KR19980079734A - 스퍼터링용 타켓트 및 피막형성방법 - Google Patents
스퍼터링용 타켓트 및 피막형성방법 Download PDFInfo
- Publication number
- KR19980079734A KR19980079734A KR1019980004823A KR19980004823A KR19980079734A KR 19980079734 A KR19980079734 A KR 19980079734A KR 1019980004823 A KR1019980004823 A KR 1019980004823A KR 19980004823 A KR19980004823 A KR 19980004823A KR 19980079734 A KR19980079734 A KR 19980079734A
- Authority
- KR
- South Korea
- Prior art keywords
- cobalt
- alloy
- nickel
- silicon
- target
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1997-082451 | 1997-03-17 | ||
JP08245197A JP3532063B2 (ja) | 1997-03-17 | 1997-03-17 | スパッタリング用ターゲットおよび皮膜形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR19980079734A true KR19980079734A (ko) | 1998-11-25 |
Family
ID=13774890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980004823A KR19980079734A (ko) | 1997-03-17 | 1998-02-17 | 스퍼터링용 타켓트 및 피막형성방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3532063B2 (ja) |
KR (1) | KR19980079734A (ja) |
TW (1) | TW426748B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2793888B1 (fr) * | 1999-05-20 | 2002-06-28 | Saint Gobain Vitrage | Dispositif electrochimique |
JP2003213407A (ja) * | 2002-01-24 | 2003-07-30 | Nikko Materials Co Ltd | 高純度ニッケル又はニッケル合金スパッタリングターゲット及びその製造方法 |
JP5113100B2 (ja) * | 2009-01-28 | 2013-01-09 | Jx日鉱日石金属株式会社 | 高純度ニッケル合金ターゲット |
TWI502092B (zh) | 2010-03-19 | 2015-10-01 | Jx Nippon Mining & Metals Corp | Nickel alloy sputtering target, Ni alloy film and silicon nitride film |
JP6340621B2 (ja) * | 2013-07-26 | 2018-06-13 | 三菱マテリアル株式会社 | Niスパッタリングターゲット及びその製造方法 |
JP6254823B2 (ja) * | 2013-11-01 | 2017-12-27 | Jx金属株式会社 | ニッケルシリサイドスパッタリングターゲット及びその製造方法 |
-
1997
- 1997-03-17 JP JP08245197A patent/JP3532063B2/ja not_active Expired - Lifetime
-
1998
- 1998-02-17 TW TW087102141A patent/TW426748B/zh not_active IP Right Cessation
- 1998-02-17 KR KR1019980004823A patent/KR19980079734A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH10251848A (ja) | 1998-09-22 |
TW426748B (en) | 2001-03-21 |
JP3532063B2 (ja) | 2004-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |