KR20010106204A - 전기 전도성 금속 스트립 및 커넥터 - Google Patents
전기 전도성 금속 스트립 및 커넥터 Download PDFInfo
- Publication number
- KR20010106204A KR20010106204A KR1020010023663A KR20010023663A KR20010106204A KR 20010106204 A KR20010106204 A KR 20010106204A KR 1020010023663 A KR1020010023663 A KR 1020010023663A KR 20010023663 A KR20010023663 A KR 20010023663A KR 20010106204 A KR20010106204 A KR 20010106204A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- base material
- metal strip
- conductive metal
- range
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Abstract
Description
Claims (9)
- 커넥터와 같은 전기 접촉 유닛을 제조하기 위한 전기 전도성 금속 스트립으로서, 주석-은 합금으로 이루어지고 용융 기술적으로 피복된 금속 피복층을 가진 구리 또는 구리 합금의 모재를 구비하며, 상기 모재와 피복층 사이에는 금속간 상(相)이 형성되는 전기 전도성 금속 스트립에 있어서,상기 피복층은 1 ∼ 3.8 중량% 범위의 은 분율을 가진 주석-은 합금으로 이루어지는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항에 있어서, 상기 피복층의 은 함량은 1.2 ∼ 2.5 중량% 범위인 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 또는 제2항에 있어서, 상기 주석-은 합금은 10 중량% 까지, 바람직하게는 0.1 ∼ 5 중량% 범위의 인을 함유하는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 모재는, 중량%로 표시하여,니켈(Ni) 1.0 % ∼ 4.0 %실리콘(Si) 0.08 % ∼ 1.0 %주석(Sn) 1.0 % 까지아연(Zn) 2.0 % 까지가능한 추가의 합금 성분 뿐만 아니라 불가피한 불순물을 포함한 나머지로서 구리로 이루어지는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 모재는, 중량%로 표시하여,니켈(Ni) 1.4 % ∼ 1.7 %실리콘(Si) 0.2 % ∼ 0.35 %주석(Sn) 0.02 % ∼ 0.3 %아연(Zn) 0.01 % ∼ 0.35 %가능한 추가의 합금 성분 뿐만 아니라 불가피한 불순물을 포함한 나머지로서 구리로 이루어지는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 모재는 0.02 ∼ 0.5 중량% 범위, 바람직하게는 0.05 ∼ 0.2 중량% 범위의 은(Ag)을 함유하는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 모재는 0.35 중량% 까지, 바람직하게는 0.005 ∼ 0.05 중량% 범위의 지르코늄(Zr)을 함유하는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 모재는 0.1 중량% 마그네슘(Mg), 0.05 중량% 까지의 인(P), 또는 0.1 중량% 까지의 철(Fe)을 함유하는 것을 특징으로 하는 전기 전도성 금속 스트립.
- 제1항 내지 제8항 중 어느 한 항에 따른 금속 스트립으로 이루어진 커넥터.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10025107A DE10025107A1 (de) | 2000-05-20 | 2000-05-20 | Elektrisch leifähiges Metallband und Steckverbinder |
DE10025107.2 | 2000-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010106204A true KR20010106204A (ko) | 2001-11-29 |
KR100786592B1 KR100786592B1 (ko) | 2007-12-21 |
Family
ID=7642994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010023663A KR100786592B1 (ko) | 2000-05-20 | 2001-05-02 | 전기 전도성 금속 스트립 및 커넥터 |
Country Status (13)
Country | Link |
---|---|
US (1) | US6641930B2 (ko) |
EP (1) | EP1157820B1 (ko) |
JP (1) | JP2002020825A (ko) |
KR (1) | KR100786592B1 (ko) |
CN (1) | CN1293676C (ko) |
AT (1) | ATE277754T1 (ko) |
DE (2) | DE10025107A1 (ko) |
DK (1) | DK1157820T3 (ko) |
ES (1) | ES2225349T3 (ko) |
HK (1) | HK1040838B (ko) |
PT (1) | PT1157820E (ko) |
TR (1) | TR200402789T4 (ko) |
TW (1) | TW495769B (ko) |
Families Citing this family (18)
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US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
DE10139953A1 (de) * | 2001-08-21 | 2003-03-27 | Stolberger Metallwerke Gmbh | Werkstoff für ein Metallband |
US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
FR2864688B1 (fr) * | 2003-12-29 | 2006-02-24 | Alstom | Organe de contact electrique pour appareillage electrique en moyenne ou haute tension, procede et appareillage correspondants. |
