DE60224798D1 - Breitbandige terbium-granat-leuchtstoffe und damit ausgerüstete weisslichtquellen - Google Patents

Breitbandige terbium-granat-leuchtstoffe und damit ausgerüstete weisslichtquellen

Info

Publication number
DE60224798D1
DE60224798D1 DE60224798T DE60224798T DE60224798D1 DE 60224798 D1 DE60224798 D1 DE 60224798D1 DE 60224798 T DE60224798 T DE 60224798T DE 60224798 T DE60224798 T DE 60224798T DE 60224798 D1 DE60224798 D1 DE 60224798D1
Authority
DE
Germany
Prior art keywords
white light
terbium
fluores
granite
broadband
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60224798T
Other languages
English (en)
Other versions
DE60224798T2 (de
Inventor
Alok Mani Srivastava
Anant Achyut Setlur
Holly Ann Comanzo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Gelcore LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gelcore LLC filed Critical Gelcore LLC
Application granted granted Critical
Publication of DE60224798D1 publication Critical patent/DE60224798D1/de
Publication of DE60224798T2 publication Critical patent/DE60224798T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7767—Chalcogenides
    • C09K11/7769—Oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7787—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Lasers (AREA)
  • Led Device Packages (AREA)
DE60224798T 2001-06-01 2002-05-29 Breitbandige terbium-granat-leuchtstoffe und damit ausgerüstete weisslichtquellen Expired - Fee Related DE60224798T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US681522 2001-06-01
US09/681,522 US6596195B2 (en) 2001-06-01 2001-06-01 Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same
PCT/US2002/017307 WO2002099902A1 (en) 2001-06-01 2002-05-29 Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same

Publications (2)

Publication Number Publication Date
DE60224798D1 true DE60224798D1 (de) 2008-03-13
DE60224798T2 DE60224798T2 (de) 2009-01-22

Family

ID=24735622

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60224798T Expired - Fee Related DE60224798T2 (de) 2001-06-01 2002-05-29 Breitbandige terbium-granat-leuchtstoffe und damit ausgerüstete weisslichtquellen

Country Status (9)

Country Link
US (1) US6596195B2 (de)
EP (1) EP1393385B1 (de)
JP (1) JP2004529252A (de)
KR (1) KR20040012846A (de)
CN (1) CN1269233C (de)
AT (1) ATE385045T1 (de)
DE (1) DE60224798T2 (de)
TW (1) TWI302937B (de)
WO (1) WO2002099902A1 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378556A3 (de) * 1999-07-23 2004-01-28 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff insbesondere für Lichtquellen und zugehörige Lichtquelle
EP1471775B9 (de) 1999-07-23 2011-04-13 OSRAM Opto Semiconductors GmbH Lichtquelle mit einer Leuchtstoffanordnung und Vergussmasse mit einer Leuchtstoffanordnung
CN1314993C (zh) * 2000-12-15 2007-05-09 科比恩公司 显示器壳体
TWI282357B (en) * 2001-05-29 2007-06-11 Nantex Industry Co Ltd Process for the preparation of pink light-emitting diode with high brightness
CN1156553C (zh) * 2001-09-27 2004-07-07 中国科学院长春应用化学研究所 稀土发光材料的制备方法
US6630077B2 (en) * 2001-10-11 2003-10-07 General Electric Company Terbium- or lutetium - containing garnet phosphors and scintillators for detection of high-energy radiation
US7008558B2 (en) * 2001-10-11 2006-03-07 General Electric Company Terbium or lutetium containing scintillator compositions having increased resistance to radiation damage
US7473995B2 (en) * 2002-03-25 2009-01-06 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
EP1536432A1 (de) * 2002-06-07 2005-06-01 Japan Science and Technology Agency Ferromagnetischer, auf der iv-gruppe basierender halbleiter, ferromagnetischer, auf der iii-v-gruppe basierender zusammengesetzter halbleiter oder ferromagnetischer, auf der ii-iv-gruppe basierender zusammengesetzter halbleiter und verfahren zur einstellung ihrer ferromagnetischen eigenschaften
US6765237B1 (en) * 2003-01-15 2004-07-20 Gelcore, Llc White light emitting device based on UV LED and phosphor blend
US6936857B2 (en) * 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
US7824937B2 (en) * 2003-03-10 2010-11-02 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
TWI229125B (en) * 2003-03-28 2005-03-11 Nantex Industry Co Ltd Fluorescent material of terbium aluminum garnet and manufacturing method therefor
US7184111B2 (en) * 2003-04-28 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor for use in white semiconductor light sources and a white light source utilizing the same
JP2005005482A (ja) * 2003-06-12 2005-01-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置及びそれを用いたカラー表示装置
KR100512600B1 (ko) * 2003-06-23 2005-09-07 럭스피아 주식회사 사마륨을 포함하는 알루미늄산이트륨계 적색형광체를 갖는발광다이오드
US7088038B2 (en) * 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US20050019241A1 (en) * 2003-07-23 2005-01-27 Lyons Robert Joseph Preparation of rare earth ceramic garnet
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
JP2005064233A (ja) 2003-08-12 2005-03-10 Stanley Electric Co Ltd 波長変換型ｌｅｄ
WO2005022032A1 (ja) * 2003-08-28 2005-03-10 Mitsubishi Chemical Corporation 発光装置及び蛍光体
TWI233697B (en) * 2003-08-28 2005-06-01 Genesis Photonics Inc AlInGaN light-emitting diode with wide spectrum and solid-state white light device
US6841804B1 (en) * 2003-10-27 2005-01-11 Formosa Epitaxy Incorporation Device of white light-emitting diode
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7252787B2 (en) * 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US20050099786A1 (en) * 2003-11-07 2005-05-12 Ru-Shi Liu Yellow phosphor material and white light-emitting device using the same
DE10360546A1 (de) * 2003-12-22 2005-07-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
TWI229465B (en) 2004-03-02 2005-03-11 Genesis Photonics Inc Single chip white light component
JP4503321B2 (ja) * 2004-03-19 2010-07-14 根本特殊化学株式会社 蛍光体
EP1769050B1 (de) * 2004-07-06 2013-01-16 Lightscape Materials Inc. Effiziente grünemittierende leuchtstoffe und kombinationen mit rotemittierenden leuchtstoffen
JP4747726B2 (ja) * 2004-09-09 2011-08-17 豊田合成株式会社 発光装置
KR100485673B1 (ko) * 2004-10-11 2005-04-27 씨엠에스테크놀로지(주) 백색 발광장치
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US20090008663A1 (en) * 2005-02-28 2009-01-08 Mitshubishi Chemcial Phosphor and method for production thereof, and application thereof
JP4779384B2 (ja) * 2005-02-28 2011-09-28 三菱化学株式会社 Ｃｅ付活希土類アルミン酸塩系蛍光体及びこれを用いた発光素子
US7274045B2 (en) * 2005-03-17 2007-09-25 Lumination Llc Borate phosphor materials for use in lighting applications
US7276183B2 (en) * 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
US7252789B2 (en) * 2005-03-31 2007-08-07 General Electric Company High-density scintillators for imaging system and method of making same
WO2006113345A2 (en) * 2005-04-14 2006-10-26 Duke University Bright visible wavelength luminescent nanostructures and methods of making and devices for using the same
US7329371B2 (en) * 2005-04-19 2008-02-12 Lumination Llc Red phosphor for LED based lighting
CN100385693C (zh) * 2005-08-18 2008-04-30 中国科学院半导体研究所 用等离子体处理提高硅基晶体薄膜发光的方法
DE102005043623A1 (de) * 2005-09-13 2007-03-15 Schott Ag Herstellung hochhomogener spannungsarmer Einkristalle durch Ziehen, eine Vorrichtung hierfür sowie die Verwendung solcher Kristalle
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US8906262B2 (en) * 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
US7427577B2 (en) * 2006-04-06 2008-09-23 Nanocerox Inc Sintered polycrystalline terbium aluminum garnet and use thereof in magneto-optical devices
CN100455536C (zh) * 2006-04-07 2009-01-28 中国科学院上海硅酸盐研究所 一种镥铝石榴石基透明陶瓷及其制备方法
US20070262294A1 (en) * 2006-05-15 2007-11-15 X-Rite, Incorporated Light source including quantum dot material and apparatus including same
CN101605867B (zh) 2006-10-03 2013-05-08 渲染材料公司 金属硅酸盐卤化物磷光体以及使用它们的led照明器件
US20080099388A1 (en) * 2006-10-31 2008-05-01 Honeywell International, Inc. Combination filter for a lubrication system
TW200823277A (en) * 2006-11-21 2008-06-01 Cai Chen Xiang Mian A light emission diode and phosphor and organic thin film
US8333907B2 (en) 2007-01-17 2012-12-18 Utc Fire & Security Corporation Articles using persistent phosphors
US7959827B2 (en) * 2007-12-12 2011-06-14 General Electric Company Persistent phosphor
DE102007010719A1 (de) * 2007-03-06 2008-09-11 Merck Patent Gmbh Leuchtstoffe bestehend aus dotierten Granaten für pcLEDs
US7625502B2 (en) * 2007-03-26 2009-12-01 General Electric Company Nano-scale metal halide scintillation materials and methods for making same
US7708968B2 (en) * 2007-03-26 2010-05-04 General Electric Company Nano-scale metal oxide, oxyhalide and oxysulfide scintillation materials and methods for making same
US7608829B2 (en) * 2007-03-26 2009-10-27 General Electric Company Polymeric composite scintillators and method for making same
JP2008283155A (ja) * 2007-05-14 2008-11-20 Sharp Corp 発光装置、照明機器および液晶表示装置
US7847309B2 (en) * 2007-07-16 2010-12-07 GE Lighting Solutions, LLC Red line emitting complex fluoride phosphors activated with Mn4+
US8545723B2 (en) * 2007-12-12 2013-10-01 General Electric Company Persistent phosphor
CN101487581A (zh) * 2008-01-17 2009-07-22 富士迈半导体精密工业（上海）有限公司 发光二极管光源模组
DE102008032299B4 (de) 2008-07-09 2021-12-02 Osram Gmbh Verfahren zur Herstellung eines Granat-Leuchtstoffs
US8456082B2 (en) 2008-12-01 2013-06-04 Ifire Ip Corporation Surface-emission light source with uniform illumination
JP5269634B2 (ja) * 2009-02-02 2013-08-21 株式会社東芝 固体シンチレータ、放射線検出器、放射線検査装置、固体シンチレータ製造用粉末および固体シンチレータの製造方法
US8183778B2 (en) * 2009-04-17 2012-05-22 Panasonic Corporation Stoichiometric phosphor, and light emitting device and plasma display panel utilizing the phosphor
RU2527082C2 (ru) * 2009-10-21 2014-08-27 Фуджикура Лтд. Монокристалл, способ его изготовления, оптический изолятор и использующий его оптический процессор
DE102010028246A1 (de) * 2010-04-27 2011-10-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
US9399733B2 (en) 2010-10-22 2016-07-26 Anatoly Vasilyevich Vishnyakov Luminescent material for solid-state sources of white light
US9112123B2 (en) * 2010-10-29 2015-08-18 National Institute For Materials Science Light-emitting device
CN102820402B (zh) * 2011-06-08 2015-04-29 展晶科技(深圳)有限公司 半导体封装结构
DE102011113802A1 (de) * 2011-09-20 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen
US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
KR101762818B1 (ko) * 2013-04-09 2017-07-28 대주전자재료 주식회사 백색 발광다이오드용 형광체 및 이의 제조방법
CN106590658A (zh) * 2017-01-22 2017-04-26 清远市德晟嘉恒能源环保工程有限责任公司 一种白光led用的高热稳定性荧光粉及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493629B1 (de) * 1969-10-13 1974-01-28
JPS493631B1 (de) * 1969-10-16 1974-01-28
GB1500902A (en) 1974-01-17 1978-02-15 Thorn Electrical Ind Ltd Phosphors and their preparation
JPS59105075A (ja) 1982-12-07 1984-06-18 Toshiba Corp 蛍光体及びこれを用いた単色表示陰極線管
US4550256A (en) 1983-10-17 1985-10-29 At&T Bell Laboratories Visual display system utilizing high luminosity single crystal garnet material
US4631144A (en) 1985-03-25 1986-12-23 General Electric Company Aluminate phosphor
US6013199A (en) * 1997-03-04 2000-01-11 Symyx Technologies Phosphor materials
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
EP1471775B9 (de) 1999-07-23 2011-04-13 OSRAM Opto Semiconductors GmbH Lichtquelle mit einer Leuchtstoffanordnung und Vergussmasse mit einer Leuchtstoffanordnung
EP1378556A3 (de) 1999-07-23 2004-01-28 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff insbesondere für Lichtquellen und zugehörige Lichtquelle
DE19960554A1 (de) * 1999-09-09 2001-03-15 Takata Europ Gmbh Sicherheitsgurtvorrichtung für Fahrzeuge
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10026435A1 (de) * 2000-05-29 2002-04-18 Osram Opto Semiconductors Gmbh Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED

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US20020195587A1 (en) 2002-12-26
EP1393385A1 (de) 2004-03-03
EP1393385B1 (de) 2008-01-23
KR20040012846A (ko) 2004-02-11
ATE385045T1 (de) 2008-02-15
US6596195B2 (en) 2003-07-22
CN1269233C (zh) 2006-08-09
TWI302937B (en) 2008-11-11
JP2004529252A (ja) 2004-09-24

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