KR20040013559A - 테이프 보호 장치 - Google Patents
테이프 보호 장치 Download PDFInfo
- Publication number
- KR20040013559A KR20040013559A KR1020020046554A KR20020046554A KR20040013559A KR 20040013559 A KR20040013559 A KR 20040013559A KR 1020020046554 A KR1020020046554 A KR 1020020046554A KR 20020046554 A KR20020046554 A KR 20020046554A KR 20040013559 A KR20040013559 A KR 20040013559A
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- wheel
- reinforcing material
- recovery
- supply
- Prior art date
Links
- 238000011084 recovery Methods 0.000 claims abstract description 22
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 3
- 239000012779 reinforcing material Substances 0.000 claims description 24
- 230000003068 static effect Effects 0.000 claims description 16
- 230000005611 electricity Effects 0.000 claims description 15
- 230000002787 reinforcement Effects 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 239000003351 stiffener Substances 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Elimination Of Static Electricity (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (5)
- 공급휠과;상기 공급휠과 소정간격 이격되어 설치된 회수휠과;상기 공급휠과 상기 회수횔 사이에서 무한 회전되도록 무한 궤도로서 상기 공급휠에서 상기 회수휠 사이의 구간에서 회로테이프의 일면에 부착어지는 보강재;를 구비하는 테이프 보호 장치.
- 제 1항에 있어서,상기 보강재는 상기 회로 테이프에 형성되어지는 스프로킷 홀에 대응하는 홀이 형성되어 있는 것을 특징으로 하는 테이프 보호 장치.
- 제 1항에 있어서,상기 보강재가 소정의 위치에서 상기 회로 테이프와 원활하게 분리되도록 상기 회수휠 상류 일측에 분리수단을 더 구비하는 테이프 보호 장치.
- 제 1항 또는 제 3항에 있어서,상기 보강재는 외면에 접착제가 도포되어서 상기 테이프에의 부착이 가능한 것을 특징으로 하는 테이프 보호 장치.
- 제 1항 또는 제 3항에 있어서,상기 보강재에 정전기를 발생시켜 상기 회로 테이프가 상기 보강재에 부착되도록 하는 정전기 발생수단을 더 구비하는 테이프 보호 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020046554A KR20040013559A (ko) | 2002-08-07 | 2002-08-07 | 테이프 보호 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020046554A KR20040013559A (ko) | 2002-08-07 | 2002-08-07 | 테이프 보호 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20040013559A true KR20040013559A (ko) | 2004-02-14 |
Family
ID=37320876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020046554A KR20040013559A (ko) | 2002-08-07 | 2002-08-07 | 테이프 보호 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20040013559A (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63160965A (ja) * | 1986-12-24 | 1988-07-04 | Ckd Corp | 包装機におけるフィルムの設定方法 |
JPH0248958A (ja) * | 1988-05-12 | 1990-02-19 | Canon Inc | インクジェット記録装置 |
JPH03221170A (ja) * | 1989-11-16 | 1991-09-30 | Nkk Corp | コンベアベルトの補修方法 |
JPH0613729A (ja) * | 1992-06-25 | 1994-01-21 | Seiko Epson Corp | フレキシブル回路基板製造装置 |
KR20000014026U (ko) * | 1998-12-29 | 2000-07-15 | 김영환 | 티·시·피 제조시의 폿팅 공정용 테이프 이송장치 |
-
2002
- 2002-08-07 KR KR1020020046554A patent/KR20040013559A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63160965A (ja) * | 1986-12-24 | 1988-07-04 | Ckd Corp | 包装機におけるフィルムの設定方法 |
JPH0248958A (ja) * | 1988-05-12 | 1990-02-19 | Canon Inc | インクジェット記録装置 |
JPH03221170A (ja) * | 1989-11-16 | 1991-09-30 | Nkk Corp | コンベアベルトの補修方法 |
JPH0613729A (ja) * | 1992-06-25 | 1994-01-21 | Seiko Epson Corp | フレキシブル回路基板製造装置 |
KR20000014026U (ko) * | 1998-12-29 | 2000-07-15 | 김영환 | 티·시·피 제조시의 폿팅 공정용 테이프 이송장치 |
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Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20020807 |
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Patent event code: PA02012R01D Patent event date: 20070727 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20020807 Comment text: Patent Application |
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Comment text: Notification of reason for refusal Patent event date: 20081117 Patent event code: PE09021S01D |
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PE0601 | Decision on rejection of patent |
Patent event date: 20090130 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20081117 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |