KR20010089362A - 데이터 캐리어 및 집적 전자 소자 - Google Patents
데이터 캐리어 및 집적 전자 소자 Download PDFInfo
- Publication number
- KR20010089362A KR20010089362A KR1020017005269A KR20017005269A KR20010089362A KR 20010089362 A KR20010089362 A KR 20010089362A KR 1020017005269 A KR1020017005269 A KR 1020017005269A KR 20017005269 A KR20017005269 A KR 20017005269A KR 20010089362 A KR20010089362 A KR 20010089362A
- Authority
- KR
- South Korea
- Prior art keywords
- contacts
- coil
- data carrier
- carrier
- turn portions
- Prior art date
Links
- 230000005540 biological transmission Effects 0.000 title claims description 4
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000004804 winding Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000000969 carrier Substances 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 9
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Near-Field Transmission Systems (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
Claims (10)
- 캐리어 바디(2)와,상기 캐리어 바디(2) 내에 위치하며, 소자 표면(4)을 포함하고, 상기 소자 표면(4)의 영역 내에 상호 떨어져 위치하고 있는 두 개의 접속 컨택트(5,6)가 제공되는 집적 전자 소자와,상기 캐리어 내에 위치하며, 상호 떨어져 위치하고 상기 접속 컨택트(5,6)에 전기적 도전성을 가지고 연결된 두 개의 코일 컨택트(13,14)와, 상기 두 개의 코일 컨택트(13,14)와 전기적으로 상호 접속되고 상기 소자 표면(14)에 대해 수직 방향에서 봤을 때 상호 떨어져 있는 상기 두 코일 컨택트(13,14) 사이와 상호 떨어져 있는 상기 두 개의 접속 컨택트(5,6) 사이에서 연장된 짧은 턴 부분(21 내지 25)과 적어도 하나의 짧은 턴 부분(21,22,23,24)에 전기적 도전성을 가지고 각각 연결된 긴 턴 부분(26,27,28,29,30,31)을 더 포함하는 권선(15,16,17,18,19,20)을 포함하는 전송 코일(12)을 포함하는 데이터 캐리어(1)에 있어서,상기 두 코일 컨택트(13,14) 사이와 상기 두 접속 컨택트(5,6) 사이에서 연장되는 상기 전송 코일(12)의 상기 짧은 턴 부분(21,22,23,24,25)이 상기 소자 표면(4)의 영역에서 상기 집적 전자 소자(3) 상에 제공된 접속선(21,22,23,24,25)에 의해 형성되는 것을 특징으로 하는데이터 캐리어(1).
- 제 1 항에 있어서,상기 긴 턴 부분(26 내지 31)은 대부분이 캐리어 바디(2) 내에 완전히 파묻혀 있고,상기 긴 턴 부분(26 내지 31)은 적어도 부분적으로 상기 캐리어 바디 내에 파묻혀 있지 않은 단부(32 내지 41)를 가지며,상기 긴 턴 부분(26 내지 31)의 상기 단부(32 내지 41)는 상기 접속선(21 내지 25)에 전기적 도전성을 가지고 연결되는 것을 특징을 하는데이터 캐리어(1).
- 제 1 항에 있어서,상기 집적 회로 소자(3)는 상기 캐리어(1)내에 위치하고 그 위에 상기 집적 소자(3)와 매개 컨택트(66,67,68,69,70,71,72,73,74,75)가 제공되는 캐리어 표면(64)을 포함하는 소자 캐리어(63)를 포함하는 모듈(62)의 일부를 형성하되,상기 각각의 매개 컨택트가 긴 턴 부분(26,27,28,29,30,31)의 단부 및 연결 선(21,22,23,24,25)의 선단 모두에 전기적 도전성을 가지고 연결되는 것을 특징으로 하는데이터 개리어(1).
- 제 1 항에 있어서,각각의 접속선(21,2,23,24,25)이 집적회로 기술로 제조된 도전체 트랙(a conductor track)에 의해 형성되는 것을 특징으로 하는 데이터 캐리어(1).
- 제 4 항에 있어서,상기 접속선(21,22,23,24,25)으로 제공된 모든 도전체 트랙이 직선경로로 배열된 것을 특징으로 하는 데이터 캐리어.
- 제 4 항에 있어서,접속선(21,22,23,24,25)으로서 제공되는 상기 도전체 트랙의 적어도 일부가 굽은 경로를 따르도록 배열된 것을 특징으로 하는 데이터 캐리어(1).
