KR20060096373A - 압전 소자 및 그 제조 방법 - Google Patents

압전 소자 및 그 제조 방법 Download PDF

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Publication number
KR20060096373A
KR20060096373A KR20060020584A KR20060020584A KR20060096373A KR 20060096373 A KR20060096373 A KR 20060096373A KR 20060020584 A KR20060020584 A KR 20060020584A KR 20060020584 A KR20060020584 A KR 20060020584A KR 20060096373 A KR20060096373 A KR 20060096373A
Authority
KR
South Korea
Prior art keywords
film
piezoelectric
electrode
electrode film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20060020584A
Other languages
English (en)
Korean (ko)
Inventor
에이지 나까시오
준이찌 혼다
다까시 다무라
고지 스즈끼
데루오 이나구마
마나부 아이자와
가즈오 다까하시
다다시 사꾸라이
Original Assignee
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 가부시끼 가이샤 filed Critical 소니 가부시끼 가이샤
Publication of KR20060096373A publication Critical patent/KR20060096373A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5663—Manufacturing; Trimming; Mounting; Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Remote Sensing (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
KR20060020584A 2005-03-04 2006-03-03 압전 소자 및 그 제조 방법 Withdrawn KR20060096373A (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00061695 2005-03-04
JPJP-P-2005-00061694 2005-03-04
JPJP-P-2005-00061696 2005-03-04
JP2005061695 2005-03-04
JP2005061694 2005-03-04
JP2005061696 2005-03-04
JPJP-P-2005-00190234 2005-06-29
JP2005190234 2005-06-29
JPJP-P-2005-00378321 2005-12-28
JP2005378321A JP2007043054A (ja) 2005-03-04 2005-12-28 圧電素子及びその製造方法

Publications (1)

Publication Number Publication Date
KR20060096373A true KR20060096373A (ko) 2006-09-11

Family

ID=36599295

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20060020584A Withdrawn KR20060096373A (ko) 2005-03-04 2006-03-03 압전 소자 및 그 제조 방법

Country Status (4)

Country Link
US (2) US7583012B2 (enExample)
EP (1) EP1699092A3 (enExample)
JP (1) JP2007043054A (enExample)
KR (1) KR20060096373A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5037819B2 (ja) * 2005-03-04 2012-10-03 ソニー株式会社 電子機器
JP2006341956A (ja) * 2005-06-09 2006-12-21 Otis Elevator Co エレベータシステム
US7946173B2 (en) * 2005-11-08 2011-05-24 Panasonic Corporation Angular velocity sensor and process for producing the same
US7696676B2 (en) * 2006-12-18 2010-04-13 Lockheed Martin Corporation Piezoelectric composite apparatus and related methods
JP5288530B2 (ja) * 2007-03-30 2013-09-11 富士フイルム株式会社 圧電素子製造方法及び液体吐出ヘッド製造方法
US7915794B2 (en) * 2007-11-15 2011-03-29 Sony Corporation Piezoelectric device having a tension stress, and angular velocity sensor
KR100975010B1 (ko) * 2008-02-29 2010-08-09 성균관대학교산학협력단 다중 크기 압전 마이크로 칸티레버 공진자 어레이를 이용한 물리센서 및 그 제작방법
JP5410686B2 (ja) * 2008-03-21 2014-02-05 富士フイルム株式会社 圧電体膜の製造方法、成膜装置および圧電体膜
FR2932192B1 (fr) * 2008-06-09 2011-01-21 Sagem Defense Securite Procede de metallisation d'une calotte vibrante et capteur vibrant obtenu
US9035253B2 (en) 2008-06-27 2015-05-19 Panasonic Intellectual Property Managment Co., Ltd. Infrared sensor element
WO2009157189A1 (ja) * 2008-06-27 2009-12-30 パナソニック株式会社 圧電体素子とその製造方法
JP4640459B2 (ja) 2008-07-04 2011-03-02 ソニー株式会社 角速度センサ
JP4582235B2 (ja) * 2008-10-31 2010-11-17 株式会社村田製作所 圧電デバイスの製造方法
JP2010135748A (ja) * 2008-11-04 2010-06-17 Seiko Epson Corp 圧電素子及びその製造方法、液体噴射ヘッド及びその製造方法、並びに液体噴射装置
JP5581781B2 (ja) * 2010-04-06 2014-09-03 セイコーエプソン株式会社 圧電アクチュエーターの製造方法
KR101677297B1 (ko) 2010-12-21 2016-11-29 한국전자통신연구원 압전 마이크로 에너지 수확기 및 이의 제조 방법
JP6044101B2 (ja) 2012-04-10 2016-12-14 セイコーエプソン株式会社 センサーデバイス、センサーデバイスの製造方法および電子機器
JP6341446B2 (ja) * 2014-03-13 2018-06-13 株式会社リコー 電気機械変換素子の製造方法、電気機械変換素子、液滴吐出ヘッド、液滴吐出装置及び画像形成装置
JP7421178B2 (ja) * 2020-02-20 2024-01-24 国立大学法人大阪大学 振動検出素子およびその製造方法
WO2022174440A1 (zh) * 2021-02-22 2022-08-25 京东方科技集团股份有限公司 压电元件、压电振动器及其制作和驱动方法、电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500988A (en) * 1990-11-20 1996-03-26 Spectra, Inc. Method of making a perovskite thin-film ink jet transducer
US5802684A (en) * 1993-09-14 1998-09-08 Nikon Corporation Process for producing a vibration angular-velocity sensor
JP4122564B2 (ja) * 1998-04-24 2008-07-23 セイコーエプソン株式会社 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP2000357826A (ja) * 1999-04-13 2000-12-26 Seiko Epson Corp 圧電体素子の製造方法、圧電体素子、インクジェット式記録ヘッドおよびプリンタ
US6362558B1 (en) * 1999-12-24 2002-03-26 Kansai Research Institute Piezoelectric element, process for producing the same and ink jet recording head
US20070046153A1 (en) * 2005-08-23 2007-03-01 Canon Kabushiki Kaisha Piezoelectric substrate, piezoelectric element, liquid discharge head and liquid discharge apparatus
US7456548B2 (en) * 2006-05-09 2008-11-25 Canon Kabushiki Kaisha Piezoelectric element, piezoelectric actuator, and ink jet recording head

Also Published As

Publication number Publication date
US20060197415A1 (en) 2006-09-07
JP2007043054A (ja) 2007-02-15
US7583012B2 (en) 2009-09-01
EP1699092A2 (en) 2006-09-06
US20080222865A1 (en) 2008-09-18
EP1699092A3 (en) 2010-02-24

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060303

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid