KR20050094820A - 낮은 스트레스 반도체 다이 부착 - Google Patents

낮은 스트레스 반도체 다이 부착 Download PDF

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Publication number
KR20050094820A
KR20050094820A KR1020057011610A KR20057011610A KR20050094820A KR 20050094820 A KR20050094820 A KR 20050094820A KR 1020057011610 A KR1020057011610 A KR 1020057011610A KR 20057011610 A KR20057011610 A KR 20057011610A KR 20050094820 A KR20050094820 A KR 20050094820A
Authority
KR
South Korea
Prior art keywords
die
dewetting agent
periphery
dewetting
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020057011610A
Other languages
English (en)
Korean (ko)
Inventor
브라이언 더블유. 콘다이
데이비드 제이. 도허티
Original Assignee
프리스케일 세미컨덕터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR20050094820A publication Critical patent/KR20050094820A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
KR1020057011610A 2002-12-30 2003-09-30 낮은 스트레스 반도체 다이 부착 Withdrawn KR20050094820A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/334,042 US7042103B2 (en) 2002-12-30 2002-12-30 Low stress semiconductor die attach
US10/334,042 2002-12-30

Publications (1)

Publication Number Publication Date
KR20050094820A true KR20050094820A (ko) 2005-09-28

Family

ID=32654908

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057011610A Withdrawn KR20050094820A (ko) 2002-12-30 2003-09-30 낮은 스트레스 반도체 다이 부착

Country Status (5)

Country Link
US (1) US7042103B2 (https=)
JP (1) JP4436765B2 (https=)
KR (1) KR20050094820A (https=)
AU (1) AU2003279079A1 (https=)
WO (1) WO2004061936A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8962389B2 (en) 2013-05-30 2015-02-24 Freescale Semiconductor, Inc. Microelectronic packages including patterned die attach material and methods for the fabrication thereof

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332414B2 (en) * 2005-06-22 2008-02-19 Freescale Semiconductor, Inc. Chemical die singulation technique
TW200820455A (en) * 2006-10-18 2008-05-01 Young Lighting Technology Corp LED package and manufacture method thereof
US8274162B2 (en) * 2007-01-20 2012-09-25 Triquint Semiconductor, Inc. Apparatus and method for reduced delamination of an integrated circuit module
US8456023B2 (en) 2007-04-27 2013-06-04 Freescale Semiconductor, Inc. Semiconductor wafer processing
CN101295695A (zh) * 2007-04-29 2008-10-29 飞思卡尔半导体（中国）有限公司 具有焊料流动控制的引线框架
US8718720B1 (en) * 2010-07-30 2014-05-06 Triquint Semiconductor, Inc. Die including a groove extending from a via to an edge of the die
CN102255033B (zh) * 2011-07-14 2013-04-10 佛山市蓝箭电子股份有限公司 一种大功率led封装结构及其封装方法
US9177907B1 (en) 2012-04-03 2015-11-03 Rockwell Collins, Inc. High performance deposited die attach
US9171786B1 (en) 2014-07-02 2015-10-27 Freescale Semiconductor, Inc. Integrated circuit with recess for die attachment
JP6430422B2 (ja) * 2016-02-29 2018-11-28 株式会社東芝 半導体装置
US11114387B2 (en) 2017-02-15 2021-09-07 Industrial Technology Research Institute Electronic packaging structure
US11488923B2 (en) 2019-05-24 2022-11-01 Wolfspeed, Inc. High reliability semiconductor devices and methods of fabricating the same
CN112038216A (zh) * 2020-09-08 2020-12-04 重庆邮电大学 一种p型非晶态半导体薄膜及其薄膜晶体管制备方法

Family Cites Families (19)

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EP0023534A3 (en) * 1979-08-06 1982-04-28 Teccor Electronics, Inc. Semiconductor device mounting structure and method of mounting
US4918511A (en) 1985-02-01 1990-04-17 Advanced Micro Devices, Inc. Thermal expansion compensated metal lead frame for integrated circuit package
US4903118A (en) * 1988-03-30 1990-02-20 Director General, Agency Of Industrial Science And Technology Semiconductor device including a resilient bonding resin
US5075254A (en) 1988-04-26 1991-12-24 National Semiconductor Corporation Method and apparatus for reducing die stress
US4952999A (en) 1988-04-26 1990-08-28 National Semiconductor Corporation Method and apparatus for reducing die stress
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5156998A (en) 1991-09-30 1992-10-20 Hughes Aircraft Company Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes
US5350662A (en) 1992-03-26 1994-09-27 Hughes Aircraft Company Maskless process for forming refractory metal layer in via holes of GaAs chips
US5409863A (en) * 1993-02-19 1995-04-25 Lsi Logic Corporation Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die
JP3350152B2 (ja) * 1993-06-24 2002-11-25 三菱電機株式会社 半導体装置およびその製造方法
JP3263288B2 (ja) * 1995-09-13 2002-03-04 株式会社東芝 半導体装置
SG46955A1 (en) 1995-10-28 1998-03-20 Inst Of Microelectronics Ic packaging lead frame for reducing chip stress and deformation
US5804880A (en) 1996-11-04 1998-09-08 National Semiconductor Corporation Solder isolating lead frame
US5825093A (en) * 1997-03-31 1998-10-20 Motorola, Inc. Attachment system and method therefor
US6169322B1 (en) 1998-03-06 2001-01-02 Cypress Semiconductor Corporation Die attach pad adapted to reduce delamination stress and method of using same
JP3274647B2 (ja) 1998-05-15 2002-04-15 日本電気株式会社 光半導体素子の実装構造
US6687987B2 (en) * 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
US6672947B2 (en) * 2001-03-13 2004-01-06 Nptest, Llc Method for global die thinning and polishing of flip-chip packaged integrated circuits
US20020182385A1 (en) * 2001-05-29 2002-12-05 Rensselaer Polytechnic Institute Atomic layer passivation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8962389B2 (en) 2013-05-30 2015-02-24 Freescale Semiconductor, Inc. Microelectronic packages including patterned die attach material and methods for the fabrication thereof

Also Published As

Publication number Publication date
US7042103B2 (en) 2006-05-09
US20040124543A1 (en) 2004-07-01
JP4436765B2 (ja) 2010-03-24
WO2004061936A1 (en) 2004-07-22
AU2003279079A1 (en) 2004-07-29
JP2006512765A (ja) 2006-04-13

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