KR20010111495A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR20010111495A KR20010111495A KR1020017010908A KR20017010908A KR20010111495A KR 20010111495 A KR20010111495 A KR 20010111495A KR 1020017010908 A KR1020017010908 A KR 1020017010908A KR 20017010908 A KR20017010908 A KR 20017010908A KR 20010111495 A KR20010111495 A KR 20010111495A
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- KR
- South Korea
- Prior art keywords
- group
- semiconductor device
- formula
- polyamide
- resin composition
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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Abstract
Description
Claims (6)
- 하기를 포함하는 반도체 장치:(a) 하기 화학식 1로 표시되는 폴리아미드 100 중량부 및 감광성 디아조퀴논 화합물 1 내지 100 중량부를 함유하는 포지티브 감광성 수지 조성물을 회로가 형성된 칩 상에 코팅하고, 코팅된 조성물을 패턴화 및 경화시킴으로써 수득된 칩 보호용 폴리벤즈옥사졸 수지, 및(b) 범프 전극:화학식 1(식에서, X는 4가 방향족기이고; Y는 2가 방향족기이며; Z는 하기 화학식과 같고:(R1및 R2는 각각 2가 유기기, 및 R3및 R4는 각각 1가 유기기); E는 하나 이상의 알케닐 또는 알키닐기를 갖는 지방족, 지환족 또는 방향족 카르복실기이며; a와 b는 각각 몰 분율이, a + b = 100몰%, a = 60.0 내지 100.0몰% 및 b = 0 내지40.0몰%이고; 및 n = 2 내지 500이다).
- 제 1항에 있어서, 포지티브 감광성 수지 조성물이 하기 화학식 2로 표시되는 비스페놀 화합물 및 하기 화학식 3으로 표시되는 트리스페놀 화합물을 총량 1 내지 30 중량부 함유하는 반도체 장치:화학식 2(식에서, R5및 R6는 각각 수소 원자 또는 알킬기이며; R7, R8, R9및 R10은 각각 수소 원자, 할로겐 원자, 히드록실기, 알콕시기, 시클로알킬기 및 알킬기로부터 선택된 하나의 원자 또는 기이다), 및화학식 3(식에서, R11은 수소 원자 또는 알킬기이며, R12, R13, R15, R16및 R17은 각각 수소 원자, 할로겐 원자, 히드록실기, 알킬기, 알콕시기 및 시클로알킬기로부터 선택된 하나의 원자 또는 기이다).
- 제 2항에 있어서, 비스페놀 화합물 및 트리스페놀 화합물의 비율이 10:90 내지 90:10인 반도체 장치.
- 제 1항 또는 제 2항에 있어서, 상기 폴리아미드의 X가 하기로부터 선택되는 반도체 장치:
- 제 1항 또는 제 2항에 있어서, 상기 폴리아미드의 Y가 하기로부터 선택되는 반도체 장치:(식에서, A는 -CH2-, -C(CH3)2-, -O-, -S-, -SO2-, -CO-, -NHCO 또는 -C(CF3)2-이다.)
- 제 1항에 있어서, 포지티브 감광성 수지 조성물이 280 ℃ 내지 440 ℃의 온도에서 경화되는 반도체 장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-1999-00051422 | 1999-02-26 | ||
JP5142299 | 1999-02-26 | ||
JP2000039079A JP3667184B2 (ja) | 1999-02-26 | 2000-02-17 | 半導体装置 |
JPJP-P-2000-00039079 | 2000-02-17 |
Publications (2)
Publication Number | Publication Date |
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KR20010111495A true KR20010111495A (ko) | 2001-12-19 |
KR100695636B1 KR100695636B1 (ko) | 2007-03-15 |
Family
ID=26391954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020017010908A KR100695636B1 (ko) | 1999-02-26 | 2000-02-23 | 반도체 장치 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6576381B1 (ko) |
EP (1) | EP1195811B1 (ko) |
JP (1) | JP3667184B2 (ko) |
KR (1) | KR100695636B1 (ko) |
CN (1) | CN1198334C (ko) |
DE (1) | DE60005959T2 (ko) |
TW (1) | TW500978B (ko) |
WO (1) | WO2000052757A1 (ko) |
Families Citing this family (20)
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JP2002341521A (ja) * | 2001-05-17 | 2002-11-27 | Sumitomo Chem Co Ltd | 感放射線性樹脂組成物 |
JP2003045877A (ja) * | 2001-08-01 | 2003-02-14 | Sharp Corp | 半導体装置およびその製造方法 |
CN1287435C (zh) * | 2002-06-27 | 2006-11-29 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
US6887643B2 (en) * | 2002-08-05 | 2005-05-03 | Toray Industries, Inc. | Photosensitive resin precursor composition |
EP1491952B1 (en) * | 2003-06-23 | 2015-10-07 | Sumitomo Bakelite Co., Ltd. | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device |
JP4327657B2 (ja) * | 2004-05-20 | 2009-09-09 | Necエレクトロニクス株式会社 | 半導体装置 |
US20090014869A1 (en) * | 2004-10-29 | 2009-01-15 | Vrtis Joan K | Semiconductor device package with bump overlying a polymer layer |
WO2006132962A2 (en) | 2005-06-03 | 2006-12-14 | Fujifilm Electronic Materials U.S.A. Inc. | Novel photosensitive resin compositions |
WO2006132906A2 (en) * | 2005-06-03 | 2006-12-14 | Fujifilm Electronic Materials U.S.A., Inc. | Pretreatment compositions |
KR101398293B1 (ko) * | 2006-10-24 | 2014-05-22 | 스미또모 베이크라이트 가부시키가이샤 | 비스(아미노페놀) 유도체 및 그 제조 방법, 및 폴리아미드 수지류, 포지티브형 감광성 수지 조성물, 보호막, 층간 절연막, 반도체 장치 및 표시 소자 |
US9524945B2 (en) | 2010-05-18 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with L-shaped non-metal sidewall protection structure |
JP5410918B2 (ja) * | 2008-10-20 | 2014-02-05 | チェイル インダストリーズ インコーポレイテッド | ポジティブ型感光性樹脂組成物 |
JP4865913B2 (ja) * | 2009-02-04 | 2012-02-01 | パナソニック株式会社 | 半導体基板構造及び半導体装置 |
US8841766B2 (en) | 2009-07-30 | 2014-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall protection structure |
US8377816B2 (en) * | 2009-07-30 | 2013-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming electrical connections |
US8324738B2 (en) | 2009-09-01 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned protection layer for copper post structure |
US8659155B2 (en) * | 2009-11-05 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps |
US8610270B2 (en) * | 2010-02-09 | 2013-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and semiconductor assembly with lead-free solder |
US8441124B2 (en) | 2010-04-29 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall protection structure |
US9018758B2 (en) | 2010-06-02 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall spacer and metal top cap |
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US5194934A (en) * | 1988-07-27 | 1993-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Mounting structure for a semiconductor chip having a buffer layer |
DE59208963D1 (de) * | 1991-05-07 | 1997-11-20 | Siemens Ag | Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
US5162257A (en) * | 1991-09-13 | 1992-11-10 | Mcnc | Solder bump fabrication method |
KR0181615B1 (ko) * | 1995-01-30 | 1999-04-15 | 모리시다 요이치 | 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재 |
EP1441388A3 (en) | 1995-03-20 | 2004-09-22 | Unitive International Limited | Solder bump fabrication methods and structure including a titanium barrier layer |
TW502135B (en) * | 1996-05-13 | 2002-09-11 | Sumitomo Bakelite Co | Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same |
US6222272B1 (en) * | 1996-08-06 | 2001-04-24 | Nitto Denko Corporation | Film carrier and semiconductor device using same |
JPH1135915A (ja) | 1997-07-15 | 1999-02-09 | Toray Ind Inc | 樹脂封止型半導体装置 |
JPH11312675A (ja) | 1998-04-27 | 1999-11-09 | Sumitomo Bakelite Co Ltd | 半導体装置及びその製造方法 |
-
2000
- 2000-02-17 JP JP2000039079A patent/JP3667184B2/ja not_active Expired - Fee Related
- 2000-02-23 US US09/913,156 patent/US6576381B1/en not_active Expired - Lifetime
- 2000-02-23 KR KR1020017010908A patent/KR100695636B1/ko active IP Right Grant
- 2000-02-23 DE DE60005959T patent/DE60005959T2/de not_active Expired - Lifetime
- 2000-02-23 EP EP00905287A patent/EP1195811B1/en not_active Expired - Lifetime
- 2000-02-23 CN CNB008042306A patent/CN1198334C/zh not_active Expired - Fee Related
- 2000-02-23 WO PCT/JP2000/001028 patent/WO2000052757A1/ja active IP Right Grant
- 2000-02-24 TW TW089103281A patent/TW500978B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1195811A4 (en) | 2002-05-15 |
DE60005959D1 (de) | 2003-11-20 |
TW500978B (en) | 2002-09-01 |
JP3667184B2 (ja) | 2005-07-06 |
WO2000052757A1 (en) | 2000-09-08 |
US6576381B1 (en) | 2003-06-10 |
EP1195811B1 (en) | 2003-10-15 |
EP1195811A1 (en) | 2002-04-10 |
CN1341279A (zh) | 2002-03-20 |
DE60005959T2 (de) | 2004-08-12 |
JP2000310858A (ja) | 2000-11-07 |
KR100695636B1 (ko) | 2007-03-15 |
CN1198334C (zh) | 2005-04-20 |
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