KR20060058735A - 집적 회로 및 인쇄 회로 기판을 위한 가변 인덕터 - Google Patents
집적 회로 및 인쇄 회로 기판을 위한 가변 인덕터 Download PDFInfo
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- KR20060058735A KR20060058735A KR1020067007415A KR20067007415A KR20060058735A KR 20060058735 A KR20060058735 A KR 20060058735A KR 1020067007415 A KR1020067007415 A KR 1020067007415A KR 20067007415 A KR20067007415 A KR 20067007415A KR 20060058735 A KR20060058735 A KR 20060058735A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F21/00—Variable inductances or transformers of the signal type
- H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
- H01F2021/125—Printed variable inductor with taps, e.g. for VCO
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03J—TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS
- H03J2200/00—Indexing scheme relating to tuning resonant circuits and selecting resonant circuits
- H03J2200/35—Inductance tunable by switching in/out parts of the inductor
Abstract
Description
Claims (28)
- 인덕터에 대한 제 1 컨덕터,상기 제 1 컨덕터에 근접하여 루프를 형성하는 제 2 컨덕터, 및상기 제 2 컨덕터에 직렬로 커플링되고 상기 루프를 개폐하도록 동작가능한 스위치를 포함하며,상기 인덕터의 인덕턴스는 상기 스위치로 상기 루프를 개폐함으로써 변경되는, 집적 회로.
- 제 1 항에 있어서,상기 제 1 컨덕터가 스파이럴 패턴으로 형성된, 집적회로.
- 제 1 항에 있어서,상기 제 2 컨덕터 및 상기 스위치와 직렬로 커플링된 전류 소스를 더 포함하는, 집적 회로.
- 제 3 항에 있어서,상기 전류 소스는, 상기 인덕터의 인덕턴스를 감소시키기 위해 상기 제 2 컨덕터에서 제 1 방향으로 직류를 흐르게 하도록 동작가능한, 집적 회로.
- 제 3 항에 있어서,상기 전류 소스는, 상기 인덕터의 인덕턴스를 증가시키기 위해 상기 제 2 컨덕터에서 제 2 방향으로 직류를 흐르게 하도록 동작가능한, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 상기 제 1 컨덕터의 외측에 위치되는, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 상기 제 1 컨덕터의 내측에 위치되는, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 상기 제 1 컨덕터의 상부 상의 레이어 상에 위치되는, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 상기 제 1 컨덕터의 하부의 레이어 상에 위치되는, 집적 회로.
- 제 1 항에 있어서,상기 제 1 컨덕터에 근접하여 제 2 루프를 형성하는 제 3 컨덕터, 및상기 제 3 컨덕터에 직렬로 커플링되고 상기 제 2 루프를 개폐하도록 동작가능한 제 2 스위치를 더 포함하는, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터 및 상기 스위치에 직렬로 커플링된 캐패시터를 더 포함하는, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터 및 상기 스위치에 직렬로 커플링된 리액턴스 회로 엘리먼트를 더 포함하는, 집적 회로.
- 제 1 항에 있어서,상기 제 1 컨덕터는 저-손실 금속으로 제작된, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 저-손실 금속으로 제작된, 집적 회로.
- 제 1 항에 있어서,상기 스위치는 금속-산화물 반도체 (MOS) 트랜지스터로 구현된, 집적 회로.
- 제 1 항에 있어서,상기 제 2 컨덕터는 상기 제 1 컨덕터로부터 소정의 거리에 위치되며,상기 소정의 거리는 개폐되는 상기 루프에 의한 인덕턴스 변화의 특정량에 기초하여 선택되는, 집적 회로.
- 제 1 항에 있어서,상기 제 1 컨덕터의 2개의 엔드에 커플링된 캐패시터를 더 포함하며,상기 캐패시터 및 상기 인덕터는 공진기 탱크를 형성하는, 집적 회로.
- 제 1 항에 있어서,상기 인덕터는 전압 제어 발진기 (VCO)의 일부인, 집적 회로.
- 제 1 항에 있어서,상기 인덕터는 필터의 일부인, 집적 회로.
- 제 1 항에 있어서,상기 인덕터는 임피던스 매칭 네트워크의 일부인, 집적 회로.
- 인덕터에 대한 제 1 컨덕터,상기 제 1 컨덕터에 근접하여 루프를 형성하는 제 2 컨덕터, 및상기 제 2 컨덕터에 직렬로 커플링되고 상기 루프를 개폐하도록 동작가능한 스위치를 포함하며,상기 인덕터의 인덕턴스는 상기 스위치로 상기 루프를 개폐함으로써 변경되는, 디바이스.
