KR20040012846A - 광역스펙트럼 테르븀을 포함한 가넷 인광물질과 그것과결합한 백색광원 - Google Patents

광역스펙트럼 테르븀을 포함한 가넷 인광물질과 그것과결합한 백색광원 Download PDF

Info

Publication number
KR20040012846A
KR20040012846A KR10-2003-7015070A KR20037015070A KR20040012846A KR 20040012846 A KR20040012846 A KR 20040012846A KR 20037015070 A KR20037015070 A KR 20037015070A KR 20040012846 A KR20040012846 A KR 20040012846A
Authority
KR
South Korea
Prior art keywords
range
approximately
terbium
phosphor
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7015070A
Other languages
English (en)
Korean (ko)
Inventor
스리바스타바아록마니
세트루아난트아큐트
코만조홀리안
Original Assignee
젤코어 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 젤코어 엘엘씨 filed Critical 젤코어 엘엘씨
Publication of KR20040012846A publication Critical patent/KR20040012846A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7767—Chalcogenides
    • C09K11/7769—Oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7787—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Lasers (AREA)
  • Led Device Packages (AREA)
KR10-2003-7015070A 2001-06-01 2002-05-29 광역스펙트럼 테르븀을 포함한 가넷 인광물질과 그것과결합한 백색광원 Ceased KR20040012846A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/681,522 2001-06-01
US09/681,522 US6596195B2 (en) 2001-06-01 2001-06-01 Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same
PCT/US2002/017307 WO2002099902A1 (en) 2001-06-01 2002-05-29 Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same

Publications (1)

Publication Number Publication Date
KR20040012846A true KR20040012846A (ko) 2004-02-11

Family

ID=24735622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7015070A Ceased KR20040012846A (ko) 2001-06-01 2002-05-29 광역스펙트럼 테르븀을 포함한 가넷 인광물질과 그것과결합한 백색광원

Country Status (9)

Country Link
US (1) US6596195B2 (enExample)
EP (1) EP1393385B1 (enExample)
JP (1) JP2004529252A (enExample)
KR (1) KR20040012846A (enExample)
CN (1) CN1269233C (enExample)
AT (1) ATE385045T1 (enExample)
DE (1) DE60224798T2 (enExample)
TW (1) TWI302937B (enExample)
WO (1) WO2002099902A1 (enExample)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20023590U1 (de) * 1999-07-23 2005-02-24 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff für Lichtquellen und zugehörige Lichtquelle
ATE279089T1 (de) 1999-07-23 2004-10-15 Osram Opto Semiconductors Gmbh Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle
CN1314993C (zh) * 2000-12-15 2007-05-09 科比恩公司 显示器壳体
TWI282357B (en) * 2001-05-29 2007-06-11 Nantex Industry Co Ltd Process for the preparation of pink light-emitting diode with high brightness
CN1156553C (zh) * 2001-09-27 2004-07-07 中国科学院长春应用化学研究所 稀土发光材料的制备方法
US7008558B2 (en) * 2001-10-11 2006-03-07 General Electric Company Terbium or lutetium containing scintillator compositions having increased resistance to radiation damage
US6630077B2 (en) * 2001-10-11 2003-10-07 General Electric Company Terbium- or lutetium - containing garnet phosphors and scintillators for detection of high-energy radiation
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7473995B2 (en) * 2002-03-25 2009-01-06 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
CN1659664A (zh) * 2002-06-07 2005-08-24 独立行政法人科学技术振兴机构 铁磁性ⅳ族系半导体、铁磁性ⅲ －ⅴ族系化合物半导体或铁磁性ⅱ －ⅵ族系化合物半导体 ,及此等半导体的铁磁性的调整方法
US6765237B1 (en) * 2003-01-15 2004-07-20 Gelcore, Llc White light emitting device based on UV LED and phosphor blend
US6936857B2 (en) * 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
TWI229125B (en) * 2003-03-28 2005-03-11 Nantex Industry Co Ltd Fluorescent material of terbium aluminum garnet and manufacturing method therefor
US7184111B2 (en) * 2003-04-28 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor for use in white semiconductor light sources and a white light source utilizing the same
JP2005005482A (ja) * 2003-06-12 2005-01-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置及びそれを用いたカラー表示装置
KR100512600B1 (ko) * 2003-06-23 2005-09-07 럭스피아 주식회사 사마륨을 포함하는 알루미늄산이트륨계 적색형광체를 갖는발광다이오드
US7088038B2 (en) * 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US20050019241A1 (en) * 2003-07-23 2005-01-27 Lyons Robert Joseph Preparation of rare earth ceramic garnet
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
JP2005064233A (ja) 2003-08-12 2005-03-10 Stanley Electric Co Ltd 波長変換型ｌｅｄ
TWI233697B (en) * 2003-08-28 2005-06-01 Genesis Photonics Inc AlInGaN light-emitting diode with wide spectrum and solid-state white light device
WO2005022032A1 (ja) * 2003-08-28 2005-03-10 Mitsubishi Chemical Corporation 発光装置及び蛍光体
US6841804B1 (en) * 2003-10-27 2005-01-11 Formosa Epitaxy Incorporation Device of white light-emitting diode
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7252787B2 (en) * 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US20050099786A1 (en) * 2003-11-07 2005-05-12 Ru-Shi Liu Yellow phosphor material and white light-emitting device using the same
DE10360546A1 (de) * 2003-12-22 2005-07-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
TWI229465B (en) 2004-03-02 2005-03-11 Genesis Photonics Inc Single chip white light component
JP4503321B2 (ja) * 2004-03-19 2010-07-14 根本特殊化学株式会社 蛍光体
US7427366B2 (en) * 2004-07-06 2008-09-23 Sarnoff Corporation Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
JP4747726B2 (ja) * 2004-09-09 2011-08-17 豊田合成株式会社 発光装置
KR100485673B1 (ko) * 2004-10-11 2005-04-27 씨엠에스테크놀로지(주) 백색 발광장치
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
JP4779384B2 (ja) * 2005-02-28 2011-09-28 三菱化学株式会社 Ｃｅ付活希土類アルミン酸塩系蛍光体及びこれを用いた発光素子
WO2006093015A1 (ja) * 2005-02-28 2006-09-08 Mitsubishi Chemical Corporation 蛍光体及びその製造方法並びにその応用
US7274045B2 (en) * 2005-03-17 2007-09-25 Lumination Llc Borate phosphor materials for use in lighting applications