US20050268991A1 (en) * | 2004-06-03 | 2005-12-08 | Enthone Inc. | Corrosion resistance enhancement of tin surfaces |
US20100047605A1 (en) * | 2006-12-19 | 2010-02-25 | Christiane Knoblauch | Sliding bearing |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
CN102159741A (zh) * | 2008-07-07 | 2011-08-17 | 山特维克知识产权股份有限公司 | 抗变色银合金 |
SE536911C2 (sv) * | 2011-02-09 | 2014-10-28 | Impact Coatings Ab | Material för att åstadkomma ett elektriskt ledande kontaktskikt, ett kontaktelement med sådant skikt, metod för att åstadkomma kontaktelementet, samt användning av materialet |
CN103093852A (zh) * | 2011-10-28 | 2013-05-08 | 常州瑞通新型线材有限公司 | 一种镀锡铝镁线材 |
DE102011088793A1 (de) | 2011-12-16 | 2013-06-20 | Tyco Electronics Amp Gmbh | Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement |
JP2015149218A (ja) * | 2014-02-07 | 2015-08-20 | 矢崎総業株式会社 | 固定接点 |
CN105385924A (zh) * | 2015-12-02 | 2016-03-09 | 苏州龙腾万里化工科技有限公司 | 一种磨削机电位器用耐用电阻合金 |
JP6365653B2 (ja) * | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | はんだ合金、はんだ継手およびはんだ付け方法 |
DE102018208116A1 (de) * | 2018-05-23 | 2019-11-28 | Aurubis Stolberg Gmbh & Co. Kg | Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder |
DE102020006059A1 (de) * | 2020-10-05 | 2022-04-07 | Wieland-Werke Aktiengesellschaft | Elektrisch leitendes Material mit Beschichtung |
CN114875269B (zh) * | 2022-04-22 | 2023-05-05 | 江西铜业技术研究院有限公司 | 一种铜合金发热丝的制备工艺 |
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-
2000
- 2000-05-20 DE DE10025107A patent/DE10025107A1/de not_active Withdrawn
-
2001
- 2001-05-02 KR KR1020010023663A patent/KR100786592B1/ko active IP Right Grant
- 2001-05-11 TW TW090111258A patent/TW495769B/zh not_active IP Right Cessation
- 2001-05-16 PT PT01111806T patent/PT1157820E/pt unknown
- 2001-05-16 TR TR2004/02789T patent/TR200402789T4/xx unknown
- 2001-05-16 EP EP01111806A patent/EP1157820B1/de not_active Expired - Lifetime
- 2001-05-16 DK DK01111806T patent/DK1157820T3/da active
- 2001-05-16 AT AT01111806T patent/ATE277754T1/de active
- 2001-05-16 ES ES01111806T patent/ES2225349T3/es not_active Expired - Lifetime
- 2001-05-16 DE DE50103827T patent/DE50103827D1/de not_active Expired - Lifetime
- 2001-05-17 CN CNB011177861A patent/CN1293676C/zh not_active Expired - Fee Related
- 2001-05-17 US US09/859,825 patent/US6641930B2/en not_active Expired - Lifetime
- 2001-05-18 JP JP2001149478A patent/JP2002020825A/ja active Pending
-
2002
- 2002-04-04 HK HK02102527.6A patent/HK1040838B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1157820B1 (de) | 2004-09-29 |
TW495769B (en) | 2002-07-21 |
HK1040838B (zh) | 2007-08-24 |
KR100786592B1 (ko) | 2007-12-21 |
US20020096662A1 (en) | 2002-07-25 |
CN1325155A (zh) | 2001-12-05 |
TR200402789T4 (tr) | 2004-11-22 |
DK1157820T3 (da) | 2004-11-29 |
JP2002020825A (ja) | 2002-01-23 |
DE10025107A1 (de) | 2001-11-22 |
HK1040838A1 (en) | 2002-06-21 |
DE50103827D1 (de) | 2004-11-04 |
PT1157820E (pt) | 2004-12-31 |
CN1293676C (zh) | 2007-01-03 |
ES2225349T3 (es) | 2005-03-16 |
US6641930B2 (en) | 2003-11-04 |
ATE277754T1 (de) | 2004-10-15 |
EP1157820A1 (de) | 2001-11-28 |
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