KR19980079734A - 스퍼터링용 타켓트 및 피막형성방법 - Google Patents

스퍼터링용 타켓트 및 피막형성방법 Download PDF

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Publication number
KR19980079734A
KR19980079734A KR1019980004823A KR19980004823A KR19980079734A KR 19980079734 A KR19980079734 A KR 19980079734A KR 1019980004823 A KR1019980004823 A KR 1019980004823A KR 19980004823 A KR19980004823 A KR 19980004823A KR 19980079734 A KR19980079734 A KR 19980079734A
Authority
KR
South Korea
Prior art keywords
cobalt
alloy
nickel
silicon
target
Prior art date
Application number
KR1019980004823A
Other languages
English (en)
Korean (ko)
Inventor
유 이치로 나카무라
가즈시게 다카하시
Original Assignee
노미세마 아키히니
가부시키가이샤 자팬 에너지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노미세마 아키히니, 가부시키가이샤 자팬 에너지 filed Critical 노미세마 아키히니
Publication of KR19980079734A publication Critical patent/KR19980079734A/ko

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1019980004823A 1997-03-17 1998-02-17 스퍼터링용 타켓트 및 피막형성방법 KR19980079734A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1997-082451 1997-03-17
JP08245197A JP3532063B2 (ja) 1997-03-17 1997-03-17 スパッタリング用ターゲットおよび皮膜形成方法

Publications (1)

Publication Number Publication Date
KR19980079734A true KR19980079734A (ko) 1998-11-25

Family

ID=13774890

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980004823A KR19980079734A (ko) 1997-03-17 1998-02-17 스퍼터링용 타켓트 및 피막형성방법

Country Status (3)

Country Link
JP (1) JP3532063B2 (ja)
KR (1) KR19980079734A (ja)
TW (1) TW426748B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793888B1 (fr) * 1999-05-20 2002-06-28 Saint Gobain Vitrage Dispositif electrochimique
JP2003213407A (ja) * 2002-01-24 2003-07-30 Nikko Materials Co Ltd 高純度ニッケル又はニッケル合金スパッタリングターゲット及びその製造方法
JP5113100B2 (ja) * 2009-01-28 2013-01-09 Jx日鉱日石金属株式会社 高純度ニッケル合金ターゲット
TWI502092B (zh) 2010-03-19 2015-10-01 Jx Nippon Mining & Metals Corp Nickel alloy sputtering target, Ni alloy film and silicon nitride film
JP6340621B2 (ja) * 2013-07-26 2018-06-13 三菱マテリアル株式会社 Niスパッタリングターゲット及びその製造方法
JP6254823B2 (ja) * 2013-11-01 2017-12-27 Jx金属株式会社 ニッケルシリサイドスパッタリングターゲット及びその製造方法

Also Published As

Publication number Publication date
JPH10251848A (ja) 1998-09-22
TW426748B (en) 2001-03-21
JP3532063B2 (ja) 2004-05-31

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application