US7276183B2 (en) * 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
US7252789B2 (en) * 2005-03-31 2007-08-07 General Electric Company High-density scintillators for imaging system and method of making same
WO2006113345A2 (en) * 2005-04-14 2006-10-26 Duke University Bright visible wavelength luminescent nanostructures and methods of making and devices for using the same
US7329371B2 (en) * 2005-04-19 2008-02-12 Lumination Llc Red phosphor for LED based lighting
CN100385693C (zh) * 2005-08-18 2008-04-30 中国科学院半导体研究所 用等离子体处理提高硅基晶体薄膜发光的方法
DE102005043623A1 (de) * 2005-09-13 2007-03-15 Schott Ag Herstellung hochhomogener spannungsarmer Einkristalle durch Ziehen, eine Vorrichtung hierfür sowie die Verwendung solcher Kristalle
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US8906262B2 (en) * 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
US7427577B2 (en) * 2006-04-06 2008-09-23 Nanocerox Inc Sintered polycrystalline terbium aluminum garnet and use thereof in magneto-optical devices
CN100455536C (zh) * 2006-04-07 2009-01-28 中国科学院上海硅酸盐研究所 一种镥铝石榴石基透明陶瓷及其制备方法
US20070262294A1 (en) * 2006-05-15 2007-11-15 X-Rite, Incorporated Light source including quantum dot material and apparatus including same
JP2010506006A (ja) 2006-10-03 2010-02-25 ライトスケイプ マテリアルズ，インク． 金属ケイ酸塩ハロゲン化物燐光体及びそれを使用するｌｅｄ照明デバイス
US20080099388A1 (en) * 2006-10-31 2008-05-01 Honeywell International, Inc. Combination filter for a lubrication system
TW200823277A (en) * 2006-11-21 2008-06-01 Cai Chen Xiang Mian A light emission diode and phosphor and organic thin film
US7959827B2 (en) * 2007-12-12 2011-06-14 General Electric Company Persistent phosphor
US8333907B2 (en) 2007-01-17 2012-12-18 Utc Fire & Security Corporation Articles using persistent phosphors
DE102007010719A1 (de) * 2007-03-06 2008-09-11 Merck Patent Gmbh Leuchtstoffe bestehend aus dotierten Granaten für pcLEDs
US7708968B2 (en) * 2007-03-26 2010-05-04 General Electric Company Nano-scale metal oxide, oxyhalide and oxysulfide scintillation materials and methods for making same
US7625502B2 (en) * 2007-03-26 2009-12-01 General Electric Company Nano-scale metal halide scintillation materials and methods for making same
US7608829B2 (en) * 2007-03-26 2009-10-27 General Electric Company Polymeric composite scintillators and method for making same
JP2008283155A (ja) * 2007-05-14 2008-11-20 Sharp Corp 発光装置、照明機器および液晶表示装置
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
US8545723B2 (en) * 2007-12-12 2013-10-01 General Electric Company Persistent phosphor
CN101487581A (zh) * 2008-01-17 2009-07-22 富士迈半导体精密工业（上海）有限公司 发光二极管光源模组
DE102008032299B4 (de) 2008-07-09 2021-12-02 Osram Gmbh Verfahren zur Herstellung eines Granat-Leuchtstoffs
US8456082B2 (en) 2008-12-01 2013-06-04 Ifire Ip Corporation Surface-emission light source with uniform illumination
JP5269634B2 (ja) * 2009-02-02 2013-08-21 株式会社東芝 固体シンチレータ、放射線検出器、放射線検査装置、固体シンチレータ製造用粉末および固体シンチレータの製造方法
WO2010119655A1 (ja) * 2009-04-17 2010-10-21 パナソニック株式会社 蛍光体、発光装置およびプラズマディスプレイパネル
WO2011049102A1 (ja) * 2009-10-21 2011-04-28 株式会社フジクラ 単結晶、その製造方法、光アイソレータ及びこれを用いた光加工器
DE102010028246A1 (de) * 2010-04-27 2011-10-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
WO2012053924A1 (ru) 2010-10-22 2012-04-26 Vishnyakov Anatoly Vasilyevich Люминесцирующий материал для твердотельных источников белого света
EP2634234B1 (en) * 2010-10-29 2017-12-06 National Institute for Materials Science Light-emitting device
CN102820402B (zh) * 2011-06-08 2015-04-29 展晶科技(深圳)有限公司 半导体封装结构
DE102011113802A1 (de) 2011-09-20 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
KR101762818B1 (ko) * 2013-04-09 2017-07-28 대주전자재료 주식회사 백색 발광다이오드용 형광체 및 이의 제조방법
CN106590658A (zh) * 2017-01-22 2017-04-26 清远市德晟嘉恒能源环保工程有限责任公司 一种白光led用的高热稳定性荧光粉及其制备方法
CN118202019A (zh) * 2021-08-20 2024-06-14 亮锐有限责任公司 在1600-2200nm波长范围内发射的磷光体成分和短波长红外发射pcLED

