KR20040063756A - 흡착 패드 - Google Patents
흡착 패드 Download PDFInfo
- Publication number
- KR20040063756A KR20040063756A KR1020030060694A KR20030060694A KR20040063756A KR 20040063756 A KR20040063756 A KR 20040063756A KR 1020030060694 A KR1020030060694 A KR 1020030060694A KR 20030060694 A KR20030060694 A KR 20030060694A KR 20040063756 A KR20040063756 A KR 20040063756A
- Authority
- KR
- South Korea
- Prior art keywords
- support
- pad
- vacuum
- force
- supported
- Prior art date
Links
- 238000001179 sorption measurement Methods 0.000 title claims description 54
- 238000007789 sealing Methods 0.000 claims description 17
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000035699 permeability Effects 0.000 claims description 4
- 238000000638 solvent extraction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 70
- 238000012856 packing Methods 0.000 abstract description 20
- 239000011521 glass Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (2)
- 지지되는 면이 평면으로 되어 있는 대상물의 상기 지지되는 면을 상기 대상물에 의한 하중을 지지하는 지지력보다 큰 흡착력을 발생시키는 진공에 의해 흡착할 수 있는 지지면과 지지되는 피지지부를 구비한 패드부와 상기 피지지부를 지지할 수 있는 지지부를 구비한 흡착 패드에 있어서,상기 피지지부와 상기 지지부는 상기 패드부가 상기 평면에 평행한 방향으로 이동할 수 있는 동시에 상기 지지면이 경사질 수 있는 지지 관계로 되어 있고, 상기 이동의 양이 작은 이동의 범위로 되도록 규제하는 이동규제 구조부와 상기 경사의 양이 작은 경사의 범위가 되도록 규제하는 경사규제 구조부를 갖는 것을 특징으로 하는 흡착 패드.
- 제 1 항에 있어서, 상기 지지부는 상기 피지지부가 넣어져 있는 공간부를 구비하고 있고, 상기 패드부는 상기 진공을 형성할 수 있도록 상기 지지면과 도통하고 상기 피지지부 속에 형성되어 상기 공간부에 개구를 갖는 통로를 구비하고 있고, 상기 공간부에서 상기 개구의 위치로부터 상기 지지면쪽에서 상기 공간부를 칸막이하여 칸막이된 양측의 통기성을 차단하는 동시에 상기 이동과 상기 경사에 대응하여 변형할 수 있도록 형성된 실링 부재를 갖는 것을 특징으로 하는 흡착 패드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003001399A JP3917528B2 (ja) | 2003-01-07 | 2003-01-07 | 吸着パッド |
JPJP-P-2003-00001399 | 2003-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040063756A true KR20040063756A (ko) | 2004-07-14 |
KR100730241B1 KR100730241B1 (ko) | 2007-06-19 |
Family
ID=32819431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030060694A KR100730241B1 (ko) | 2003-01-07 | 2003-09-01 | 흡착 패드 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3917528B2 (ko) |
KR (1) | KR100730241B1 (ko) |
CN (1) | CN1329263C (ko) |
TW (1) | TWI309226B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100765007B1 (ko) * | 2006-03-26 | 2007-10-09 | 엘지이노텍 주식회사 | Rfid 송수신 시스템 |
KR100809718B1 (ko) * | 2007-01-15 | 2008-03-06 | 삼성전자주식회사 | 이종 칩들을 갖는 적층형 반도체 칩 패키지 및 그 제조방법 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007242787A (ja) * | 2006-03-07 | 2007-09-20 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP4770663B2 (ja) * | 2006-09-20 | 2011-09-14 | 株式会社安川電機 | 基板吸着装置およびそれを用いた基板搬送ロボット |
JP5069552B2 (ja) * | 2007-12-25 | 2012-11-07 | 株式会社リコー | 光学ユニットおよび画像読取装置ならびに画像形成装置 |
JP5379589B2 (ja) * | 2009-07-24 | 2013-12-25 | 東京エレクトロン株式会社 | 真空吸着パッド、搬送アーム及び基板搬送装置 |
JP6224437B2 (ja) * | 2013-11-26 | 2017-11-01 | 東京エレクトロン株式会社 | 基板搬送装置 |
CN103646905A (zh) * | 2013-12-11 | 2014-03-19 | 中国电子科技集团公司第二研究所 | 晶圆片识别旋转定位吸附台 |
KR101587461B1 (ko) * | 2014-03-28 | 2016-01-21 | (주)대성하이텍 | 유리판 가공용 지그 |
CN103967919B (zh) * | 2014-05-06 | 2016-02-03 | 无锡微焦科技有限公司 | 真空吸盘 |
CN104959870A (zh) * | 2015-07-31 | 2015-10-07 | 苏州市玄天环保科技有限公司 | 一种带孔平面物体吸附装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63136636U (ko) | 1987-02-27 | 1988-09-08 | ||
JP3977904B2 (ja) * | 1997-09-10 | 2007-09-19 | 松下電器産業株式会社 | 電子部品実装機の部品吸着ヘッド |
JP2001260065A (ja) * | 2000-03-17 | 2001-09-25 | Advantest Corp | 部品保持装置 |
JP4291497B2 (ja) * | 2000-05-11 | 2009-07-08 | 株式会社妙徳 | 吸着パッド |
JP3883171B2 (ja) * | 2000-06-16 | 2007-02-21 | 富士通アクセス株式会社 | 吸着パッド |
JP4547649B2 (ja) * | 2000-07-31 | 2010-09-22 | Smc株式会社 | 吸着用パッド |
-
2003
- 2003-01-07 JP JP2003001399A patent/JP3917528B2/ja not_active Expired - Fee Related
- 2003-08-07 TW TW092121669A patent/TWI309226B/zh not_active IP Right Cessation
- 2003-09-01 KR KR1020030060694A patent/KR100730241B1/ko active IP Right Grant
- 2003-09-27 CN CNB031602037A patent/CN1329263C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100765007B1 (ko) * | 2006-03-26 | 2007-10-09 | 엘지이노텍 주식회사 | Rfid 송수신 시스템 |
KR100809718B1 (ko) * | 2007-01-15 | 2008-03-06 | 삼성전자주식회사 | 이종 칩들을 갖는 적층형 반도체 칩 패키지 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
TWI309226B (en) | 2009-05-01 |
TW200412319A (en) | 2004-07-16 |
CN1329263C (zh) | 2007-08-01 |
JP3917528B2 (ja) | 2007-05-23 |
CN1517286A (zh) | 2004-08-04 |
JP2004209612A (ja) | 2004-07-29 |
KR100730241B1 (ko) | 2007-06-19 |
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