CN1715822A - 热传递装置和系统以及包含该装置和系统的方法 - Google Patents

热传递装置和系统以及包含该装置和系统的方法 Download PDF

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Publication number
CN1715822A
CN1715822A CNA2005100809873A CN200510080987A CN1715822A CN 1715822 A CN1715822 A CN 1715822A CN A2005100809873 A CNA2005100809873 A CN A2005100809873A CN 200510080987 A CN200510080987 A CN 200510080987A CN 1715822 A CN1715822 A CN 1715822A
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CN
China
Prior art keywords
electrode
heat
electrodes
hot
driver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100809873A
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English (en)
Chinese (zh)
Inventor
S·E·小韦弗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
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General Electric Co
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Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN1715822A publication Critical patent/CN1715822A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNA2005100809873A 2004-06-30 2005-06-30 热传递装置和系统以及包含该装置和系统的方法 Pending CN1715822A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/880807 2004-06-30
US10/880,807 US7305839B2 (en) 2004-06-30 2004-06-30 Thermal transfer device and system and method incorporating same

Publications (1)

Publication Number Publication Date
CN1715822A true CN1715822A (zh) 2006-01-04

Family

ID=35115828

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100809873A Pending CN1715822A (zh) 2004-06-30 2005-06-30 热传递装置和系统以及包含该装置和系统的方法

Country Status (6)

Country Link
US (2) US7305839B2 (enExample)
EP (1) EP1612492B1 (enExample)
JP (1) JP2006017451A (enExample)
KR (1) KR20060048668A (enExample)
CN (1) CN1715822A (enExample)
DE (1) DE602005018416D1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782297A (zh) * 2010-01-13 2012-11-14 克利尔赛恩燃烧公司 用于热传递的电控制的方法和装置
CN106194355A (zh) * 2014-11-27 2016-12-07 现代自动车株式会社 引擎的热电发电机系统
CN107407498A (zh) * 2015-03-09 2017-11-28 罗伯特·博世有限公司 热传递装置
CN114824558A (zh) * 2022-04-26 2022-07-29 京东方科技集团股份有限公司 温控组件及电池模组

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CN105848964B (zh) 2013-11-04 2020-01-03 坦普罗尼克斯公司 针对功能和耐久性的热电串、板和封套的设计
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782297A (zh) * 2010-01-13 2012-11-14 克利尔赛恩燃烧公司 用于热传递的电控制的方法和装置
CN106194355A (zh) * 2014-11-27 2016-12-07 现代自动车株式会社 引擎的热电发电机系统
CN106194355B (zh) * 2014-11-27 2019-05-17 现代自动车株式会社 引擎的热电发电机系统
CN107407498A (zh) * 2015-03-09 2017-11-28 罗伯特·博世有限公司 热传递装置
CN114824558A (zh) * 2022-04-26 2022-07-29 京东方科技集团股份有限公司 温控组件及电池模组

Also Published As

Publication number Publication date
DE602005018416D1 (de) 2010-02-04
US7805950B2 (en) 2010-10-05
US7305839B2 (en) 2007-12-11
EP1612492B1 (en) 2009-12-23
US20060000226A1 (en) 2006-01-05
JP2006017451A (ja) 2006-01-19
EP1612492A1 (en) 2006-01-04
KR20060048668A (ko) 2006-05-18
US20080042163A1 (en) 2008-02-21

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Open date: 20060104