KR20040030536A - 가요성 프린트 기판용 폴리이미드 필름 및 이를 사용한가요성 프린트 기판 - Google Patents

가요성 프린트 기판용 폴리이미드 필름 및 이를 사용한가요성 프린트 기판 Download PDF

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Publication number
KR20040030536A
KR20040030536A KR10-2003-7011885A KR20037011885A KR20040030536A KR 20040030536 A KR20040030536 A KR 20040030536A KR 20037011885 A KR20037011885 A KR 20037011885A KR 20040030536 A KR20040030536 A KR 20040030536A
Authority
KR
South Korea
Prior art keywords
flexible printed
film
printed circuit
polyimide
polyimide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7011885A
Other languages
English (en)
Korean (ko)
Inventor
히사야스 가네시로
기요까즈 아까호리
Original Assignee
가네가후치 가가쿠 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19123345&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20040030536(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 가네가후치 가가쿠 고교 가부시키가이샤 filed Critical 가네가후치 가가쿠 고교 가부시키가이샤
Publication of KR20040030536A publication Critical patent/KR20040030536A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR10-2003-7011885A 2001-09-28 2002-09-27 가요성 프린트 기판용 폴리이미드 필름 및 이를 사용한가요성 프린트 기판 Ceased KR20040030536A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001303219 2001-09-28
JPJP-P-2001-00303219 2001-09-28
PCT/JP2002/010117 WO2003030598A1 (en) 2001-09-28 2002-09-27 Polyimide film for flexible printed board and flexible printed board using the same

Publications (1)

Publication Number Publication Date
KR20040030536A true KR20040030536A (ko) 2004-04-09

Family

ID=19123345

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7011885A Ceased KR20040030536A (ko) 2001-09-28 2002-09-27 가요성 프린트 기판용 폴리이미드 필름 및 이를 사용한가요성 프린트 기판

Country Status (6)

Country Link
US (1) US7018704B2 (https=)
JP (1) JPWO2003030598A1 (https=)
KR (1) KR20040030536A (https=)
CN (1) CN1283132C (https=)
TW (1) TWI304079B (https=)
WO (1) WO2003030598A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002102882A1 (en) * 2001-06-15 2002-12-27 Kaneka Corporation Semiconductive polyimide film and process for production thereof
JP2006310643A (ja) * 2005-04-28 2006-11-09 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2007208087A (ja) * 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
US8323798B2 (en) 2007-09-28 2012-12-04 Tri-Star Laminates, Inc. Systems and methods for drilling holes in printed circuit boards
JP2009170891A (ja) * 2007-12-07 2009-07-30 Integral Technology Inc リジッドプリント回路板用の改良された絶縁層
JP5275001B2 (ja) * 2008-12-10 2013-08-28 日本メクトロン株式会社 多層フレキシブル配線板の製造方法
WO2011063204A1 (en) * 2009-11-20 2011-05-26 E. I. Du Pont De Nemours And Company Thermally and dimensionally stable polyimide films and methods relating thereto
JP2012049368A (ja) * 2010-08-27 2012-03-08 Arisawa Mfg Co Ltd カバーレイフィルム及びこれを用いたフレキシブルプリント配線板
TWI535766B (zh) * 2010-10-28 2016-06-01 Kaneka Corp Method for manufacturing conductive polyimide film
KR102157067B1 (ko) 2013-05-31 2020-09-18 가부시키가이샤 가네카 절연 피복 재료 및 그의 용도
KR102309828B1 (ko) 2013-12-13 2021-10-08 이 아이 듀폰 디 네모아 앤드 캄파니 다층 필름
DE112014005737B4 (de) 2013-12-17 2021-12-30 E.I. Du Pont De Nemours And Company Mehrschichtfolie, verfahren zum herstellen einer mehrschichtfolie und verfahren zum verringern der farbstoffmenge in einer mehrschichtfolie und erlangen eines l*- farbraums von weniger als 30 und eines 60 ° -glanzwerts von weniger als 10
CN107004474B (zh) 2014-11-27 2019-11-29 株式会社钟化 耐磨耗性优越的绝缘包覆材料
EP3226259B1 (en) * 2014-11-27 2024-10-02 Kaneka Corporation Insulating coating material having excellent wear resistance
US9481150B2 (en) 2014-12-10 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
CN109575831A (zh) * 2018-11-20 2019-04-05 深圳市弘海电子材料技术有限公司 低反弹力覆盖膜及其制备方法
GB2642986A (en) * 2024-07-25 2026-02-04 Sumitomo Chemical Co Thermally conductive composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066360B2 (ja) 1985-06-14 1994-01-26 日東電工株式会社 ポリイミド−金属箔複合フイルム
US5432001A (en) * 1990-01-30 1995-07-11 Trw Inc. Concentrated prepolymer composition useful for forming polyimide articles
JP3356568B2 (ja) 1994-11-30 2002-12-16 鐘淵化学工業株式会社 新規なフレキシブル銅張積層板
JPH11227099A (ja) 1998-02-10 1999-08-24 Mitsubishi Chemical Corp 耐熱性基板
JPH11298102A (ja) 1998-04-10 1999-10-29 Unitika Ltd 二層フレキシブルプリント基板及びその製造方法
JP2000299359A (ja) 1999-04-16 2000-10-24 Kanegafuchi Chem Ind Co Ltd Ｔａｂ用テープ
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad

Also Published As

Publication number Publication date
WO2003030598A1 (en) 2003-04-10
CN1283132C (zh) 2006-11-01
TWI304079B (https=) 2008-12-11
US20040081808A1 (en) 2004-04-29
US7018704B2 (en) 2006-03-28
CN1504067A (zh) 2004-06-09
JPWO2003030598A1 (ja) 2005-01-20

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