DE602005019961D1 - Steuervorrichtung und Verfahren zu deren Herstellung - Google Patents

Steuervorrichtung und Verfahren zu deren Herstellung

Info

Publication number
DE602005019961D1
DE602005019961D1 DE602005019961T DE602005019961T DE602005019961D1 DE 602005019961 D1 DE602005019961 D1 DE 602005019961D1 DE 602005019961 T DE602005019961 T DE 602005019961T DE 602005019961 T DE602005019961 T DE 602005019961T DE 602005019961 D1 DE602005019961 D1 DE 602005019961D1
Authority
DE
Germany
Prior art keywords
manufacture
control device
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005019961T
Other languages
English (en)
Inventor
Takuya Mayuzumi
Shuji Eguchi
Masahiro Sasaki
Kiyoomi Kadoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE602005019961D1 publication Critical patent/DE602005019961D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE602005019961T 2004-10-06 2005-10-06 Steuervorrichtung und Verfahren zu deren Herstellung Active DE602005019961D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004293183A JP4585828B2 (ja) 2004-10-06 2004-10-06 制御装置およびその製造方法

Publications (1)

Publication Number Publication Date
DE602005019961D1 true DE602005019961D1 (de) 2010-04-29

Family

ID=35686509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005019961T Active DE602005019961D1 (de) 2004-10-06 2005-10-06 Steuervorrichtung und Verfahren zu deren Herstellung

Country Status (4)

Country Link
US (2) US7359212B2 (de)
EP (1) EP1646271B1 (de)
JP (1) JP4585828B2 (de)
DE (1) DE602005019961D1 (de)

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CN1802883A (zh) * 2003-07-03 2006-07-12 株式会社日立制作所 组件装置及其制造方法
JP2006032490A (ja) * 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
JP4548199B2 (ja) * 2005-04-22 2010-09-22 株式会社デンソー 電子回路装置の製造方法
JP4209423B2 (ja) * 2005-12-16 2009-01-14 パナソニックＥｖエナジー株式会社 二次電池用の制御装置及び二次電池の出力制御方法
DE102006038373A1 (de) * 2006-08-12 2008-02-14 Robert Bosch Gmbh Elektrische Vorrichtung
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DE102007002323B4 (de) * 2007-01-16 2008-11-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Waschbares Elektronik-Flachsystem mit freien Anschlusskontakten zur Integration in ein textiles Material oder Flexmaterial
JP2009010014A (ja) * 2007-06-26 2009-01-15 Yanmar Co Ltd 電子制御装置の取り付け構成
JP5098772B2 (ja) * 2007-06-29 2012-12-12 ダイキン工業株式会社 電装品ユニット
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US8156797B2 (en) * 2008-07-28 2012-04-17 Trw Automotive U.S. Llc Method and apparatus for overmolding a tire pressure monitor sensor
JP2010057345A (ja) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd 電子制御装置
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JP5417162B2 (ja) * 2009-12-28 2014-02-12 株式会社日立製作所 蓄電装置
DE102011012673A1 (de) 2010-03-17 2011-09-22 Hitachi Automotive Systems, Ltd. Elektronische Steuereinrichtung für Fahrzeuge
JP5501816B2 (ja) * 2010-03-19 2014-05-28 日立オートモティブシステムズ株式会社 自動車用電子制御装置
JP5693351B2 (ja) * 2011-04-21 2015-04-01 三菱電機株式会社 基板内蔵用筐体
JP5823774B2 (ja) * 2011-08-12 2015-11-25 シャープ株式会社 導電部材およびこれを備える電子機器
DE102011085650B4 (de) * 2011-11-03 2022-09-01 Robert Bosch Gmbh Befestigung eines Steuergerätes für ein Getriebesteuermodul an einer Trägerplatte
JP6075613B2 (ja) * 2012-11-30 2017-02-08 株式会社デンソー 車両用電子制御ユニット
JP2014168982A (ja) * 2013-03-01 2014-09-18 Denso Corp 車両用電子制御ユニット
JP5892088B2 (ja) * 2013-03-01 2016-03-23 株式会社デンソー 車両用電子制御ユニット
KR101449271B1 (ko) * 2013-04-19 2014-10-08 현대오트론 주식회사 오버몰딩을 이용한 차량의 전자 제어 장치 및 그 제조 방법
KR101428933B1 (ko) * 2013-07-05 2014-08-08 현대오트론 주식회사 방열판을 이용한 차량의 전자 제어 장치 및 그 제조 방법
US9385059B2 (en) * 2013-08-28 2016-07-05 Infineon Technologies Ag Overmolded substrate-chip arrangement with heat sink
EP2857169B1 (de) * 2013-10-01 2017-12-13 Inalfa Roof Systems Group B.V. Konstruktionsanordnung und Verfahren zu ihrer Herstellung
JP6405732B2 (ja) * 2014-06-13 2018-10-17 株式会社デンソー 電子装置
JP5901725B1 (ja) * 2014-10-17 2016-04-13 三菱電機株式会社 防水型制御ユニットとその組立方法
WO2016161617A1 (en) * 2015-04-10 2016-10-13 Hamlin Electronics Suzhou Co. Ltd Encapsulated electrical device and method of fabrication
DE102015206480A1 (de) * 2015-04-10 2016-10-13 Robert Bosch Gmbh Steuergerät
JP6453195B2 (ja) * 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
CN106714507B (zh) * 2015-11-16 2019-09-13 华为技术有限公司 中框件及其生产方法
DE102016204811A1 (de) * 2016-03-23 2017-09-28 Robert Bosch Gmbh Steuermodul zur Ansteuerung wenigstens eines elektrisch betätigbaren Aktuators
JP2018073993A (ja) * 2016-10-28 2018-05-10 株式会社デンソー 電子装置および装置モジュール
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CN108934132B (zh) * 2017-05-25 2021-08-06 法雷奥汽车内部控制（深圳）有限公司 印刷电路板组件及其封装方法和机动车辆
DE102017211513A1 (de) * 2017-07-06 2019-01-10 Robert Bosch Gmbh Elektronikmodul und Kombination eines Elektronikmoduls mit einer Hydraulikplatte
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US10694617B2 (en) * 2018-07-31 2020-06-23 Sensus Spectrum, Llc Plastic injection molded potting cups and related methods
US11638353B2 (en) * 2018-09-17 2023-04-25 Hutchinson Technology Incorporated Apparatus and method for forming sensors with integrated electrical circuits on a substrate
DE102018217456B4 (de) 2018-10-11 2020-07-09 Conti Temic Microelectronic Gmbh Elektronische Steuervorrichtung und Verfahren zur Herstellung einer elektronischen Steuervorrichtung
EP3761768B1 (de) * 2019-07-04 2023-04-12 Hosiden Corporation Wasserdichte elektronische komponente und verfahren zur montage davon
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DE102021208578A1 (de) * 2021-08-06 2023-02-09 Zf Friedrichshafen Ag Modulgehäuse aus Kunststoff mit eingebettetem Kühlkörper
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CN1802883A (zh) 2003-07-03 2006-07-12 株式会社日立制作所 组件装置及其制造方法

Also Published As

Publication number Publication date
US20080165511A1 (en) 2008-07-10
US7924572B2 (en) 2011-04-12
JP2006108398A (ja) 2006-04-20
US20060077643A1 (en) 2006-04-13
JP4585828B2 (ja) 2010-11-24
EP1646271B1 (de) 2010-03-17
US7359212B2 (en) 2008-04-15
EP1646271A2 (de) 2006-04-12
EP1646271A3 (de) 2007-11-07

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