KR20020032015A - 반도체 패키지 제조용 리드프레임 - Google Patents
반도체 패키지 제조용 리드프레임 Download PDFInfo
- Publication number
- KR20020032015A KR20020032015A KR1020000062868A KR20000062868A KR20020032015A KR 20020032015 A KR20020032015 A KR 20020032015A KR 1020000062868 A KR1020000062868 A KR 1020000062868A KR 20000062868 A KR20000062868 A KR 20000062868A KR 20020032015 A KR20020032015 A KR 20020032015A
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- inner lead
- lead frame
- die pad
- wire bonding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (2)
- 반도체칩이 부착되는 다이패드와, 상기 다이패드 주위에 배치되는 복수개의 인너리드와, 상기 다이패드를 지지하는 타이바를 포함하여서 된 반도체 패키지 제조용 리드프레임에 있어서;상기 인너리드의 상부면은 와이어 본딩 영역의 폭이 와이어 본딩 영역을 벗어난 영역의 폭에 비해 상대적으로 넓은 형상이고, 상기 인너리드의 하부면은 리드 팁에서부터 멀어질수록 점점 그 폭이 넓어지는 형상임을 특징으로 하는 반도체 패키지 제조용 리드프레임.
- 제 1 항에 있어서,상기 인너리드들의 클램핑 영역에,서로 이웃하는 각 인너리드 사이의 간격이 일정하게 유지되도록 리드 록 테이프(lead lock tape)가 부착됨을 특징으로 하는 반도체 패키지 제조용 리드프레임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000062868A KR100348321B1 (ko) | 2000-10-25 | 2000-10-25 | 반도체 패키지 제조용 리드프레임 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000062868A KR100348321B1 (ko) | 2000-10-25 | 2000-10-25 | 반도체 패키지 제조용 리드프레임 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020032015A true KR20020032015A (ko) | 2002-05-03 |
KR100348321B1 KR100348321B1 (ko) | 2002-08-10 |
Family
ID=19695329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000062868A KR100348321B1 (ko) | 2000-10-25 | 2000-10-25 | 반도체 패키지 제조용 리드프레임 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100348321B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100568225B1 (ko) | 2003-11-06 | 2006-04-07 | 삼성전자주식회사 | 리드 프레임 및 이를 적용한 반도체 패키지 제조방법 |
-
2000
- 2000-10-25 KR KR1020000062868A patent/KR100348321B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100348321B1 (ko) | 2002-08-10 |
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