KR20030041528A - 활성면에 점퍼링 수단이 형성된 센터패드형 집적회로 칩과그 제조 방법 및 그를 이용한 멀티 칩 패키지 - Google Patents
활성면에 점퍼링 수단이 형성된 센터패드형 집적회로 칩과그 제조 방법 및 그를 이용한 멀티 칩 패키지 Download PDFInfo
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- KR20030041528A KR20030041528A KR1020010072348A KR20010072348A KR20030041528A KR 20030041528 A KR20030041528 A KR 20030041528A KR 1020010072348 A KR1020010072348 A KR 1020010072348A KR 20010072348 A KR20010072348 A KR 20010072348A KR 20030041528 A KR20030041528 A KR 20030041528A
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Abstract
Description
Claims (8)
- 센터패드형 칩 위에 칩 패드 외측으로 형성되는 버퍼층과 그 버퍼층에 소정 패턴으로 형성된 점프 메탈라인을 포함하는 점퍼링 수단을 갖는 것을 특징으로 하는 센터패드형 집적회로 칩.
- 제 1항에 있어서, 상기 점퍼링 수단은 일면에 접착층이 형성된 베이스 필름의 버퍼층과 점프 메탈라인이 그 베이스 필름에 형성된 테이프인 것을 특징으로 하는 센터패드형 집적회로 칩.
- 제 1항에 있어서, 상기 점퍼링 수단은 열경화성 수지로 센터패드형 칩에 부착된 것을 특징으로 하는 센터패드형 집적회로 칩.
- 제 1항에 있어서, 상기 점프 메탈라인은 금, 알루미늄, 팔라듐 중의 어느 하나의 재질인 것을 특징으로 하는 센터패드형 집적회로 칩.
- ⒜웨이퍼 상태의 센터패드형 칩 위에 버퍼층을 형성시키는 단계와, ⒝상기 버퍼층 위에 마스크를 정렬시키는 단계, 및 ⒞스퍼터링에 의해 점프 메탈라인을 형성하는 단계를 포함하는 것을 특징으로 하는 센터패드형 집적회로 칩 제조 방법.
- 제 5항에 있어서, 상기 ⒞단계 후에 점프 메탈라인 사이의 브리지를 이온 밀링으로 제거시키는 단계를 더 포함하는 것을 특징으로 하는 센터패드형 집적회로 칩 제조 방법.
- ⒜웨이퍼 상태의 센터패드형 칩 위에 버퍼층을 형성시키는 단계와, ⒝상기 버퍼층 위에 마스크를 정렬시키는 단계와, ⒞스퍼터링에 의해 점프 메탈라인을 형성하는 단계, 및 ⒟글라스 마스크를 정렬시키고 레이저로 밀링하여 점프 메탈라인을 형성하는 단계를 포함하는 센터패드형 집적회로 칩 제조 방법.
- 칩 실장 영역의 외측 영역에 기판 패드가 형성된 기판과, 그 기판의 칩 실장 영역에 실장되며 칩 패드가 활성면의 마주보는 양쪽 가장자리에 형성된 제 1칩과, 제 1칩 위에 부착되며 칩 패드가 활성면의 중앙에 형성된 제 2칩과, 제 2칩 위에 칩 패드 양쪽에 위치하도록 버퍼층(buffer layer)이 형성되며 그 버퍼층 위에서 일측이 제 2칩의 칩 패드에 인접하며 타측이 제 2칩의 가장자리에 인접하는 소정 패턴의 점프 메탈라인이 형성된 점퍼링 수단과, 제 1칩의 칩 패드와 기판 패드를 연결시키는 제 1본딩와이어와, 제 2칩의 칩 패드와 그에 인접한 점프 메탈라인 부분을 연결시키는 제 2본딩와이어, 및 제 2칩의 가장자리 부분의 점프 메탈라인과 기판 패드를 연결시키는 점프 본딩와이어를 포함하는 것을 특징으로 하는 멀티 칩 패키지.
