KR20010032504A - 미세 내식막 패턴의 형성 방법 - Google Patents
미세 내식막 패턴의 형성 방법 Download PDFInfo
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- KR20010032504A KR20010032504A KR1020007005746A KR20007005746A KR20010032504A KR 20010032504 A KR20010032504 A KR 20010032504A KR 1020007005746 A KR1020007005746 A KR 1020007005746A KR 20007005746 A KR20007005746 A KR 20007005746A KR 20010032504 A KR20010032504 A KR 20010032504A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Abstract
Description
노볼락 수지/감광제 (중량비) | 현상액 TMAH (중량%) | 감도(mJ/㎠) | 막 잔류율(%) | SEM 관찰 (3㎛ 라인) | |
실시예 1 | 100/3 | 1.90 | 7 | 98 | 수직 |
2 | 100/6 | 1.90 | 10 | 98 | 수직 |
3 | 100/9 | 1.90 | 12 | 98 | 수직 |
4 | 100/12 | 1.90 | 15 | 99 | 수직 |
5 | 100/15 | 1.90 | 16 | 99 | 수직 |
6 | 100/9 | 2.20 | 10 | 98 | 수직 |
7 | 100/9 | 1.70 | 15 | 99 | 수직 |
비교예 1 | 100/17 | 2.38 | - | 0 | 막이 잔류되지 않음 |
2 | 100/20 | 2.38 | 12 | 48 | 산 모양 |
3 | 100/25 | 2.38 | 16 | 92 | 수직에 가까운 산 모양 |
4 | 100/27 | 2.38 | 20 | 94 | 수직에 가까운 산 모양 |
5 | 100/30 | 2.38 | 32 | 98 | 스컴 |
6 | 100/17 | 1.90 | 21 | 99 | 수직 |
7 | 100/20 | 1.90 | 27 | 99 | 수직 |
8 | 100/25 | 1.90 | 48 | 99 | 옷자락이 끌린 모양 |
9 | 100/30 | 1.90 | 해상되지 않음 | 99 | 해상되지 않음 |
10 | 100/2 | 1.90 | 3 | 67 | 표면이 거칠어지지 않음 |
11 | 100/9 | 2.50 | - | 0 | 막이 잔류되지 않음 |
12 | 100/9 | 2.38 | - | 0 | 막이 잔류되지 않음 |
노볼락 수지/감광제 (중량비) | 현상액 NaOH(중량%) | 감도(mJ/㎠) | 막 잔류율(%) | SEM 관찰 (3㎛ 라인) | |
실시예 8 | 100/3 | 0.30 | 9 | 98 | 수직 |
9 | 100/6 | 0.30 | 11 | 99 | 수직 |
10 | 100/9 | 0.30 | 14 | 100 | 수직 |
11 | 100/12 | 0.30 | 17 | 100 | 수직 |
12 | 100/15 | 0.30 | 20 | 100 | 수직 |
13 | 100/9 | 0.40 | 12 | 99 | 수직 |
14 | 100/9 | 0.20 | 17 | 100 | 수직 |
비교예 13 | 100/17 | 0.50 | 28 | 89 | 수직 |
14 | 100/20 | 0.50 | 45 | 96 | 수직 |
15 | 100/25 | 0.50 | 59 | 99 | 스컴 |
16 | 100/27 | 0.50 | 88 | 100 | 스컴 |
17 | 100/30 | 0.50 | 해상되지 않음 | 100 | 스컴 |
18 | 100/17 | 0.30 | 31 | 95 | 수직 |
19 | 100/20 | 0.30 | 56 | 99 | 수직 |
20 | 100/25 | 0.30 | 69 | 99 | 스컴 |
21 | 100/30 | 0.30 | 해상되지 않음 | 100 | 해상되지 않음 |
22 | 100/2 | 0.30 | 6 | 79 | 산 모양 |
23 | 100/9 | 0.75 | - | 0 | 막이 잔류되지 않음 |
24 | 100/9 | 0.50 | 3 | 44 | 산 모양 |
노볼락 수지/감광제(중량비) | 현상액 | 감도(mJ/㎠) | 막 잔류율(%) | 최소 해상선폭(㎛) | 3㎛ 마스크라인의 내식막 라인폭(㎛) | ||
NaOH (중량%) | 시간(초) | ||||||
실시예 15 | 100/12 | 1.90 | 60 | 15.3 | 99 | 0.5 | 3.00 |
16 | 100/12 | 1.90 | 80 | 14.3 | 99 | - | 2.94 |
17 | 100/12 | 1.90 | 100 | 13.6 | 98 | - | 2.89 |
18 | 100/12 | 1.90 | 120 | 12.7 | 97 | - | 2.83 |
비교예 25 | 100/25 | 2.38 | 60 | 15.8 | 92 | 0.9 | 3.00 |
26 | 100/25 | 2.38 | 80 | 11.5 | 77 | - | 2.77 |
27 | 100/25 | 2.38 | 100 | 8.1 | 62 | - | 2.50 |
28 | 100/25 | 2.38 | 120 | 6.3 | 45 | - | 2.19 |
노볼락 수지/감광제(중량비) | 현상액 | 감도(mJ/㎠) | 막 잔류율 (%) | 자연 산화 Mo 위에서의 내식막 패턴 | ||
TMAH(중량%) | 시간(초) | |||||
실시예 19 | 100/12 | 1.90 | 60 | 15.3 | 99 | 전체 패턴이 밀착 |
실시예 20 | 100/9 | 1.70 | 60 | 15.1 | 99 | 전체 패턴이 밀착 |
실시예 29 | 100/25 | 2.38 | 60 | 15.7 | 92 | 10㎛ 미만의 라인 패턴이 유출 |
Claims (4)
- 알칼리 가용성 노볼락 수지 100중량부에 대하여, 퀴논디아지드 그룹을 함유하는 감광제를 3 내지 15중량부 함유하는 포지티브형 감광성 내식막 조성물을, 2.2중량% 이하의 화학식 1의 4급 수산화암모늄 수용액을 현상제로서 사용하여 현상함을 특징으로 하는, 미세 내식막 패턴의 형성 방법.화학식 1[(R1)3N-R2]+OH상기식에서,R1은 탄소수 1 내지 3의 알킬 그룹이고,R2는 탄소수 1 내지 3의 알킬 그룹 또는 탄소수 1 내지 3의 하이드록시 치환된 알킬 그룹이다.
- 제1항에 있어서, 화학식 1의 4급 수산화암모늄이 수산화테트라메틸암모늄, 수산화테트라에틸암모늄 또는 수산화트리메틸(2-하이드록시에틸)암모늄이고, 이들 중의 하나 이상이 현상제에 함유됨을 특징으로 하는, 미세 내식막 패턴의 형성 방법.
- 알칼리 가용성 노볼락 수지 100중량부에 대하여, 퀴논디아지드 그룹을 함유하는 감광제를 3 내지 15중량부 함유하는 포지티브형 감광성 내식막 조성물을, 0.4중량% 이하의 화학식 2의 무기 수산화물 수용액을 현상제로서 사용하여 현상함을 특징으로 하는, 미세 내식막 패턴의 형성 방법.화학식 2MOH상기식에서,M은 알칼리 금속이다.
- 제3항에 있어서, 화학식 2의 무기 수산화물이 수산화나트륨 또는 수산화칼륨이고, 이들 중의 하나 이상이 현상제에 함유됨을 특징으로 하는, 미세 내식막 패턴의 형성 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP98-275933 | 1998-09-29 | ||
JP27593398A JP3968177B2 (ja) | 1998-09-29 | 1998-09-29 | 微細レジストパターン形成方法 |
PCT/JP1999/004759 WO2000019274A1 (fr) | 1998-09-29 | 1999-09-02 | Procede d'elaboration de microstructure de resine |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010032504A true KR20010032504A (ko) | 2001-04-25 |
KR100585574B1 KR100585574B1 (ko) | 2006-06-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020007005746A KR100585574B1 (ko) | 1998-09-29 | 1999-09-02 | 미세 내식막 패턴의 형성방법 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6514676B1 (ko) |
EP (1) | EP1046954A4 (ko) |
JP (1) | JP3968177B2 (ko) |
KR (1) | KR100585574B1 (ko) |
CN (1) | CN1169022C (ko) |
TW (1) | TW459163B (ko) |
WO (1) | WO2000019274A1 (ko) |
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US5024921A (en) * | 1987-11-23 | 1991-06-18 | Ocg Microelectronic Materials, Inc. | Thermally stable light-sensitive compositions with o-quinone diazide and phenolic resin used in a method of forming a positive photoresist image |
US5175078A (en) * | 1988-10-20 | 1992-12-29 | Mitsubishi Gas Chemical Company, Inc. | Positive type photoresist developer |
EP0431971B1 (en) * | 1989-12-07 | 1995-07-19 | Kabushiki Kaisha Toshiba | Photosensitive composition and resin-encapsulated semiconductor device |
JP2626363B2 (ja) * | 1991-11-05 | 1997-07-02 | 東レ株式会社 | 電子線感応組成物およびそれを用いるパターン形成方法 |
JP2914172B2 (ja) * | 1993-04-28 | 1999-06-28 | 東レ株式会社 | ポジ型電子線レジスト組成物およびこれを用いた微細パターン形成方法 |
WO1994025904A1 (en) | 1993-04-28 | 1994-11-10 | Toray Industries, Inc. | Positive electron-beam resist composition and developer for positive electron-beam resist |
US5645970A (en) * | 1995-10-25 | 1997-07-08 | Industrial Technology Research Institute | Weak base developable positive photoresist composition containing quinonediazide compound |
JP3968177B2 (ja) * | 1998-09-29 | 2007-08-29 | Azエレクトロニックマテリアルズ株式会社 | 微細レジストパターン形成方法 |
-
1998
- 1998-09-29 JP JP27593398A patent/JP3968177B2/ja not_active Expired - Lifetime
-
1999
- 1999-09-02 KR KR1020007005746A patent/KR100585574B1/ko not_active IP Right Cessation
- 1999-09-02 WO PCT/JP1999/004759 patent/WO2000019274A1/ja active IP Right Grant
- 1999-09-02 CN CNB998016942A patent/CN1169022C/zh not_active Expired - Lifetime
- 1999-09-02 EP EP99940623A patent/EP1046954A4/en not_active Withdrawn
- 1999-09-02 US US09/555,393 patent/US6514676B1/en not_active Expired - Fee Related
- 1999-09-27 TW TW088116502A patent/TW459163B/zh not_active IP Right Cessation
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2002
- 2002-12-18 US US10/323,119 patent/US6933100B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1286764A (zh) | 2001-03-07 |
TW459163B (en) | 2001-10-11 |
JP3968177B2 (ja) | 2007-08-29 |
US6933100B2 (en) | 2005-08-23 |
US6514676B1 (en) | 2003-02-04 |
EP1046954A4 (en) | 2003-03-26 |
US20030108822A1 (en) | 2003-06-12 |
EP1046954A1 (en) | 2000-10-25 |
WO2000019274A1 (fr) | 2000-04-06 |
KR100585574B1 (ko) | 2006-06-02 |
CN1169022C (zh) | 2004-09-29 |
JP2000105466A (ja) | 2000-04-11 |
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