DE602005018416D1 - Wärmeübertragungseinrichtung und Verfahren zu Herstellung und Betrieb derselben - Google Patents

Wärmeübertragungseinrichtung und Verfahren zu Herstellung und Betrieb derselben

Info

Publication number
DE602005018416D1
DE602005018416D1 DE602005018416T DE602005018416T DE602005018416D1 DE 602005018416 D1 DE602005018416 D1 DE 602005018416D1 DE 602005018416 T DE602005018416 T DE 602005018416T DE 602005018416 T DE602005018416 T DE 602005018416T DE 602005018416 D1 DE602005018416 D1 DE 602005018416D1
Authority
DE
Germany
Prior art keywords
producing
operating
same
heat transfer
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005018416T
Other languages
English (en)
Inventor
Stanton Earl Weaver Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE602005018416D1 publication Critical patent/DE602005018416D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602005018416T 2004-06-30 2005-06-16 Wärmeübertragungseinrichtung und Verfahren zu Herstellung und Betrieb derselben Active DE602005018416D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/880,807 US7305839B2 (en) 2004-06-30 2004-06-30 Thermal transfer device and system and method incorporating same

Publications (1)

Publication Number Publication Date
DE602005018416D1 true DE602005018416D1 (de) 2010-02-04

Family

ID=35115828

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005018416T Active DE602005018416D1 (de) 2004-06-30 2005-06-16 Wärmeübertragungseinrichtung und Verfahren zu Herstellung und Betrieb derselben

Country Status (6)

Country Link
US (2) US7305839B2 (de)
EP (1) EP1612492B1 (de)
JP (1) JP2006017451A (de)
KR (1) KR20060048668A (de)
CN (1) CN1715822A (de)
DE (1) DE602005018416D1 (de)

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US8018117B2 (en) * 2006-01-31 2011-09-13 Tempronics, Inc. Closely spaced electrodes with a uniform gap
US7456543B2 (en) 2006-01-31 2008-11-25 Tempronics, Inc. Closely spaced electrodes with a uniform gap
US8102096B2 (en) * 2006-08-30 2012-01-24 Tempronics, Inc. Closely spaced electrodes with a uniform gap
US7659143B2 (en) * 2006-09-29 2010-02-09 Intel Corporation Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
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US20090031733A1 (en) * 2007-07-31 2009-02-05 General Electric Company Thermotunneling refrigeration system
US20090205695A1 (en) * 2008-02-15 2009-08-20 Tempronics, Inc. Energy Conversion Device
CN101257770B (zh) * 2008-04-16 2011-06-22 汕头超声印制板公司 一种在印制电路板上嵌入散热片的制作方法
US8359871B2 (en) * 2009-02-11 2013-01-29 Marlow Industries, Inc. Temperature control device
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US8695353B2 (en) * 2009-12-17 2014-04-15 Empire Technology Development Llc Electrocaloric cooling
CN102782297B (zh) * 2010-01-13 2016-03-02 克利尔赛恩燃烧公司 用于加强和降低热传递的装置及用于刺激热传递和保护温度敏感性表面的方法
WO2011117716A2 (en) * 2010-03-22 2011-09-29 Scannanotek Oy Mems solar cell device and array
WO2011159316A1 (en) 2010-06-18 2011-12-22 Empire Technology Development Llc Electrocaloric effect materials and thermal diodes
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
WO2012030351A1 (en) 2010-09-03 2012-03-08 Empire Technology Development Llc Electrocaloric heat transfer
US8969703B2 (en) 2010-09-13 2015-03-03 Tempronics, Inc. Distributed thermoelectric string and insulating panel
US8703523B1 (en) 2010-12-06 2014-04-22 Lawrence Livermore National Security, Llc. Nanoporous carbon tunable resistor/transistor and methods of production thereof
WO2012144995A1 (en) * 2011-04-20 2012-10-26 Empire Technology Development Llc Heterogeneous electrocaloric effect heat transfer device
CN103635121B (zh) 2011-07-06 2016-10-12 坦普罗尼克斯公司 分布式热电加热和冷却的集成
US9671140B2 (en) 2011-09-21 2017-06-06 Empire Technology Development Llc Heterogeneous electrocaloric effect heat transfer
US8739553B2 (en) 2011-09-21 2014-06-03 Empire Technology Development Llc Electrocaloric effect heat transfer device dimensional stress control
US9310109B2 (en) 2011-09-21 2016-04-12 Empire Technology Development Llc Electrocaloric effect heat transfer device dimensional stress control
US20130192269A1 (en) * 2012-02-01 2013-08-01 Min-Chia Wang Magnetocaloric module for magnetic refrigeration apparatus
WO2014014448A1 (en) 2012-07-17 2014-01-23 Empire Technology Development Llc Multistage thermal flow device and thermal energy transfer
US9638442B2 (en) 2012-08-07 2017-05-02 Tempronics, Inc. Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling
US9318192B2 (en) 2012-09-18 2016-04-19 Empire Technology Development Llc Phase change memory thermal management with electrocaloric effect materials
KR20150060798A (ko) 2012-09-25 2015-06-03 포레시아 오토모티브 시팅, 엘엘씨 열소자를 구비한 차량 시트
WO2015066518A1 (en) 2013-11-04 2015-05-07 Tempronics, Inc. Design of thermoelectric string, panel, and covers for function and durability
KR101673703B1 (ko) * 2014-11-27 2016-11-07 현대자동차주식회사 엔진의 열전 발전 시스템
DE102015216691A1 (de) * 2015-03-09 2016-09-15 Robert Bosch Gmbh Wärmeübertrager
CN106255350A (zh) * 2016-08-18 2016-12-21 东莞市五株电子科技有限公司 埋铜板制作方法

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Also Published As

Publication number Publication date
KR20060048668A (ko) 2006-05-18
CN1715822A (zh) 2006-01-04
EP1612492B1 (de) 2009-12-23
US7305839B2 (en) 2007-12-11
EP1612492A1 (de) 2006-01-04
US20060000226A1 (en) 2006-01-05
US7805950B2 (en) 2010-10-05
US20080042163A1 (en) 2008-02-21
JP2006017451A (ja) 2006-01-19

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Legal Events

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