KR20030095349A - 반도체집적회로장치 - Google Patents

반도체집적회로장치 Download PDF

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Publication number
KR20030095349A
KR20030095349A KR10-2003-0037075A KR20030037075A KR20030095349A KR 20030095349 A KR20030095349 A KR 20030095349A KR 20030037075 A KR20030037075 A KR 20030037075A KR 20030095349 A KR20030095349 A KR 20030095349A
Authority
KR
South Korea
Prior art keywords
circuit
power supply
voltage
clamp
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2003-0037075A
Other languages
English (en)
Korean (ko)
Inventor
사이토우카요코
쿠스노키미츠구
시즈카히로야스
마스다신이치로
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
가부시기가이샤 히다치초엘에스아이시스템즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치세이사쿠쇼, 가부시기가이샤 히다치초엘에스아이시스템즈 filed Critical 가부시키가이샤 히타치세이사쿠쇼
Publication of KR20030095349A publication Critical patent/KR20030095349A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K5/00Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/01Shaping pulses
    • H03K5/08Shaping pulses by limiting; by thresholding; by slicing, i.e. combined limiting and thresholding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/003Modifications for increasing the reliability for protection
    • H03K19/00315Modifications for increasing the reliability for protection in field-effect transistor circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/18Peripheral circuit regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Manipulation Of Pulses (AREA)
KR10-2003-0037075A 2002-06-10 2003-06-10 반도체집적회로장치 Withdrawn KR20030095349A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00168680 2002-06-10
JP2002168680A JP4043855B2 (ja) 2002-06-10 2002-06-10 半導体集積回路装置

Publications (1)

Publication Number Publication Date
KR20030095349A true KR20030095349A (ko) 2003-12-18

Family

ID=29706811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0037075A Withdrawn KR20030095349A (ko) 2002-06-10 2003-06-10 반도체집적회로장치

Country Status (5)

Country Link
US (1) US6828842B2 (enExample)
JP (1) JP4043855B2 (enExample)
KR (1) KR20030095349A (enExample)
CN (1) CN1326242C (enExample)
TW (1) TWI286380B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100569558B1 (ko) * 2003-11-10 2006-04-10 주식회사 하이닉스반도체 전원 제어 기능을 갖는 불휘발성 강유전체 메모리 장치
US7098717B2 (en) * 2004-06-25 2006-08-29 Altera Corporation Gate triggered ESD clamp
JP4942007B2 (ja) 2004-10-25 2012-05-30 ルネサスエレクトロニクス株式会社 半導体集積回路
US7859301B2 (en) * 2007-04-30 2010-12-28 Altera Corporation Power regulator circuitry for programmable logic device memory elements
US7692975B2 (en) 2008-05-09 2010-04-06 Micron Technology, Inc. System and method for mitigating reverse bias leakage
JP2009283610A (ja) * 2008-05-21 2009-12-03 Elpida Memory Inc Esd保護回路
DE102008034109B4 (de) * 2008-07-21 2016-10-13 Dspace Digital Signal Processing And Control Engineering Gmbh Schaltung zur Nachbildung einer elektrischen Last
US8238067B2 (en) * 2008-12-11 2012-08-07 Ati Technologies Ulc Electrostatic discharge circuit and method
JP2011228372A (ja) * 2010-04-16 2011-11-10 Toshiba Corp 半導体集積回路装置
TWI422008B (zh) 2010-05-24 2014-01-01 Au Optronics Corp 靜電防護電路及採用此種靜電防護電路之顯示裝置
CN101859764B (zh) * 2010-06-03 2012-02-08 友达光电股份有限公司 静电防护电路及采用此种静电防护电路的显示装置
JP5656658B2 (ja) * 2011-01-14 2015-01-21 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置
JP2013055102A (ja) 2011-09-01 2013-03-21 Sony Corp 半導体集積回路及び保護回路
JP2014229624A (ja) 2013-05-17 2014-12-08 ソニー株式会社 半導体装置および電子機器
JP5710706B2 (ja) * 2013-07-29 2015-04-30 アギア システムズ エルエルシーAgere Systems LLC 静電気放電保護回路
JP2016035958A (ja) 2014-08-01 2016-03-17 ソニー株式会社 保護素子、保護回路及び半導体集積回路
CN111584490A (zh) * 2015-02-26 2020-08-25 杭州海存信息技术有限公司 分离的三维纵向存储器
US10734806B2 (en) 2016-07-21 2020-08-04 Analog Devices, Inc. High voltage clamps with transient activation and activation release control
JP6623139B2 (ja) 2016-10-24 2019-12-18 株式会社東芝 Esd保護回路
US10861845B2 (en) * 2016-12-06 2020-12-08 Analog Devices, Inc. Active interface resistance modulation switch
US11387648B2 (en) 2019-01-10 2022-07-12 Analog Devices International Unlimited Company Electrical overstress protection with low leakage current for high voltage tolerant high speed interfaces
TWI735909B (zh) * 2019-07-10 2021-08-11 瑞昱半導體股份有限公司 靜電放電保護電路以及運作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3229809B2 (ja) * 1995-08-31 2001-11-19 三洋電機株式会社 半導体装置
CN1075667C (zh) * 1996-04-19 2001-11-28 松下电器产业株式会社 半导体集成电路及采用该电路的系统
JPH10243639A (ja) * 1997-02-27 1998-09-11 Hitachi Ltd 電源回路
US5907464A (en) 1997-03-24 1999-05-25 Intel Corporation MOSFET-based power supply clamps for electrostatic discharge protection of integrated circuits
JPH10303314A (ja) 1997-04-24 1998-11-13 Toshiba Microelectron Corp 半導体集積回路
JPH11243639A (ja) 1998-02-24 1999-09-07 Asahi Kasei Micro Syst Co Ltd 半導体回路
US6400546B1 (en) * 1999-09-02 2002-06-04 Ati International Srl I/O pad voltage protection circuit and method
US6181193B1 (en) * 1999-10-08 2001-01-30 International Business Machines Corporation Using thick-oxide CMOS devices to interface high voltage integrated circuits
US6462601B1 (en) * 2001-05-11 2002-10-08 Faraday Technology Corp. Electrostatic discharge protection circuit layout
JP2002344251A (ja) * 2001-05-22 2002-11-29 Oki Electric Ind Co Ltd オフリーク電流キャンセル回路

Also Published As

Publication number Publication date
JP4043855B2 (ja) 2008-02-06
TWI286380B (en) 2007-09-01
US6828842B2 (en) 2004-12-07
TW200402140A (en) 2004-02-01
US20030227304A1 (en) 2003-12-11
JP2004014929A (ja) 2004-01-15
CN1467844A (zh) 2004-01-14
CN1326242C (zh) 2007-07-11

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20030610

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid