KR20010007100A - 레이저를 이용한 스크라이브 방법 - Google Patents
레이저를 이용한 스크라이브 방법 Download PDFInfo
- Publication number
- KR20010007100A KR20010007100A KR1020000027386A KR20000027386A KR20010007100A KR 20010007100 A KR20010007100 A KR 20010007100A KR 1020000027386 A KR1020000027386 A KR 1020000027386A KR 20000027386 A KR20000027386 A KR 20000027386A KR 20010007100 A KR20010007100 A KR 20010007100A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- crack
- scribing
- scribe
- moving speed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
Claims (3)
- 취성 재료의 기판에 레이저의 조사로 인한 열변형에 의하여 기판에 수직 크랙을 형성하기 위한 스크라이브 방법에 있어서,제1방향으로 수직 크랙을 형성한 후, 제1방향과 직교하는 제2방향으로 수직 크랙을 형성할 때에, 제1방향의 크랙에 대하여 제2방향으로 형성되는 크랙의 깊이를 얕게 하는 것을 특징으로 하는 레이저를 이용한 스크라이브 방법.
- 제1항에 있어서,기판에 대한 레이저의 상대이동속도가 제1방향 및 제2방향에서 동일할 때에 제1방향에 대하여 제2방향에서의 레이저 출력을 10∼40% 저하시키는 것을 특징으로 하는 레이저를 이용한 스크라이브 방법.
- 제1항에 있어서,제1방향 및 제2방향에서 레이저 출력이 동일할 때에 제1방향에 대하여 제2방향에서의 레이저의 상대이동속도를 110∼140%로 하는 것을 특징으로 하는 레이저를 이용한 스크라이브 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-172601 | 1999-06-18 | ||
JP17260199 | 1999-06-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010007100A true KR20010007100A (ko) | 2001-01-26 |
KR100626983B1 KR100626983B1 (ko) | 2006-09-22 |
Family
ID=15944892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000027386A KR100626983B1 (ko) | 1999-06-18 | 2000-05-22 | 레이저를 이용한 스크라이브 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6423930B1 (ko) |
KR (1) | KR100626983B1 (ko) |
TW (1) | TW495409B (ko) |
Cited By (3)
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KR100804362B1 (ko) * | 2002-02-21 | 2008-02-15 | 주식회사 엘지이아이 | 반도체 웨이퍼의 절단방법 |
US7780493B2 (en) | 2007-01-12 | 2010-08-24 | Samsung Mobile Display Co., Ltd. | Method of manufacturing flat panel display device |
KR20110138727A (ko) * | 2010-06-21 | 2011-12-28 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지, 조명 시스템, 및 레이저 스크라이빙 방법 |
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DE10041519C1 (de) * | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
US6812430B2 (en) * | 2000-12-01 | 2004-11-02 | Lg Electronics Inc. | Glass cutting method and apparatus with controlled laser beam energy |
RU2206525C2 (ru) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
JP3577492B1 (ja) * | 2003-03-24 | 2004-10-13 | 西山ステンレスケミカル株式会社 | ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板及びフラットパネルディスプレイ |
US20050188808A1 (en) * | 2003-12-02 | 2005-09-01 | Michael Parrish | Trimmer with laser guide |
US7770502B2 (en) * | 2003-12-02 | 2010-08-10 | Elmer's Products Inc | Laser-guided paper trimmer |
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US7005603B2 (en) * | 2004-04-02 | 2006-02-28 | Hewlett-Packard Development Company, L.P. | Laser marking |
US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
KR100881466B1 (ko) * | 2004-12-28 | 2009-02-06 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 절단방법 및 기판절단 시스템 |
US20060162513A1 (en) * | 2005-01-21 | 2006-07-27 | General Binding Corporation | Trimmer with light guidance |
KR101019790B1 (ko) | 2005-02-18 | 2011-03-04 | 엘지전자 주식회사 | 반도체 레이저 다이오드의 거울면 형성방법 |
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KR101140164B1 (ko) * | 2005-10-28 | 2012-04-24 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 라인 형성방법 및 스크라이브라인 형성장치 |
KR100904381B1 (ko) * | 2007-08-09 | 2009-06-25 | 주식회사 탑 엔지니어링 | 스크라이빙 방법 및 스크라이빙 장치 |
CN101530951B (zh) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 激光切割脆性基板的方法及脆性基板 |
CN101567303B (zh) * | 2008-04-24 | 2011-07-20 | 福建钧石能源有限公司 | 激光刻膜设备和划线方法 |
US10322469B2 (en) | 2008-06-11 | 2019-06-18 | Hamamatsu Photonics K.K. | Fusion bonding process for glass |
WO2010093857A1 (en) * | 2009-02-13 | 2010-08-19 | Videojet Technologies Inc. | Laser parameter adjustment |
US8539795B2 (en) * | 2009-05-13 | 2013-09-24 | Corning Incorporated | Methods for cutting a fragile material |
WO2011002089A1 (ja) * | 2009-07-03 | 2011-01-06 | 旭硝子株式会社 | 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス |
US8932510B2 (en) * | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
JP5567319B2 (ja) | 2009-11-25 | 2014-08-06 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535589B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
JP5795000B2 (ja) * | 2009-11-30 | 2015-10-14 | コーニング インコーポレイテッド | ガラス基板のレーザスクライブおよび分離方法 |
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WO2018105489A1 (ja) * | 2016-12-06 | 2018-06-14 | 日本電気硝子株式会社 | 帯状ガラスフィルムの品質検査方法、及び、ガラスロール |
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JPS5325997A (en) * | 1977-07-06 | 1978-03-10 | Toshiba Corp | Laser scribing method |
RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
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US5622540A (en) * | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
DE69629704T2 (de) * | 1995-08-31 | 2004-07-08 | Corning Inc. | Verfahren und vorrichtung zum zerbrechen von sprödem material |
US5961852A (en) * | 1997-09-09 | 1999-10-05 | Optical Coating Laboratory, Inc. | Laser scribe and break process |
-
2000
- 2000-05-22 KR KR1020000027386A patent/KR100626983B1/ko active IP Right Grant
- 2000-06-01 TW TW089110663A patent/TW495409B/zh not_active IP Right Cessation
- 2000-06-15 US US09/593,928 patent/US6423930B1/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100804362B1 (ko) * | 2002-02-21 | 2008-02-15 | 주식회사 엘지이아이 | 반도체 웨이퍼의 절단방법 |
US7780493B2 (en) | 2007-01-12 | 2010-08-24 | Samsung Mobile Display Co., Ltd. | Method of manufacturing flat panel display device |
KR20110138727A (ko) * | 2010-06-21 | 2011-12-28 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지, 조명 시스템, 및 레이저 스크라이빙 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100626983B1 (ko) | 2006-09-22 |
TW495409B (en) | 2002-07-21 |
US6423930B1 (en) | 2002-07-23 |
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