KR20040072645A - 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 - Google Patents

하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 Download PDF

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Publication number
KR20040072645A
KR20040072645A KR10-2004-7008724A KR20047008724A KR20040072645A KR 20040072645 A KR20040072645 A KR 20040072645A KR 20047008724 A KR20047008724 A KR 20047008724A KR 20040072645 A KR20040072645 A KR 20040072645A
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South Korea
Prior art keywords
integrated circuit
circuit die
die device
array
memory
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KR10-2004-7008724A
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English (en)
Korean (ko)
Inventor
존 엠. 후펜쌀
제임스 디. 구지
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아르보 컴퍼니 엘엘피
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7867—Architectures of general purpose stored program computers comprising a single central processing unit with reconfigurable architecture
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microcomputers (AREA)
KR10-2004-7008724A 2001-12-05 2002-11-08 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈 Ceased KR20040072645A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/012,057 US6627985B2 (en) 2001-12-05 2001-12-05 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
US10/012,057 2001-12-05
PCT/US2002/035972 WO2003050694A1 (en) 2001-12-05 2002-11-08 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Publications (1)

Publication Number Publication Date
KR20040072645A true KR20040072645A (ko) 2004-08-18

Family

ID=21753168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7008724A Ceased KR20040072645A (ko) 2001-12-05 2002-11-08 하이브리드 스택형 직접 회로 다이 소자들을 포함한재구성 가능 프로세서 모듈

Country Status (7)

Country Link
US (3) US6627985B2 (https=)
EP (1) EP1461715A4 (https=)
JP (1) JP2005512229A (https=)
KR (1) KR20040072645A (https=)
AU (1) AU2002352582A1 (https=)
CA (1) CA2467821C (https=)
WO (1) WO2003050694A1 (https=)

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KR20170016450A (ko) * 2014-06-23 2017-02-13 지글루, 인크. 모듈형 적층 집적 회로를 제조하기 위한 시스템 및 방법
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KR20230021147A (ko) * 2020-06-29 2023-02-13 아르보 컴퍼니 엘엘엘피 5g 프로세서 독립형 모뎀과 함께 3d 다이 스태킹 재구성 가능 프로세서 모듈을 사용하는 모바일 iot 에지 디바이스
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