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493629B1 (enExample) * 1969-10-13 1974-01-28
JPS493631B1 (enExample) * 1969-10-16 1974-01-28
GB1500902A (en) 1974-01-17 1978-02-15 Thorn Electrical Ind Ltd Phosphors and their preparation
JPS59105075A (ja) 1982-12-07 1984-06-18 Toshiba Corp 蛍光体及びこれを用いた単色表示陰極線管
US4550256A (en) 1983-10-17 1985-10-29 At&T Bell Laboratories Visual display system utilizing high luminosity single crystal garnet material
US4631144A (en) 1985-03-25 1986-12-23 General Electric Company Aluminate phosphor
US6013199A (en) * 1997-03-04 2000-01-11 Symyx Technologies Phosphor materials
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
DE20023590U1 (de) 1999-07-23 2005-02-24 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff für Lichtquellen und zugehörige Lichtquelle
ATE279089T1 (de) 1999-07-23 2004-10-15 Osram Opto Semiconductors Gmbh Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle
DE19960554A1 (de) * 1999-09-09 2001-03-15 Takata Europ Gmbh Sicherheitsgurtvorrichtung für Fahrzeuge
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10026435A1 (de) * 2000-05-29 2002-04-18 Osram Opto Semiconductors Gmbh Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED

Also Published As

Publication number Publication date
WO2002099902A1 (en) 2002-12-12
EP1393385A1 (en) 2004-03-03
EP1393385B1 (en) 2008-01-23
DE60224798D1 (de) 2008-03-13
TWI302937B (en) 2008-11-11
US20020195587A1 (en) 2002-12-26
ATE385045T1 (de) 2008-02-15
CN1513209A (zh) 2004-07-14
JP2004529252A (ja) 2004-09-24
CN1269233C (zh) 2006-08-09
US6596195B2 (en) 2003-07-22
DE60224798T2 (de) 2009-01-22

Similar Documents

Publication Publication Date Title
KR20040012846A (ko) 광역스펙트럼 테르븀을 포함한 가넷 인광물질과 그것과결합한 백색광원
KR100951066B1 (ko) 새로운 알루미네이트계 그린 형광체
KR100869396B1 (ko) 알칼리 토금속 및 ⅲａ족 금속의 산화물을 함유하는 형광체 및 그를 포함하는 광원
JP2005303289A (ja) 燐光体変換型発光デバイス
JP5461752B2 (ja) アルカリ土類金属及び１３族金属の酸化物を含む蛍光体及び該蛍光体を組み込む光源
US7022263B2 (en) Europium-activated phosphors containing oxides of rare-earth and group-IIIB metals and method of making the same
CN102517016A (zh) 用于蓝光激发的固溶体荧光发光材料及其制备方法
KR100458126B1 (ko) 장파장 자외선용 녹색 형광체 및 그의 제조 방법
US20030001495A1 (en) Pink light-emitting device
CN117701279A (zh) 紫光激发类太阳光led用蓝色荧光材料及其制备方法与应用
CN101899304B (zh) 一种掺铕的锶铝硅系氮氧化物复合荧光粉及其制备方法
CN101448915B (zh) 无机发光材料、涂敷用无机发光材料组合物、制备无机发光材料的方法和发光器件
CN102154006B (zh) 荧光体、发光装置及白色发光二极管
CN104962286A (zh) 石榴石结构的复相荧光材料及其制备方法
KR101072572B1 (ko) 고체 조명용 적색 형광체 및 그 제조방법
CN104194781B (zh) 一种单一基质余辉颜色可调的长余辉发光材料及制备方法
EP1258520A2 (en) Quantum-splitting oxide-based phosphors
CN110283588B (zh) 一种照明显示用白光led用荧光粉及其制备和应用
CN116396754B (zh) 一种宽谱激发的窄带绿光氮氧化物荧光粉
JP3754701B2 (ja) 蛍光体及びそれを使用した発光素子
KR100668796B1 (ko) 훈타이트계 형광체 및 이를 이용한 백색 발광 장치
US20050205874A1 (en) Phosphor material and white light-emitting device using the same
KR20150088668A (ko) 산질화물계 황색 형광체 및 이를 포함하는 발광장치
HK1053140A (en) Yttrium aluminum garnet fluorescent powder and its preparation and uses

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20031119

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20070518

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20080331

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20090128

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20080331

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I