- 소자 표면(4)을 포함하고,전송 코일(12)의 두 코일 컨택트(13,14)에 전기적 도전성이 있는 접속을 이루기 위한 두 접속 컨택트(5,6)가 상기 소자 표면(4)의 영역에 제공되며,캐리어 바디(2)와 캐리어 바디 내에 위치하는 전송 코일(12)을 구비하는 데이터 캐리어(1) 내에서 구현되도록 디자인되되, 상기 전송 코일은 상호 떨어져 있는 두 코일 컨택트(13,14)와 상기 두 코일 컨택트(13,14)를 전기적으로 상호 연결시키는 권선(15,16,17,18,19,20)을 포함하고 상기 권선은 소자 표면(14)에 대해 수직 방향에서 봤을 때 상호 떨어져 있는 상기 두 접속 컨택트(5,6) 사이에서 연장되는 짧은 턴 부분(21,22,23,24,25)과 적어도 하나의 짧은 턴 부분(21,22,23,24,25)에 전기적 도전성을 가지고 각각 연결된 긴 턴 부분(26,27,28,29,30,31)을 포함하는집적 전자 소자(3)에 있어서상기 소자 표면(4)의 영역에 상기 전송 코일(12)의 상기 권선(15,16,17,18,19)의 짧은 턴 부분(21,22,23,24,25)으로서 쓰이기 위해 디자인된 접속선(21,22,23,24)이 제공되는 것을 특징으로 하는집적 전자 소자(3).
- 제 7 항에 있어서,각각의 접속선(21,22,23,24,25)이 집적 회로 기술에 의해 제조된 도전체 트랙에 의해 형성되는 것을 특징으로 하는 집적 전자 소자(3).
- 제 8 항에 있어서,상기 접속선(21,22,23,24,25)으로 제공되는 모든 도전체 트랙이 직선경로 배열되는 것을 특징으로 하는 집적 전자 소자(3).
- 제 8 항에 있어서,접속선(21,22,23,24,25)으로 제공된 상기 도전체 트랙의 적어도 일부가 굽은 경로를 따르도록 배열되는 것을 특징으로 하는 집적 전자 소자(3).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99890279.5 | 1999-08-31 | ||
EP99890279 | 1999-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010089362A true KR20010089362A (ko) | 2001-10-06 |
KR100762530B1 KR100762530B1 (ko) | 2007-10-01 |
Family
ID=8244007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017005269A KR100762530B1 (ko) | 1999-08-31 | 2000-08-14 | 데이터 캐리어 및 집적 전자 소자 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6552422B1 (ko) |
EP (1) | EP1125247B1 (ko) |
JP (1) | JP2003508833A (ko) |
KR (1) | KR100762530B1 (ko) |
CN (1) | CN1321282A (ko) |
AT (1) | ATE383621T1 (ko) |
DE (1) | DE60037717T2 (ko) |
WO (1) | WO2001016877A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7397672B2 (en) * | 2003-08-05 | 2008-07-08 | Lintec Corporation | Flip chip mounting substrate |
FR2872945B1 (fr) * | 2004-07-07 | 2007-01-12 | Oberthur Card Syst Sa | Entite electronique comportant une antenne, inlay et module pour une telle entite |
JP5874181B2 (ja) * | 2011-03-14 | 2016-03-02 | 株式会社村田製作所 | コイルモジュールおよび非接触電力伝送システム |
JP2013229937A (ja) * | 2013-07-26 | 2013-11-07 | Dainippon Printing Co Ltd | ブースターアンテナ基板 |
CN104377439B (zh) | 2013-08-15 | 2019-08-27 | 德昌电机(深圳)有限公司 | 天线电路及制造方法 |
US11916405B2 (en) * | 2019-01-02 | 2024-02-27 | Ge Hybrid Technologies, Llc | Wireless power transmission apparatus with multiple controllers |
EP3973612A1 (en) | 2019-05-21 | 2022-03-30 | General Electric Company | Wireless power transmission apparatus with multiple primary coils and adjacent coil muting |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857893A (en) * | 1986-07-18 | 1989-08-15 | Bi Inc. | Single chip transponder device |
DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
JP2814477B2 (ja) | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
JP4015717B2 (ja) * | 1995-06-29 | 2007-11-28 | 日立マクセル株式会社 | 情報担体の製造方法 |
DE19642378C2 (de) * | 1996-10-14 | 2000-06-08 | Fraunhofer Ges Forschung | Kontaktlose Chipkarte |
FR2756648B1 (fr) * | 1996-11-29 | 1999-01-08 | Solaic Sa | Carte a memoire du type sans contact |
DE19701167A1 (de) * | 1997-01-15 | 1998-07-23 | Siemens Ag | Chipkarte |
JPH1131784A (ja) * | 1997-07-10 | 1999-02-02 | Rohm Co Ltd | 非接触icカード |
DE19731983A1 (de) * | 1997-07-24 | 1999-01-28 | Giesecke & Devrient Gmbh | Kontaktlos betreibbarer Datenträger |
US6173899B1 (en) * | 1998-04-03 | 2001-01-16 | Alexander Rozin | Method and system for contactless energy transmission and data exchange between a terminal and IC card |