- 제 21 항에 있어서,상기 제 1 컨덕터의 2개의 엔드에 커플링된 캐패시터를 더 포함하며,상기 캐패시터 및 상기 인덕터는 공진기 탱크를 형성하는, 디바이스.
- 인덕터에 대한 제 1 컨덕터,상기 제 1 컨덕터에 근접하여 루프를 형성하는 제 2 컨덕터,상기 제 2 컨덕터에 직렬로 커플링되고 상기 루프를 개폐하도록 동작가능한 스위치로서, 상기 인덕터의 인덕턴스는 상기 스위치로 상기 루프를 개폐함으로써 변경되는, 상기 스위치, 및상기 제 1 컨덕터의 2개의 엔드에 커플링된 캐패시터를 포함하며,상기 캐패시터 및 인덕터는 전압 제어 발진기 (VCO)에 대한 공진기 탱크를 형성하고,상기 VCO는, 개폐되는 상기 루프에 대응하는 2개의 주파수에서 동작가능한, 집적 회로.
- 제 23 항에 있어서,상기 캐패시터는 가변 캐패시터인, 집적 회로.
- 인덕터에 대한 제 1 컨덕터를 형성하는 단계,상기 제 1 컨덕터에 근접한 루프에서 제 2 컨덕터를 형성하는 단계, 및상기 제 2 컨덕터와 직렬로 스위치를 형성하는 단계를 포함하며,상기 스위치는 상기 인덕터의 인덕턴스를 변경하기 위해 상기 루프를 개폐하도록 동작가능한, 집적 회로의 제작 방법.
- 제 25 항에 있어서,상기 제 2 컨덕터 및 상기 스위치에 직렬로 전류 소스를 형성하는 단계를 더 포함하는, 집적 회로의 제작 방법.
- 제 25 항에 있어서,상기 제 2 컨덕터 및 상기 스위치에 직렬로 캐패시터를 형성하는 단계를 더 포함하는, 집적 회로의 제작 방법.
- 제 25 항에 있어서,상기 제 1 컨덕터에 근접한 제 2 루프에서 제 3 컨덕터를 형성하는 단계, 및상기 제 3 컨덕터에 직렬이고 상기 제 2 루프를 개폐하도록 동작가능한, 제 2 스위치를 형성하는 단계를 더 포함하는, 집적 회로의 제작 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/672,904 US7460001B2 (en) | 2003-09-25 | 2003-09-25 | Variable inductor for integrated circuit and printed circuit board |
US10/672,904 | 2003-09-25 |
Publications (2)
Publication Number | Publication Date |
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KR20060058735A true KR20060058735A (ko) | 2006-05-30 |
KR100807132B1 KR100807132B1 (ko) | 2008-03-03 |
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KR1020067007415A KR100807132B1 (ko) | 2003-09-25 | 2004-09-10 | 집적 회로 및 인쇄 회로 기판을 위한 가변 인덕터 |
Country Status (6)
Country | Link |
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US (1) | US7460001B2 (ko) |
JP (1) | JP4740136B2 (ko) |
KR (1) | KR100807132B1 (ko) |
CN (1) | CN100464420C (ko) |
TW (1) | TWI383409B (ko) |
WO (1) | WO2005034239A2 (ko) |
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KR100818497B1 (ko) * | 2006-11-06 | 2008-03-31 | 삼성전기주식회사 | 대칭형 스위치 인덕터 |
WO2014092339A1 (en) | 2012-12-13 | 2014-06-19 | Lg Innotek Co., Ltd. | Wirless power receiver and method of controlling the same |
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- 2004-09-10 KR KR1020067007415A patent/KR100807132B1/ko not_active IP Right Cessation
- 2004-09-14 TW TW093127775A patent/TWI383409B/zh not_active IP Right Cessation
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US20050068146A1 (en) | 2005-03-31 |
WO2005034239A3 (en) | 2005-07-14 |
CN1875484A (zh) | 2006-12-06 |
JP2007507106A (ja) | 2007-03-22 |
CN100464420C (zh) | 2009-02-25 |
JP4740136B2 (ja) | 2011-08-03 |
TW200515433A (en) | 2005-05-01 |
TWI383409B (zh) | 2013-01-21 |
WO2005034239A2 (en) | 2005-04-14 |
US7460001B2 (en) | 2008-12-02 |
KR100807132B1 (ko) | 2008-03-03 |
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