KR20030013322A - 무전해 금속 도금용 촉진 용액의 첨가제 - Google Patents

무전해 금속 도금용 촉진 용액의 첨가제 Download PDF

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Publication number
KR20030013322A
KR20030013322A KR1020020045745A KR20020045745A KR20030013322A KR 20030013322 A KR20030013322 A KR 20030013322A KR 1020020045745 A KR1020020045745 A KR 1020020045745A KR 20020045745 A KR20020045745 A KR 20020045745A KR 20030013322 A KR20030013322 A KR 20030013322A
Authority
KR
South Korea
Prior art keywords
acid
solution
palladium
compound
substrate
Prior art date
Application number
KR1020020045745A
Other languages
English (en)
Korean (ko)
Inventor
간다다카시
Original Assignee
쉬플리 캄파니, 엘.엘.씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쉬플리 캄파니, 엘.엘.씨. filed Critical 쉬플리 캄파니, 엘.엘.씨.
Publication of KR20030013322A publication Critical patent/KR20030013322A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020020045745A 2001-08-02 2002-08-02 무전해 금속 도금용 촉진 용액의 첨가제 KR20030013322A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00234424 2001-08-02
JP2001234424A JP2003049279A (ja) 2001-08-02 2001-08-02 アクセレレータ浴液用添加剤およびアクセレレータ浴液

Publications (1)

Publication Number Publication Date
KR20030013322A true KR20030013322A (ko) 2003-02-14

Family

ID=19066034

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020045745A KR20030013322A (ko) 2001-08-02 2002-08-02 무전해 금속 도금용 촉진 용액의 첨가제

Country Status (5)

Country Link
EP (1) EP1281787A2 (zh)
JP (1) JP2003049279A (zh)
KR (1) KR20030013322A (zh)
CN (1) CN1408899A (zh)
TW (1) TW548340B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140023368A (ko) * 2011-05-17 2014-02-26 아토테크더치랜드게엠베하 무전해 도금 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005036285A (ja) * 2003-07-15 2005-02-10 Tokyo Electron Ltd 無電解メッキ用前処理液及び無電解メッキ方法
US8404035B2 (en) * 2003-10-17 2013-03-26 Nippon Mining & Metals Co., Ltd. Electroless copper plating solution
DE102007007227A1 (de) * 2007-02-14 2008-10-09 Evonik Degussa Gmbh Edelmetall-Katalysatoren
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法
JP5930525B2 (ja) * 2011-12-20 2016-06-08 株式会社Adeka 無電解めっき前処理剤及び該前処理剤を用いた無電解めっき前処理方法
EP2845923B1 (en) * 2013-09-04 2018-11-28 Rohm and Haas Electronic Materials LLC Electroless metallization of dielectrics with stable alkaline catalysts containing pyrazine derivatives
CN104746057B (zh) * 2013-12-25 2018-05-08 比亚迪股份有限公司 一种化学镀锡液及其制备方法和一种化学镀锡方法
WO2017034871A1 (en) 2015-08-21 2017-03-02 G&P Holding, Inc. Silver and copper itaconates and poly itaconates
EP3190209B1 (en) * 2016-01-06 2018-06-06 ATOTECH Deutschland GmbH 1-acylguanidine compounds and the use of said compounds in electroless deposition of nickel and nickel alloy coatings
CN112981382A (zh) * 2021-02-20 2021-06-18 深圳中科利尔科技有限公司 一种化学镀铜溶液及其应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140023368A (ko) * 2011-05-17 2014-02-26 아토테크더치랜드게엠베하 무전해 도금 방법

Also Published As

Publication number Publication date
JP2003049279A (ja) 2003-02-21
TW548340B (en) 2003-08-21
CN1408899A (zh) 2003-04-09
EP1281787A2 (en) 2003-02-05

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