JP4393707B2 (ja) * | 1998-07-07 | 2010-01-06 | エヌエックスピー ビー ヴィ | データ処理手段及び電流ピークパターン抑制手段を備えたデータキャリヤ |
EP1055192A1 (en) * | 1998-12-18 | 2000-11-29 | Koninklijke Philips Electronics N.V. | Data carrier module with integrated circuit and transmission coil |
-
2000
- 2000-08-14 EP EP00954628A patent/EP1125247B1/en not_active Expired - Lifetime
- 2000-08-14 CN CN00801831A patent/CN1321282A/zh active Pending
- 2000-08-14 DE DE60037717T patent/DE60037717T2/de not_active Expired - Lifetime
- 2000-08-14 AT AT00954628T patent/ATE383621T1/de not_active IP Right Cessation
- 2000-08-14 WO PCT/EP2000/007922 patent/WO2001016877A1/en active IP Right Grant
- 2000-08-14 JP JP2001520349A patent/JP2003508833A/ja not_active Withdrawn
- 2000-08-14 KR KR1020017005269A patent/KR100762530B1/ko active IP Right Grant
- 2000-08-28 US US09/649,673 patent/US6552422B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6552422B1 (en) | 2003-04-22 |
DE60037717D1 (de) | 2008-02-21 |
JP2003508833A (ja) | 2003-03-04 |
DE60037717T2 (de) | 2009-01-15 |
KR100762530B1 (ko) | 2007-10-01 |
ATE383621T1 (de) | 2008-01-15 |
EP1125247B1 (en) | 2008-01-09 |
WO2001016877A1 (en) | 2001-03-08 |
EP1125247A1 (en) | 2001-08-22 |
CN1321282A (zh) | 2001-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6568600B1 (en) | Chip card equipped with a loop antenna, and associated micromodule | |
US6994563B2 (en) | Signal channel configuration providing increased capacitance at a card edge connection | |
JP2000133341A (ja) | 改良された半田テ―ルを有する端子を備えたカ―ドエッジ電気コネクタ | |
UA46842C2 (uk) | Носій для напівпровідникового чіпа | |
US6717249B2 (en) | Non-contact type IC card and process for manufacturing-same | |
EP0804059B1 (en) | Structure for mounting an electrical module on a board | |
KR20010089362A (ko) | 데이터 캐리어 및 집적 전자 소자 | |
JPH057868B2 (ko) | ||
US6803527B2 (en) | Circuit board with via through surface mount device contact | |
JP2006059883A (ja) | インターフェイスモジュール付lsiパッケージ | |
JPH0831527A (ja) | 基板用コネクタ | |
US5683256A (en) | Integral thru-hole contacts | |
US4657322A (en) | Microwave interconnect | |
US7068120B2 (en) | Electromagnetic bus coupling having an electromagnetic coupling interposer | |
JP2001135380A (ja) | 低インダクタンスコネクタ | |
EP1804202A1 (en) | Tape carrier and module for contact type IC card and method for manufacturing the tape carrier | |
KR20030066787A (ko) | 허용전류를 증가시켜 높은 ic파워전달을 갖는 소켓 및패키지 파워/그라운드바 장치 | |
US20050205988A1 (en) | Die package with higher useable die contact pad area | |
US6305946B1 (en) | Power connector combining signal connection | |
JPH11296633A (ja) | Icカード | |
JPH11288449A (ja) | Icモジュール、icカードおよびicチップの樹脂封止方法 | |
JPH0935031A (ja) | 接触ユニット用の接点部 | |
KR20010041052A (ko) | 데이터 캐리어 및 이를 구비한 장치 | |
KR20010041051A (ko) | 데이터 캐리어 및 이를 구비한 장치 | |
RU2133067C1 (ru) | Интегральная схема |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
N231 | Notification of change of applicant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120830 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20130830 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20140828 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160629 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20170629 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20180628 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20190624 Year of fee payment: 13 |