017-07-21 | 2019-01-24 | Carl Zeiss Smt Gmbh | METHOD AND APPARATUS FOR REMOVING EXCESS MATERIALS FROM A PHOTOLITHOGRAPHIC MASK |
| US10811492B2 (en) | 2018-10-31 | 2020-10-20 | Texas Instruments Incorporated | Method and device for patterning thick layers |
| CN111367142A (zh) * | 2018-12-26 | 2020-07-03 | 聚灿光电科技(宿迁)有限公司 | 一种包含不同透光性的新型光学掩膜版 |
| CN113296354B (zh) * | 2020-02-22 | 2023-04-07 | 长鑫存储技术有限公司 | 应用于半导体光刻工艺中的掩膜版及光刻工艺方法 |
| CN113311660B (zh) * | 2021-06-03 | 2023-07-18 | 上海传芯半导体有限公司 | 掩模基版的制作方法及具有等离子体加热装置的涂胶设备 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW517286B (en) * | 2000-12-19 | 2003-01-11 | Hoya Corp | Gray tone mask and method for producing the same |
| KR100599054B1 (ko) * | 2001-04-11 | 2006-07-12 | 삼성전자주식회사 | 투과량 조절 마스크 및 그 제조방법 |
| DE10310136B4 (de) * | 2003-03-07 | 2007-05-03 | Infineon Technologies Ag | Maskensatz zur Projektion von jeweils auf den Masken des Satzes angeordneten und aufeinander abgestimmten Strukturmustern auf einen Halbleiterwafer |
| JP2005091855A (ja) * | 2003-09-18 | 2005-04-07 | Dainippon Printing Co Ltd | 階調マスクの製造方法 |
| JP4608882B2 (ja) | 2003-12-22 | 2011-01-12 | セイコーエプソン株式会社 | 露光用マスク及びその製造方法、並びに液晶装置の製造方法 |
| JP2005241693A (ja) * | 2004-02-24 | 2005-09-08 | Shin Etsu Chem Co Ltd | ハーフトーン型位相シフトマスクブランク及びその製造方法並びにハーフトーン型位相シフトマスク及びその製造方法 |
-
2006
- 2006-09-19 KR KR1020087005601A patent/KR20080037702A/ko not_active Ceased
- 2006-09-19 WO PCT/JP2006/318892 patent/WO2007034930A1/ja not_active Ceased
- 2006-09-19 US US12/066,203 patent/US8124301B2/en active Active
- 2006-09-19 CN CNA2006800345852A patent/CN101268417A/zh active Pending
- 2006-09-19 TW TW095134519A patent/TW200717176A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI502623B (zh) * | 2010-01-07 | 2015-10-01 | Hoya股份有限公司 | 光罩之製造方法、光罩、及顯示裝置之製造方法 |
| US8784672B2 (en) | 2010-12-13 | 2014-07-22 | Samsung Electronics Co., Ltd. | Photomasks and methods of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200717176A (en) | 2007-05-01 |
| US20090220867A1 (en) | 2009-09-03 |
| CN101268417A (zh) | 2008-09-17 |
| TWI363247B (https=) | 2012-05-01 |
| US8124301B2 (en) | 2012-02-28 |
| WO2007034930A1 (ja) | 2007-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E14-X000 | Pre-grant third party observation filed |
St.27 status event code: A-2-3-E10-E14-opp-X000 |
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| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
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| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
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| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
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| B601 | Maintenance of original decision after re-examination before a trial | ||
| PB0601 | Maintenance of original decision after re-examination before a trial |
St.27 status event code: N-3-6-B10-B17-rex-PB0601 |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20100211 Effective date: 20110721 |
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| PJ1301 | Trial decision |
St.27 status event code: A-3-3-V10-V15-crt-PJ1301 Decision date: 20110721 Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2008 7005601 Appeal request date: 20100211 Appellate body name: Patent Examination Board Decision authority category: Office appeal board Decision identifier: 2010101001067 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |