KR20030053564A - 엑스레이 디텍터의 제조방법 - Google Patents
엑스레이 디텍터의 제조방법 Download PDFInfo
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- KR20030053564A KR20030053564A KR1020010083317A KR20010083317A KR20030053564A KR 20030053564 A KR20030053564 A KR 20030053564A KR 1020010083317 A KR1020010083317 A KR 1020010083317A KR 20010083317 A KR20010083317 A KR 20010083317A KR 20030053564 A KR20030053564 A KR 20030053564A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 11
- 238000002161 passivation Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 33
- 239000010408 film Substances 0.000 description 13
- 239000010409 thin film Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14692—Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78663—Amorphous silicon transistors
- H01L29/78669—Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Thin Film Transistor (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (5)
- 절연기판을 준비하는 단계;상기 절연기판 상면에 게이트 및 패드를 형성하는 단계;상기 게이트 및 패드를 포함한 상기 절연기판 상면에 게이트 절연막과 비정질 실리콘층 및 에치스톱퍼를 형성하는 단계;상기 에치스톱퍼를 포함한 상기 게이트 절연막 상면에 채널층과 오옴접촉층 및 소오스/드레인을 형성하고, 이와 동시에 상기 게이트 절연막의 소정부분상에 공통전극을 형성하는 단계;상기 공통전극을 포함한 상기 게이트 절연막상에 제1스토리지 전극을 형성하는 단계;상기 소오스/드레인 및 제1스토리지 전극이 형성된 상기 절연기판의 전체 구조 전면상에 보호막을 형성한 다음, 상기 보호막의 소정부분에 콘택홀과 비아홀을 형성하는 단계; 및상기 보호막 상면에 제2스토리지 전극을 형성하는 단계를 포함하는 것을 특징으로 하는 엑스레이 디텍터의 제조방법.
- 제1항에 있어서,상기 채널층과 오옴접촉층 및 소오스/드레인은 하나의 마스크를 사용하여 동시에 형성하는 것을 특징으로 하는 엑스레이 디텍터의 형성방법.
- 제1항에 있어서,상기 콘택홀과 비아홀을 형성하는 단계는, 상기 소오스/드레인의 표면 일부가 노출되도록 상기 보호막을 선택적으로 제거하여 콘택홀을 형성하고, 이와 동시에 상기 패드의 표면 일부가 노출되도록 상기 보호막을 선택적으로 제거하여 수개의 비아홀을 형성하는 것을 특징으로 하는 엑스레이 디텍터의 제조방법.
- 제3항에 있어서,상기 콘택홀과 비아홀은 하나의 마스크를 사용하여 형성하는 것을 특징으로 하는 엑스레이 디텍터의 제조방법.
- 제1항에 있어서,상기 제2스토리지 전극을 형성하는 단계는, 상기 콘택홀을 통해 상기 소오스/드레인 일부와 콘택하며, 상기 제1스토리지 전극과 상호 대향하는 제2스토리지 전극을 형성하는 것을 특징으로 하는 엑스레이 디텍터의 제조방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0083317A KR100527087B1 (ko) | 2001-12-22 | 2001-12-22 | 엑스레이 디텍터의 제조방법 |
TW91135652A TW573368B (en) | 2001-12-22 | 2002-12-10 | Rubbing machine with realigning functions of rubbing method for manufacturing x-ray detector |
US10/316,406 US6653176B2 (en) | 2001-12-22 | 2002-12-11 | Method for manufacturing x-ray detector |
JP2002364401A JP3735682B2 (ja) | 2001-12-22 | 2002-12-16 | X線検出器の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0083317A KR100527087B1 (ko) | 2001-12-22 | 2001-12-22 | 엑스레이 디텍터의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030053564A true KR20030053564A (ko) | 2003-07-02 |
KR100527087B1 KR100527087B1 (ko) | 2005-11-09 |
Family
ID=19717455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0083317A KR100527087B1 (ko) | 2001-12-22 | 2001-12-22 | 엑스레이 디텍터의 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6653176B2 (ko) |
JP (1) | JP3735682B2 (ko) |
KR (1) | KR100527087B1 (ko) |
TW (1) | TW573368B (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100653132B1 (ko) * | 2005-11-09 | 2006-12-04 | 주식회사 다나 바이오시스템 | 과립자 선별기 |
KR101006054B1 (ko) * | 2007-11-22 | 2011-01-06 | 황명철 | 석재슬러지 처리장치 |
US10185042B2 (en) | 2015-12-31 | 2019-01-22 | Lg Display Co., Ltd. | Array substrate of X-ray detector, method for manufacturing array substrate of X-ray detector, digital X-ray detector including the same, and method for manufacturing X-ray detector |
KR102304934B1 (ko) | 2021-02-22 | 2021-09-27 | (주)금호금속 | 기능성 피규어 거치대 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW540128B (en) * | 2002-07-12 | 2003-07-01 | Hannstar Display Corp | Manufacturing method of X-ray detector array |
