CN101128563B - 荧光体、其制造方法及其应用 - Google Patents
荧光体、其制造方法及其应用 Download PDFInfo
- Publication number
- CN101128563B CN101128563B CN200680006387.5A CN200680006387A CN101128563B CN 101128563 B CN101128563 B CN 101128563B CN 200680006387 A CN200680006387 A CN 200680006387A CN 101128563 B CN101128563 B CN 101128563B
- Authority
- CN
- China
- Prior art keywords
- fluor
- light
- twinkler
- emitting device
- luminous intensity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005053676 | 2005-02-28 | ||
JP053676/2005 | 2005-02-28 | ||
PCT/JP2006/303279 WO2006093015A1 (ja) | 2005-02-28 | 2006-02-23 | 蛍光体及びその製造方法並びにその応用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101128563A CN101128563A (zh) | 2008-02-20 |
CN101128563B true CN101128563B (zh) | 2012-05-23 |
Family
ID=36941049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680006387.5A Expired - Fee Related CN101128563B (zh) | 2005-02-28 | 2006-02-23 | 荧光体、其制造方法及其应用 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090008663A1 (zh) |
EP (1) | EP1854863A4 (zh) |
JP (1) | JP4325733B2 (zh) |
KR (1) | KR101388470B1 (zh) |
CN (1) | CN101128563B (zh) |
TW (1) | TW200704754A (zh) |
WO (1) | WO2006093015A1 (zh) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8135531B2 (en) | 2002-06-12 | 2012-03-13 | Nmhg Oregon, Llc | Predictive vehicle controller |
US7974760B2 (en) | 2003-10-20 | 2011-07-05 | Nmhg Oregon, Inc. | Advanced power-shift transmission control system |
US8775039B2 (en) | 2003-10-20 | 2014-07-08 | Nmhg Oregon, Llc | Dynamically adjustable inch/brake overlap for vehicle transmission control |
JP2008050493A (ja) * | 2006-08-25 | 2008-03-06 | Mitsubishi Chemicals Corp | 蛍光体及びそれを用いた発光装置 |
EP2060616A4 (en) | 2006-09-15 | 2010-08-04 | Mitsubishi Chem Corp | FLUORESCENT, MANUFACTURING METHOD, FLUORESCENT COMPOSITION, LIGHTING DEVICE, PICTURE INDICATOR AND LIGHTING DEVICE |
US8133461B2 (en) | 2006-10-20 | 2012-03-13 | Intematix Corporation | Nano-YAG:Ce phosphor compositions and their methods of preparation |
US8475683B2 (en) | 2006-10-20 | 2013-07-02 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on halogenated-aluminates |
US8529791B2 (en) | 2006-10-20 | 2013-09-10 | Intematix Corporation | Green-emitting, garnet-based phosphors in general and backlighting applications |
US9120975B2 (en) | 2006-10-20 | 2015-09-01 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates |
JP2008150276A (ja) * | 2006-11-21 | 2008-07-03 | Canon Inc | 紫外光用ガラス組成物及びそれを用いた光学装置 |
US9178121B2 (en) | 2006-12-15 | 2015-11-03 | Cree, Inc. | Reflective mounting substrates for light emitting diodes |
US8487525B2 (en) | 2007-05-04 | 2013-07-16 | Seoul Semiconductor Co., Ltd. | Light emitting device including optical lens |
JP2009173905A (ja) * | 2007-12-28 | 2009-08-06 | Mitsubishi Chemicals Corp | 蛍光体、蛍光体の製造方法、蛍光体含有組成物および発光装置 |
KR100937962B1 (ko) * | 2008-02-01 | 2010-01-21 | 삼성에스디아이 주식회사 | 디스플레이 장치용 형광체 조성물 |
US8178888B2 (en) | 2008-02-01 | 2012-05-15 | Cree, Inc. | Semiconductor light emitting devices with high color rendering |
KR100937963B1 (ko) * | 2008-02-05 | 2010-01-21 | 삼성에스디아이 주식회사 | 디스플레이 장치용 형광체 조성물 |
JP5402008B2 (ja) * | 2009-01-16 | 2014-01-29 | 日亜化学工業株式会社 | 蛍光体の製造方法及び蛍光体並びにこれを用いた発光装置 |
DE102009037730A1 (de) | 2009-08-17 | 2011-02-24 | Osram Gesellschaft mit beschränkter Haftung | Konversions-LED mit hoher Farbwiedergabe |
TWI383036B (zh) * | 2009-11-10 | 2013-01-21 | China Glaze Co Ltd | 螢光粉組成物及包含其之白光發光二極體裝置 |
TWI394827B (zh) * | 2010-04-20 | 2013-05-01 | China Glaze Co Ltd | 螢光材料與白光發光裝置 |
DE102010021341A1 (de) * | 2010-05-22 | 2011-11-24 | Merck Patent Gmbh | Leuchtstoffe |
JP5323131B2 (ja) | 2010-06-09 | 2013-10-23 | 信越化学工業株式会社 | 蛍光粒子及び発光ダイオード並びにこれらを用いた照明装置及び液晶パネル用バックライト装置 |
EP2634234B1 (en) | 2010-10-29 | 2017-12-06 | National Institute for Materials Science | Light-emitting device |
JP5450559B2 (ja) * | 2010-11-25 | 2014-03-26 | シャープ株式会社 | 植物栽培用led光源、植物工場及び発光装置 |
US9617469B2 (en) | 2011-01-06 | 2017-04-11 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles, making method, and light-emitting diode |
US8747697B2 (en) * | 2011-06-07 | 2014-06-10 | Cree, Inc. | Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same |
