KR20030086893A - 도전성 밀봉제 및 그 제조 방법과 장치 - Google Patents

도전성 밀봉제 및 그 제조 방법과 장치 Download PDF

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Publication number
KR20030086893A
KR20030086893A KR10-2003-0023691A KR20030023691A KR20030086893A KR 20030086893 A KR20030086893 A KR 20030086893A KR 20030023691 A KR20030023691 A KR 20030023691A KR 20030086893 A KR20030086893 A KR 20030086893A
Authority
KR
South Korea
Prior art keywords
sealing
sealant
conductive
roving
magnetic
Prior art date
Application number
KR10-2003-0023691A
Other languages
English (en)
Korean (ko)
Inventor
노이하우스알렉산더
Original Assignee
노이하우스 엘렉트로닉 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노이하우스 엘렉트로닉 게엠베하 filed Critical 노이하우스 엘렉트로닉 게엠베하
Publication of KR20030086893A publication Critical patent/KR20030086893A/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/78Moulding material on one side only of the preformed part
    • B29C70/80Moulding sealing material into closure members
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16JPISTONS; CYLINDERS; SEALINGS
    • F16J15/00Sealings
    • F16J15/02Sealings between relatively-stationary surfaces
    • F16J15/06Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/0011Combinations of extrusion moulding with other shaping operations combined with compression moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/12Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005Conductive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00Seal for a joint or juncture
    • Y10S277/92Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gasket Seals (AREA)
  • Sealing Material Composition (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
KR10-2003-0023691A 2002-05-03 2003-04-15 도전성 밀봉제 및 그 제조 방법과 장치 KR20030086893A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10221100A DE10221100C1 (de) 2002-05-03 2002-05-03 Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung
DE10221100.0 2002-05-03

Publications (1)

Publication Number Publication Date
KR20030086893A true KR20030086893A (ko) 2003-11-12

Family

ID=7714523

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0023691A KR20030086893A (ko) 2002-05-03 2003-04-15 도전성 밀봉제 및 그 제조 방법과 장치

Country Status (8)

Country Link
US (2) US7066472B2 (fr)
EP (1) EP1358995A3 (fr)
JP (1) JP2003332786A (fr)
KR (1) KR20030086893A (fr)
CN (1) CN1254163C (fr)
DE (1) DE10221100C1 (fr)
SG (1) SG105573A1 (fr)
TW (1) TW200306392A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8034120B2 (en) 2002-12-20 2011-10-11 Ossur Hf Suspension liner system with seal
US11523917B2 (en) 2002-12-20 2022-12-13 Ossur Hf Suspension liner system with seal
US10322016B2 (en) 2002-12-20 2019-06-18 Ossur Iceland Ehf Adjustable seal system, seal component and method for using the same
US7661680B2 (en) * 2006-05-03 2010-02-16 Plantronics, Inc Ferrofluid magnetic seal
US8956422B2 (en) 2011-08-22 2015-02-17 Ossur Hf Suspension liner with seal component
JO3407B1 (ar) 2012-05-31 2019-10-20 Eisai R&D Man Co Ltd مركبات رباعي هيدرو بيرازولو بيريميدين
ES2813575T3 (es) * 2015-03-06 2021-03-24 Signify Holding Bv Impresión 3D de materiales compuestos de grafeno (óxido)
CN105235210A (zh) * 2015-09-25 2016-01-13 深圳市博恩实业有限公司 可3d打印的导电复合材料及3d打印成型方法
EP3824851A1 (fr) 2015-10-15 2021-05-26 Össur Iceland EHF Système d'étanchéité réglable
US11793657B2 (en) 2017-11-01 2023-10-24 Ossur Iceland Ehf Prosthetic socket system
WO2019108460A1 (fr) 2017-11-28 2019-06-06 Ossur Iceland Ehf Système d'étanchéité ajustable, composant d'étanchéité et leur procédé d'utilisation
IT201900001147A1 (it) * 2019-01-25 2020-07-25 Bridgestone Europe Nv Sa Sistema e metodo di applicazione per applicare un agente sigillante sulla superficie interna di uno pneumatico

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671048A (en) * 1970-06-12 1972-06-20 Borg Warner Lip type seal
US4172916A (en) * 1978-09-15 1979-10-30 Watson Benjamin H Method of fabricating sandwich panels
JPS61235133A (ja) * 1985-04-11 1986-10-20 Ricoh Co Ltd 情報記録担体の製造方法
US4838347A (en) * 1987-07-02 1989-06-13 American Telephone And Telegraph Company At&T Bell Laboratories Thermal conductor assembly
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
JP3038859B2 (ja) * 1989-09-29 2000-05-08 ジェイエスアール株式会社 異方導電性シート
US5057363A (en) * 1989-12-27 1991-10-15 Japan Capsular Products Inc. Magnetic display system
US5354521A (en) * 1992-02-05 1994-10-11 Gas Research Institute Method of making a magnetically detectable plastic pipe
US5655781A (en) * 1993-02-08 1997-08-12 Petrak; Gregory H. Unitized radial and facial seal
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
US6635354B2 (en) * 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
DE19733627C1 (de) * 1997-07-29 1998-06-18 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung und Verfahren zu deren Herstellung
DE19961187C1 (de) * 1999-12-18 2001-02-08 Siegfried Schaal Metallveredel Verfahren zum Herstellen und Aufbringen eines Abschirmprofils
US7569173B2 (en) * 2000-01-24 2009-08-04 International Brain System S.A. Method and device for transforming crystalline or semicrystalline polymers
DE10039068B4 (de) * 2000-08-10 2006-01-05 Hugo Kern Und Liebers Gmbh & Co. Kg Platinen- Und Federnfabrik Dichtung, Verfahren und Vorrichtung zur Herstellung einer Dichtung
DE10135038A1 (de) * 2001-07-18 2003-02-06 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung
SE521689C2 (sv) * 2001-10-26 2003-11-25 Nolato Silikonteknik Ab Element för elektromagnetisk skärmning samt metod för framställning därav

Also Published As

Publication number Publication date
US20060213679A1 (en) 2006-09-28
US7066472B2 (en) 2006-06-27
EP1358995A2 (fr) 2003-11-05
US20040012158A1 (en) 2004-01-22
TW200306392A (en) 2003-11-16
EP1358995A3 (fr) 2006-02-15
CN1455636A (zh) 2003-11-12
CN1254163C (zh) 2006-04-26
JP2003332786A (ja) 2003-11-21
DE10221100C1 (de) 2003-06-05
SG105573A1 (en) 2004-08-27

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee