KR20060048668A - 열 전달 장치와 그 동작 및 제조 방법 - Google Patents

열 전달 장치와 그 동작 및 제조 방법 Download PDF

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Publication number
KR20060048668A
KR20060048668A KR1020050056758A KR20050056758A KR20060048668A KR 20060048668 A KR20060048668 A KR 20060048668A KR 1020050056758 A KR1020050056758 A KR 1020050056758A KR 20050056758 A KR20050056758 A KR 20050056758A KR 20060048668 A KR20060048668 A KR 20060048668A
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KR
South Korea
Prior art keywords
electrode
substrate layer
heat transfer
transfer device
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020050056758A
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English (en)
Korean (ko)
Inventor
스탠튼 얼 2세 위버
Original Assignee
제너럴 일렉트릭 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제너럴 일렉트릭 캄파니 filed Critical 제너럴 일렉트릭 캄파니
Publication of KR20060048668A publication Critical patent/KR20060048668A/ko
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020050056758A 2004-06-30 2005-06-29 열 전달 장치와 그 동작 및 제조 방법 Ceased KR20060048668A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/880,807 2004-06-30
US10/880,807 US7305839B2 (en) 2004-06-30 2004-06-30 Thermal transfer device and system and method incorporating same

Publications (1)

Publication Number Publication Date
KR20060048668A true KR20060048668A (ko) 2006-05-18

Family

ID=35115828

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050056758A Ceased KR20060048668A (ko) 2004-06-30 2005-06-29 열 전달 장치와 그 동작 및 제조 방법

Country Status (6)

Country Link
US (2) US7305839B2 (enExample)
EP (1) EP1612492B1 (enExample)
JP (1) JP2006017451A (enExample)
KR (1) KR20060048668A (enExample)
CN (1) CN1715822A (enExample)
DE (1) DE602005018416D1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7305839B2 (en) * 2004-06-30 2007-12-11 General Electric Company Thermal transfer device and system and method incorporating same
US8018117B2 (en) * 2006-01-31 2011-09-13 Tempronics, Inc. Closely spaced electrodes with a uniform gap
US7456543B2 (en) 2006-01-31 2008-11-25 Tempronics, Inc. Closely spaced electrodes with a uniform gap
KR20080091783A (ko) * 2006-01-31 2008-10-14 템프로닉스, 인크. 균일한 갭으로 밀접한 간격을 갖는 디바이스 및 변환프로세스
JP2010503219A (ja) * 2006-08-30 2010-01-28 テンプロニクス，インコーポレイテッド 均一ギャップを備える近接電極
US7659143B2 (en) * 2006-09-29 2010-02-09 Intel Corporation Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
AT504938A2 (de) 2007-02-23 2008-09-15 Vaillant Austria Gmbh Kraft-wärme-kopplungsanlage
US8653356B2 (en) 2007-03-26 2014-02-18 The Boeing Company Thermoelectric devices and methods of manufacture
US20090031733A1 (en) * 2007-07-31 2009-02-05 General Electric Company Thermotunneling refrigeration system
US20090205695A1 (en) * 2008-02-15 2009-08-20 Tempronics, Inc. Energy Conversion Device
CN101257770B (zh) * 2008-04-16 2011-06-22 汕头超声印制板公司 一种在印制电路板上嵌入散热片的制作方法
US8359871B2 (en) * 2009-02-11 2013-01-29 Marlow Industries, Inc. Temperature control device
US8869542B2 (en) * 2009-07-27 2014-10-28 The Penn State Research Foundation Polymer-based electrocaloric cooling devices
US8695353B2 (en) * 2009-12-17 2014-04-15 Empire Technology Development Llc Electrocaloric cooling
CA2787234A1 (en) * 2010-01-13 2011-07-21 Clearsign Combustion Corporation Method and apparatus for electrical control of heat transfer
US20110277808A1 (en) * 2010-03-22 2011-11-17 Scannanotek Oy Mems solar cell device and array
WO2011159316A1 (en) 2010-06-18 2011-12-22 Empire Technology Development Llc Electrocaloric effect materials and thermal diodes
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US8769967B2 (en) 2010-09-03 2014-07-08 Empire Technology Development Llc Electrocaloric heat transfer
US8969703B2 (en) 2010-09-13 2015-03-03 Tempronics, Inc. Distributed thermoelectric string and insulating panel
US8703523B1 (en) 2010-12-06 2014-04-22 Lawrence Livermore National Security, Llc. Nanoporous carbon tunable resistor/transistor and methods of production thereof
US9157669B2 (en) * 2011-04-20 2015-10-13 Empire Technology Development Llc Heterogeneous electrocaloric effect heat transfer device
KR20140045408A (ko) 2011-07-06 2014-04-16 템프로닉스, 인크. 분산된 열전기 가열 및 냉각의 통합
US9310109B2 (en) 2011-09-21 2016-04-12 Empire Technology Development Llc Electrocaloric effect heat transfer device dimensional stress control
US9671140B2 (en) 2011-09-21 2017-06-06 Empire Technology Development Llc Heterogeneous electrocaloric effect heat transfer
CN103814259B (zh) 2011-09-21 2015-12-16 英派尔科技开发有限公司 电热效应热传递装置尺寸应力控制
US20130192269A1 (en) * 2012-02-01 2013-08-01 Min-Chia Wang Magnetocaloric module for magnetic refrigeration apparatus
US9500392B2 (en) 2012-07-17 2016-11-22 Empire Technology Development Llc Multistage thermal flow device and thermal energy transfer
US9638442B2 (en) 2012-08-07 2017-05-02 Tempronics, Inc. Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling
WO2014046640A1 (en) 2012-09-18 2014-03-27 Empire Technology Development Llc Phase change memory thermal management with the electrocaloric effect materials
DE202013012369U1 (de) 2012-09-25 2016-07-06 Faurecia Automotive Seating, Llc Fahrzeugsitz mit einer thermischen Vorrichtung
CN105848964B (zh) 2013-11-04 2020-01-03 坦普罗尼克斯公司 针对功能和耐久性的热电串、板和封套的设计
KR101673703B1 (ko) * 2014-11-27 2016-11-07 현대자동차주식회사 엔진의 열전 발전 시스템
DE102015216691A1 (de) * 2015-03-09 2016-09-15 Robert Bosch Gmbh Wärmeübertrager
CN106255350A (zh) * 2016-08-18 2016-12-21 东莞市五株电子科技有限公司 埋铜板制作方法
CN114824558B (zh) * 2022-04-26 2025-08-01 京东方科技集团股份有限公司 温控组件及电池模组

