KR19990037402A - 방전 램프, 방전 램프 장치, 형광 램프 및 형광 램프 장치 - Google Patents
방전 램프, 방전 램프 장치, 형광 램프 및 형광 램프 장치 Download PDFInfo
- Publication number
- KR19990037402A KR19990037402A KR1019980044954A KR19980044954A KR19990037402A KR 19990037402 A KR19990037402 A KR 19990037402A KR 1019980044954 A KR1019980044954 A KR 1019980044954A KR 19980044954 A KR19980044954 A KR 19980044954A KR 19990037402 A KR19990037402 A KR 19990037402A
- Authority
- KR
- South Korea
- Prior art keywords
- support member
- indium
- discharge lamp
- bulb
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229910052738 indium Inorganic materials 0.000 claims abstract description 164
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 163
- 229910000497 Amalgam Inorganic materials 0.000 claims abstract description 142
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims description 90
- 239000002184 metal Substances 0.000 claims description 90
- 238000007747 plating Methods 0.000 claims description 66
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 52
- 229910052753 mercury Inorganic materials 0.000 claims description 47
- 238000000576 coating method Methods 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000006243 chemical reaction Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 30
- 239000011651 chromium Substances 0.000 claims description 23
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 18
- 229910052804 chromium Inorganic materials 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims description 13
- 239000011733 molybdenum Substances 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 9
- 238000001523 electrospinning Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000010953 base metal Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 abstract description 40
- 230000004907 flux Effects 0.000 abstract description 36
- 229910045601 alloy Inorganic materials 0.000 abstract description 15
- 239000000956 alloy Substances 0.000 abstract description 15
- 239000000155 melt Substances 0.000 abstract description 14
- 238000003466 welding Methods 0.000 abstract description 10
- 239000011888 foil Substances 0.000 description 22
- 238000005192 partition Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229920001707 polybutylene terephthalate Polymers 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 229920003002 synthetic resin Polymers 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 229910000846 In alloy Inorganic materials 0.000 description 6
- 229910052797 bismuth Inorganic materials 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000002542 deteriorative effect Effects 0.000 description 5
- -1 oxides thereof Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 229910001295 No alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012412 chemical coupling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
- H01J61/361—Seals between parts of vessel
Landscapes
- Vessels And Coating Films For Discharge Lamps (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30110697 | 1997-10-31 | ||
| JP97-301106 | 1997-10-31 | ||
| JP35902197 | 1997-12-26 | ||
| JP97-359021 | 1997-12-26 | ||
| JP98-156271 | 1998-06-04 | ||
| JP15627198 | 1998-06-04 | ||
| JP18433998 | 1998-06-30 | ||
| JP98-184339 | 1998-06-30 | ||
| JP28082698A JP3925591B2 (ja) | 1997-10-31 | 1998-10-02 | 放電ランプ、放電ランプ装置、蛍光ランプおよび蛍光ランプ装置 |
| JP98-280826 | 1998-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990037402A true KR19990037402A (ko) | 1999-05-25 |
Family
ID=27528109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980044954A Ceased KR19990037402A (ko) | 1997-10-31 | 1998-10-27 | 방전 램프, 방전 램프 장치, 형광 램프 및 형광 램프 장치 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3925591B2 (enExample) |
| KR (1) | KR19990037402A (enExample) |
| CN (1) | CN1216857A (enExample) |
| TW (1) | TW384496B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543922C (zh) | 2003-02-17 | 2009-09-23 | 东芝照明技术株式会社 | 荧光灯、球形荧光灯和照明装置 |
| ITMI20042516A1 (it) * | 2004-12-27 | 2005-03-27 | Getters Spa | Processo per produrre mediante deposizione di lega bassofondente dispositivi portanti almeno un materiale attivo |
| CN115667788A (zh) * | 2020-05-28 | 2023-01-31 | 昕诺飞控股有限公司 | 一种灯泡 |
-
1998
- 1998-10-02 JP JP28082698A patent/JP3925591B2/ja not_active Expired - Fee Related
- 1998-10-12 TW TW087116916A patent/TW384496B/zh not_active IP Right Cessation
- 1998-10-27 KR KR1019980044954A patent/KR19990037402A/ko not_active Ceased
- 1998-10-30 CN CN98123820A patent/CN1216857A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP3925591B2 (ja) | 2007-06-06 |
| JP2000082440A (ja) | 2000-03-21 |
| CN1216857A (zh) | 1999-05-19 |
| TW384496B (en) | 2000-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19981027 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19981027 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20001031 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20010628 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20001031 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |