HK1040838A1 - Metal strip with high electric conductibility and connector made from it - Google Patents

Metal strip with high electric conductibility and connector made from it

Info

Publication number
HK1040838A1
HK1040838A1 HK02102527A HK02102527A HK1040838A1 HK 1040838 A1 HK1040838 A1 HK 1040838A1 HK 02102527 A HK02102527 A HK 02102527A HK 02102527 A HK02102527 A HK 02102527A HK 1040838 A1 HK1040838 A1 HK 1040838A1
Authority
HK
Hong Kong
Prior art keywords
weight
base material
coating
metal strip
high electric
Prior art date
Application number
HK02102527A
Other versions
HK1040838B (en
Inventor
Klaus Schleicher
Albert Rumbach
Juergen Gebhardt
Udo Adler
Original Assignee
Km Europa Metal Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Km Europa Metal Ag filed Critical Km Europa Metal Ag
Publication of HK1040838A1 publication Critical patent/HK1040838A1/en
Publication of HK1040838B publication Critical patent/HK1040838B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Insulated Conductors (AREA)
  • Resistance Heating (AREA)
  • Cable Accessories (AREA)
  • Organic Insulating Materials (AREA)

Abstract

Electrically conducting metal strip comprises a base material made from copper or a copper alloy with a coating made from a tin-silver alloy. An intermetallic phase is formed between the base material and the coating. The coating contains 1-3.8 weight % silver. Preferred Features: The base material consists of a copper alloy containing the following additions (in weight %): 1.0-4.0 nickel, 0.08-1.0 silicon, up to 1.0 tin, and up to 2.0 zinc. The base material further contains up to 0.1 weight % magnesium, up to 0.05 weight % phosphorus and/or up to 0.1 weight % iron. The coating further contains 0.1-5 weight % indium.
HK02102527.6A 2000-05-20 2002-04-04 Metal strip with high electric conductibility and connector made from it HK1040838B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10025107A DE10025107A1 (en) 2000-05-20 2000-05-20 Electrically conductive metal band and connector

Publications (2)

Publication Number Publication Date
HK1040838A1 true HK1040838A1 (en) 2002-06-21
HK1040838B HK1040838B (en) 2007-08-24

Family

ID=7642994

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102527.6A HK1040838B (en) 2000-05-20 2002-04-04 Metal strip with high electric conductibility and connector made from it

Country Status (13)

Country Link
US (1) US6641930B2 (en)
EP (1) EP1157820B1 (en)
JP (1) JP2002020825A (en)
KR (1) KR100786592B1 (en)
CN (1) CN1293676C (en)
AT (1) ATE277754T1 (en)
DE (2) DE10025107A1 (en)
DK (1) DK1157820T3 (en)
ES (1) ES2225349T3 (en)
HK (1) HK1040838B (en)
PT (1) PT1157820E (en)
TR (1) TR200402789T4 (en)
TW (1) TW495769B (en)

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DE10139953A1 (en) * 2001-08-21 2003-03-27 Stolberger Metallwerke Gmbh Material for a metal band
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
US7391116B2 (en) * 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
FR2864688B1 (en) * 2003-12-29 2006-02-24 Alstom ELECTRICAL CONTACT DEVICE FOR MEDIUM OR HIGH VOLTAGE ELECTRICAL EQUIPMENT, METHOD AND APPARATUS THEREFOR.
US20050268991A1 (en) * 2004-06-03 2005-12-08 Enthone Inc. Corrosion resistance enhancement of tin surfaces
WO2008074344A1 (en) * 2006-12-19 2008-06-26 Mahle International Gmbh Sliding bearing
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
US20110151276A1 (en) * 2008-07-07 2011-06-23 Sandvik Intellectual Property Ab Anti tarnish silver alloy
SE536911C2 (en) * 2011-02-09 2014-10-28 Impact Coatings Ab Material for providing an electrically conductive contact layer, a contact element with such layer, method for providing the contact element, and use of the material
CN103093852A (en) * 2011-10-28 2013-05-08 常州瑞通新型线材有限公司 Plating tin aluminum magnesium wire
DE102011088793A1 (en) * 2011-12-16 2013-06-20 Tyco Electronics Amp Gmbh Electrical connector with microstructured contact element
JP2015149218A (en) * 2014-02-07 2015-08-20 矢崎総業株式会社 fixed contact
CN105385924A (en) * 2015-12-02 2016-03-09 苏州龙腾万里化工科技有限公司 Durable resistance alloy for grinder potentiometer
JP6365653B2 (en) * 2016-08-19 2018-08-01 千住金属工業株式会社 Solder alloy, solder joint and soldering method
DE102018208116A1 (en) * 2018-05-23 2019-11-28 Aurubis Stolberg Gmbh & Co. Kg Copper tape for making electrical contacts and method of making a copper tape and connectors
DE102020006059A1 (en) 2020-10-05 2022-04-07 Wieland-Werke Aktiengesellschaft Electrically conductive material with coating
CN114875269B (en) * 2022-04-22 2023-05-05 江西铜业技术研究院有限公司 Preparation process of copper alloy heating wire

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JPH0788549B2 (en) * 1986-06-26 1995-09-27 古河電気工業株式会社 Copper alloy for semiconductor equipment and its manufacturing method
JPS63241131A (en) * 1986-11-20 1988-10-06 Nippon Mining Co Ltd Copper alloy for sliding material
JPH08957B2 (en) * 1987-04-21 1996-01-10 日鉱金属株式会社 Method for producing copper alloy having excellent heat-resistant peeling property with tin or tin alloy
JPH0776397B2 (en) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Cu alloy electrical equipment connector
DE4005836C2 (en) * 1990-02-23 1999-10-28 Stolberger Metallwerke Gmbh Electrical connector pair
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Also Published As

Publication number Publication date
DE10025107A1 (en) 2001-11-22
EP1157820B1 (en) 2004-09-29
ATE277754T1 (en) 2004-10-15
TW495769B (en) 2002-07-21
ES2225349T3 (en) 2005-03-16
KR100786592B1 (en) 2007-12-21
KR20010106204A (en) 2001-11-29
CN1325155A (en) 2001-12-05
HK1040838B (en) 2007-08-24
US20020096662A1 (en) 2002-07-25
CN1293676C (en) 2007-01-03
PT1157820E (en) 2004-12-31
JP2002020825A (en) 2002-01-23
DK1157820T3 (en) 2004-11-29
DE50103827D1 (en) 2004-11-04
US6641930B2 (en) 2003-11-04
EP1157820A1 (en) 2001-11-28
TR200402789T4 (en) 2004-11-22

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200517