KR100658286B1 (ko) * | 2005-08-11 | 2006-12-14 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 이를 이용한 평판표시장치 |
KR101218089B1 (ko) | 2007-12-07 | 2013-01-18 | 엘지디스플레이 주식회사 | 디지털 엑스레이 디텍터 및 그 제조방법 |
KR101182230B1 (ko) * | 2009-12-15 | 2012-09-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이의 제조 방법 |
CN103050499B (zh) * | 2011-10-12 | 2016-11-16 | 上海天马微电子有限公司 | 平板型x射线图像传感器及其制造方法 |
JP2013115098A (ja) * | 2011-11-25 | 2013-06-10 | Sony Corp | トランジスタ、トランジスタの製造方法、表示装置および電子機器 |
CN104218095B (zh) | 2014-09-01 | 2016-05-25 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板和显示装置 |
CN104576673B (zh) * | 2014-12-15 | 2017-10-27 | 上海天马微电子有限公司 | 平板图像传感器及其制造方法 |
CN107452833B (zh) * | 2017-06-26 | 2019-06-07 | 中国电子科技集团公司第五十研究所 | 微孔负电极结构的阻挡杂质带探测器的制备方法及探测器 |
CN108640080B (zh) * | 2018-04-09 | 2020-10-02 | 上海集成电路研发中心有限公司 | 一种探测器的金属电极形成方法 |
CN108646487B (zh) * | 2018-05-15 | 2020-12-25 | Tcl华星光电技术有限公司 | Ffs型阵列基板的制作方法及ffs型阵列基板 |
CN111725241B (zh) * | 2020-06-29 | 2023-07-25 | 昆山龙腾光电股份有限公司 | 阵列基板及其制备方法和电子价签 |
Family Cites Families (13)
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GB9202693D0 (en) | 1992-02-08 | 1992-03-25 | Philips Electronics Uk Ltd | A method of manufacturing a large area active matrix array |
US5254480A (en) | 1992-02-20 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Process for producing a large area solid state radiation detector |
JP3976915B2 (ja) | 1998-02-09 | 2007-09-19 | シャープ株式会社 | 二次元画像検出器およびその製造方法 |
US6323490B1 (en) | 1998-03-20 | 2001-11-27 | Kabushiki Kaisha Toshiba | X-ray semiconductor detector |
JP3597392B2 (ja) | 1998-08-07 | 2004-12-08 | シャープ株式会社 | 二次元画像検出器 |
JP3432770B2 (ja) | 1998-09-29 | 2003-08-04 | シャープ株式会社 | 二次元画像検出器の製造方法 |
KR100299537B1 (ko) * | 1999-08-31 | 2001-11-01 | 남상희 | 엑스-선 검출용 박막트랜지스터 기판 제조방법 |
KR100660813B1 (ko) * | 1999-12-31 | 2006-12-26 | 엘지.필립스 엘시디 주식회사 | 엑스레이 디텍터용 어레이기판 제조방법 |
JP2001230398A (ja) * | 2000-02-14 | 2001-08-24 | Sharp Corp | 二次元画像検出器及びその製造方法 |
KR100658978B1 (ko) * | 2000-02-21 | 2006-12-18 | 엘지.필립스 엘시디 주식회사 | 엑스레이 디텍터용 어레이기판 제조방법 |
KR100344777B1 (ko) * | 2000-02-28 | 2002-07-20 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터를 포함하는 소자 제조방법 |
KR20010087036A (ko) * | 2000-03-06 | 2001-09-15 | 구본준, 론 위라하디락사 | 엑스레이 디텍터 |
US6737653B2 (en) * | 2001-03-12 | 2004-05-18 | Lg. Philips Lcd Co., Ltd. | X-ray detector and method of fabricating therefore |
-
2001
- 2001-12-22 KR KR10-2001-0083317A patent/KR100527087B1/ko active IP Right Grant
-
2002
- 2002-12-10 TW TW91135652A patent/TW573368B/zh not_active IP Right Cessation
- 2002-12-11 US US10/316,406 patent/US6653176B2/en not_active Expired - Lifetime
- 2002-12-16 JP JP2002364401A patent/JP3735682B2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100653132B1 (ko) * | 2005-11-09 | 2006-12-04 | 주식회사 다나 바이오시스템 | 과립자 선별기 |
KR101006054B1 (ko) * | 2007-11-22 | 2011-01-06 | 황명철 | 석재슬러지 처리장치 |
US10185042B2 (en) | 2015-12-31 | 2019-01-22 | Lg Display Co., Ltd. | Array substrate of X-ray detector, method for manufacturing array substrate of X-ray detector, digital X-ray detector including the same, and method for manufacturing X-ray detector |
KR102304934B1 (ko) | 2021-02-22 | 2021-09-27 | (주)금호금속 | 기능성 피규어 거치대 |
Also Published As
Publication number | Publication date |
---|---|
US20030119232A1 (en) | 2003-06-26 |
JP3735682B2 (ja) | 2006-01-18 |
JP2003264276A (ja) | 2003-09-19 |
TW573368B (en) | 2004-01-21 |
TW200410420A (en) | 2004-06-16 |
KR100527087B1 (ko) | 2005-11-09 |
US6653176B2 (en) | 2003-11-25 |
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