DE102011078402A1 (de) | 2011-06-30 | 2013-01-03 | Osram Ag | Konversionselement und Leuchtdiode mit einem solchen Konversionselement |
DE102011113802A1 (de) | 2011-09-20 | 2013-03-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen |
TWI515922B (zh) * | 2011-10-25 | 2016-01-01 | 奇美實業股份有限公司 | 螢光體及使用其之發光裝置 |
TWI538980B (zh) * | 2011-11-29 | 2016-06-21 | 奇美實業股份有限公司 | 螢光體及使用其之發光裝置 |
KR101335522B1 (ko) | 2012-02-29 | 2013-12-02 | 한국화학연구원 | 청색광 여기용 형광체, 이의 제조방법 및 이를 포함하는 백색 발광 다이오드 |
CN102604515A (zh) * | 2012-03-01 | 2012-07-25 | 上海祥羚光电科技发展有限公司 | 大功率蓝光led远程激发灯罩专用静电喷涂黄色荧光粉复合白光涂料 |
WO2013161683A1 (ja) | 2012-04-24 | 2013-10-31 | 株式会社光波 | 蛍光体及びその製造方法、並びに発光装置 |
CN104736667B (zh) * | 2012-10-16 | 2017-12-12 | 电化株式会社 | 荧光体、发光装置及照明装置 |
JP6261196B2 (ja) * | 2013-06-12 | 2018-01-17 | 信越化学工業株式会社 | 発光装置 |
JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
TWI518170B (zh) * | 2013-12-26 | 2016-01-21 | 奇美實業股份有限公司 | 螢光粉體與發光裝置 |
JP2015183084A (ja) * | 2014-03-24 | 2015-10-22 | 三菱化学株式会社 | 紫光励起用蛍光体、該蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、該発光装置を用いた照明装置及び画像表示装置 |
JP6833683B2 (ja) * | 2015-06-12 | 2021-02-24 | 株式会社東芝 | 蛍光体およびその製造方法、ならびにledランプ |
JP6944104B2 (ja) | 2016-11-30 | 2021-10-06 | 日亜化学工業株式会社 | 発光装置 |
Citations (1)
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CN1254747A (zh) * | 1998-11-23 | 2000-05-31 | 中国科学院长春物理研究所 | 稀土石榴石绿色荧光体及制备方法 |
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JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
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TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
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JPH10190066A (ja) | 1996-12-27 | 1998-07-21 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたled表示装置 |
JP3246386B2 (ja) | 1997-03-05 | 2002-01-15 | 日亜化学工業株式会社 | 発光ダイオード及び発光ダイオード用の色変換モールド部材 |
JP2003505582A (ja) * | 1999-07-23 | 2003-02-12 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | 光源用発光物質および発光物質を有する光源 |
KR100450647B1 (ko) * | 1999-07-23 | 2004-10-01 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | 발광 물질, 파장 전환용 시일링 물질 및 광원 |
US6552487B1 (en) * | 1999-10-27 | 2003-04-22 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh | Phosphor for light sources, and associated light source |
JP4683719B2 (ja) * | 2000-12-21 | 2011-05-18 | 株式会社日立メディコ | 酸化物蛍光体及びそれを用いた放射線検出器、並びにx線ct装置 |
MY131962A (en) * | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
US6596195B2 (en) * | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
US7038370B2 (en) * | 2003-03-17 | 2006-05-02 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting device |
JP4272011B2 (ja) | 2003-08-06 | 2009-06-03 | ダイハツ工業株式会社 | 吊下げ搬送機 |
EP1659335A4 (en) * | 2003-08-28 | 2010-05-05 | Mitsubishi Chem Corp | LIGHT DISPENSER AND PHOSPHORUS |
JP4916651B2 (ja) * | 2003-08-28 | 2012-04-18 | 三菱化学株式会社 | 発光装置及び蛍光体 |
JP4503321B2 (ja) * | 2004-03-19 | 2010-07-14 | 根本特殊化学株式会社 | 蛍光体 |
KR20060000313A (ko) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물 |
-
2006
- 2006-02-23 KR KR1020077019688A patent/KR101388470B1/ko not_active IP Right Cessation
- 2006-02-23 US US11/816,920 patent/US20090008663A1/en not_active Abandoned
- 2006-02-23 WO PCT/JP2006/303279 patent/WO2006093015A1/ja active Application Filing
- 2006-02-23 EP EP06714419A patent/EP1854863A4/en not_active Withdrawn
- 2006-02-23 CN CN200680006387.5A patent/CN101128563B/zh not_active Expired - Fee Related
- 2006-02-27 TW TW095106562A patent/TW200704754A/zh unknown
-
2008
- 2008-07-29 JP JP2008194443A patent/JP4325733B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1254747A (zh) * | 1998-11-23 | 2000-05-31 | 中国科学院长春物理研究所 | 稀土石榴石绿色荧光体及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006093015A1 (ja) | 2006-09-08 |
KR20070106536A (ko) | 2007-11-01 |
JP2009001809A (ja) | 2009-01-08 |
TW200704754A (en) | 2007-02-01 |
EP1854863A4 (en) | 2012-02-22 |
CN101128563A (zh) | 2008-02-20 |
US20090008663A1 (en) | 2009-01-08 |
KR101388470B1 (ko) | 2014-04-23 |
EP1854863A1 (en) | 2007-11-14 |
JP4325733B2 (ja) | 2009-09-02 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Address after: Tokyo, Japan Patentee after: MITSUBISHI CHEMICAL Corp. Address before: Tokyo, Japan Patentee before: MITSUBISHI RAYON Co.,Ltd. |
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