Priority Applications (2)
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KR10-2001-0072348A KR100426608B1 (ko) | 2001-11-20 | 2001-11-20 | 활성면에 점퍼링 수단이 형성된 센터패드형 집적회로 칩과그 제조 방법 및 그를 이용한 멀티 칩 패키지 |
US10/269,328 US7224055B2 (en) | 2001-11-20 | 2002-10-10 | Center pad type IC chip with jumpers, method of processing the same and multi chip package |
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KR10-2001-0072348A KR100426608B1 (ko) | 2001-11-20 | 2001-11-20 | 활성면에 점퍼링 수단이 형성된 센터패드형 집적회로 칩과그 제조 방법 및 그를 이용한 멀티 칩 패키지 |
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KR100574954B1 (ko) * | 2003-11-15 | 2006-04-28 | 삼성전자주식회사 | 중앙부 패드와 재 배선된 패드에서 와이어 본딩된집적회로 칩패키지 |
US7745944B2 (en) | 2005-08-31 | 2010-06-29 | Micron Technology, Inc. | Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
US7714450B2 (en) | 2006-03-27 | 2010-05-11 | Marvell International Technology Ltd. | On-die bond wires system and method for enhancing routability of a redistribution layer |
US20090032972A1 (en) * | 2007-03-30 | 2009-02-05 | Kabushiki Kaisha Toshiba | Semiconductor device |
US8222726B2 (en) * | 2010-03-29 | 2012-07-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package having a jumper chip and method of fabricating the same |
CN108987246A (zh) * | 2017-05-31 | 2018-12-11 | 上海新微技术研发中心有限公司 | 一种去除芯片封装结构的方法 |
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JPH0513663A (ja) * | 1991-07-09 | 1993-01-22 | Fujitsu Ltd | 半導体装置と半導体チツプの実装方法 |
US5696031A (en) | 1996-11-20 | 1997-12-09 | Micron Technology, Inc. | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
US6097098A (en) * | 1997-02-14 | 2000-08-01 | Micron Technology, Inc. | Die interconnections using intermediate connection elements secured to the die face |
JPH10256293A (ja) * | 1997-03-14 | 1998-09-25 | Toshiba Corp | 半導体素子を有する回路モジュールおよびその製造方法ならびに回路モジュールを搭載した電子機器 |
JPH1140694A (ja) * | 1997-07-16 | 1999-02-12 | Oki Electric Ind Co Ltd | 半導体パッケージおよび半導体装置とその製造方法 |
JP3495566B2 (ja) | 1997-07-23 | 2004-02-09 | 三洋電機株式会社 | 半導体装置 |
JP3891678B2 (ja) * | 1998-03-11 | 2007-03-14 | 松下電器産業株式会社 | 半導体装置 |
KR100340862B1 (ko) | 1998-06-29 | 2002-09-25 | 주식회사 하이닉스반도체 | 스택패키지및그의제조방법 |
US6773965B2 (en) * | 1999-05-25 | 2004-08-10 | Micron Technology, Inc. | Semiconductor device, ball grid array connection system, and method of making |
KR20010026512A (ko) | 1999-09-07 | 2001-04-06 | 윤종용 | 멀티 칩 패키지 |
KR100390466B1 (ko) * | 1999-12-30 | 2003-07-04 | 앰코 테크놀로지 코리아 주식회사 | 멀티칩 모듈 반도체패키지 |
US6400574B1 (en) * | 2000-05-11 | 2002-06-04 | Micron Technology, Inc. | Molded ball grid array |
JP2002076252A (ja) * | 2000-08-31 | 2002-03-15 | Nec Kyushu Ltd | 半導体装置 |
JP2002343932A (ja) * | 2001-05-17 | 2002-11-29 | Mitsubishi Electric Corp | 半導体装置と半導体装置の製造方法 |
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