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169200A (en) 1962-06-22 1965-02-09 Fred N Huffman Thermotunnel converter
US3702408A (en) 1970-11-03 1972-11-07 Atomic Energy Commission Multi-converter thermionic energy module
US4039352A (en) 1971-09-13 1977-08-02 Institutul De Cercetaro Energetice Industriale Si Proictari Utilaje Energetice High efficiency thermoelectric generator for the direct conversion of heat into electrical energy
DE2547262C3 (de) 1975-10-22 1981-07-16 Reinhard Dr. 7101 Flein Dahlberg Thermoelektrische Anordnung mit großen Temperaturgradienten und Verwendung
US4667126A (en) 1982-11-26 1987-05-19 Rasor Associates, Inc. Thermionic converter
US4755350A (en) 1987-03-11 1988-07-05 The United States Of America As Represented By The Secretary Of The Air Force Thermionic reactor module with thermal storage reservoir
US5028835A (en) 1989-10-11 1991-07-02 Fitzpatrick Gary O Thermionic energy production
US5113315A (en) 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
JPH05129231A (ja) * 1991-11-01 1993-05-25 Hitachi Ltd 電極配線
US5219516A (en) 1992-06-16 1993-06-15 Thermacore, Inc. Thermionic generator module with heat pipes
US5637946A (en) 1993-10-28 1997-06-10 Lockheed Corporation Thermally energized electrical power source
US5541464A (en) 1994-03-30 1996-07-30 Johnson; Lonnie G. Thermionic generator
US5492570A (en) 1994-07-05 1996-02-20 Thermacore, Inc. Hybrid thermal electric generator
EP0706196B1 (en) 1994-10-05 2000-03-01 Matsushita Electric Industrial Co., Ltd. An electron emission cathode; an electron emission device, a flat display, a thermoelectric cooling device incorporating the same; and a method for producing the electron emission cathode
US6064137A (en) 1996-03-06 2000-05-16 Borealis Technical Limited Method and apparatus for a vacuum thermionic converter with thin film carbonaceous field emission
US5675972A (en) 1996-09-25 1997-10-14 Borealis Technical Limited Method and apparatus for vacuum diode-based devices with electride-coated electrodes
US5994638A (en) 1996-12-19 1999-11-30 Borealis Technical Limited Method and apparatus for thermionic generator
US5973259A (en) 1997-05-12 1999-10-26 Borealis Tech Ltd Method and apparatus for photoelectric generation of electricity
US6084173A (en) 1997-07-30 2000-07-04 Dimatteo; Robert Stephen Method and apparatus for the generation of charged carriers in semiconductor devices
AU9225098A (en) 1997-09-08 1999-03-29 Borealis Technical Limited Diode device
US6720704B1 (en) 1997-09-08 2004-04-13 Boreaiis Technical Limited Thermionic vacuum diode device with adjustable electrodes
US7140102B2 (en) 2001-09-02 2006-11-28 Borealis Technical Limited Electrode sandwich separation
GB9724642D0 (en) * 1997-11-21 1998-01-21 British Tech Group Single electron devices
US6495843B1 (en) 1998-02-09 2002-12-17 Borealis Technical Limited Method for increasing emission through a potential barrier
US6281514B1 (en) 1998-02-09 2001-08-28 Borealis Technical Limited Method for increasing of tunneling through a potential barrier
US6294858B1 (en) 1998-02-26 2001-09-25 Sandia Corporation Microminiature thermionic converters
US6509669B1 (en) 1998-02-26 2003-01-21 Sandia Corporation Microminiature thermionic converters
US6100621A (en) 1998-03-26 2000-08-08 The United States Of America As Represented By The United States Department Of Energy Thermionic converter with differentially heated cesium-oxygen source and method of operation
JP2000057646A (ja) * 1998-08-07 2000-02-25 Sony Corp 光磁気記録媒体及び光磁気記録再生装置
US6037697A (en) 1999-01-18 2000-03-14 General Atomics Thermionic converter and method of making same
US6396191B1 (en) 1999-03-11 2002-05-28 Eneco, Inc. Thermal diode for energy conversion
US6489704B1 (en) 1999-03-11 2002-12-03 Eneco, Inc. Hybrid thermionic energy converter and method
WO2001039235A2 (en) 1999-09-17 2001-05-31 Vanderbilt University Thermodynamic energy conversion devices and methods using a diamond-based electron emitter
US6417060B2 (en) 2000-02-25 2002-07-09 Borealis Technical Limited Method for making a diode device
US6651760B2 (en) 2000-04-05 2003-11-25 Borealis Technical Limited Thermionic automobile
US6545385B2 (en) * 2000-04-11 2003-04-08 Sandia Corporation Microelectromechanical apparatus for elevating and tilting a platform
US6403876B1 (en) 2000-12-07 2002-06-11 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metal tips
US6384312B1 (en) 2000-12-07 2002-05-07 International Business Machines Corporation Thermoelectric coolers with enhanced structured interfaces
US6467275B1 (en) 2000-12-07 2002-10-22 International Business Machines Corporation Cold point design for efficient thermoelectric coolers
US6608250B2 (en) 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
US7273981B2 (en) 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US6625990B2 (en) 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
US6774003B2 (en) 2001-02-23 2004-08-10 Borealis Technical Limited Method for making a diode device
US6779347B2 (en) 2001-05-21 2004-08-24 C.P. Baker Securities, Inc. Solid-state thermionic refrigeration
US6876123B2 (en) 2001-08-28 2005-04-05 Borealis Technical Limited Thermotunnel converter with spacers between the electrodes
AU2003220082A1 (en) 2002-03-06 2003-11-03 Borealis Technical Limited Thermionic vacuum diode device with adjustable electrodes
AU2003218346A1 (en) 2002-03-22 2003-10-13 Borealis Technical Limited Influence of surface geometry on metal properties
US6494048B1 (en) 2002-04-11 2002-12-17 International Business Machines Corporation Assembly of quantum cold point thermoelectric coolers using magnets
US20040029341A1 (en) 2002-08-01 2004-02-12 Cox Isaiah Watas Gap diode device
US6946596B2 (en) 2002-09-13 2005-09-20 Kucherov Yan R Tunneling-effect energy converters
JP2004150741A (ja) * 2002-10-31 2004-05-27 Kyocera Corp 熱電子ヒートポンプ及びそれを用いた熱電子ヒートポンプモジュール
US7305839B2 (en) 2004-06-30 2007-12-11 General Electric Company Thermal transfer device and system and method incorporating same

Also Published As

Publication number Publication date
DE602005018416D1 (de) 2010-02-04
US7805950B2 (en) 2010-10-05
US7305839B2 (en) 2007-12-11
EP1612492B1 (en) 2009-12-23
US20060000226A1 (en) 2006-01-05
JP2006017451A (ja) 2006-01-19
EP1612492A1 (en) 2006-01-04
CN1715822A (zh) 2006-01-04
US20080042163A1 (en) 2008-02-21

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