KR102950304B1 - 분사 조립체를 포함한 비-접촉 침착 시스템 - Google Patents

분사 조립체를 포함한 비-접촉 침착 시스템

Info

Publication number
KR102950304B1
KR102950304B1 KR1020227018710A KR20227018710A KR102950304B1 KR 102950304 B1 KR102950304 B1 KR 102950304B1 KR 1020227018710 A KR1020227018710 A KR 1020227018710A KR 20227018710 A KR20227018710 A KR 20227018710A KR 102950304 B1 KR102950304 B1 KR 102950304B1
Authority
KR
South Korea
Prior art keywords
fluid
orifice
deposition system
valve
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227018710A
Other languages
English (en)
Korean (ko)
Other versions
KR20220151155A (ko
Inventor
윌리엄 에이. 부스키크
Original Assignee
매튜 인터내셔널 코포레이션
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Publication of KR20220151155A publication Critical patent/KR20220151155A/ko
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/02—Burettes; Pipettes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/02—Burettes; Pipettes
    • B01L3/0241—Drop counters; Drop formers
    • B01L3/0268—Drop counters; Drop formers using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502738—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by integrated valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50—Means for feeding of material, e.g. heads
    • B22F12/53—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B29C64/209—Heads; Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14282—Structure of print heads with piezoelectric elements of cantilever type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/04—Closures and closing means
    • B01L2300/041—Connecting closures to device or container
    • B01L2300/044—Connecting closures to device or container pierceable, e.g. films, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0681—Filter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0433—Moving fluids with specific forces or mechanical means specific forces vibrational forces
    • B01L2400/0439—Moving fluids with specific forces or mechanical means specific forces vibrational forces ultrasonic vibrations, vibrating piezo elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/06—Valves, specific forms thereof
    • B01L2400/0633—Valves, specific forms thereof with moving parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
    • G01N2035/1027—General features of the devices
    • G01N2035/1034—Transferring microquantities of liquid
    • G01N2035/1041—Ink-jet like dispensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Clinical Laboratory Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Coating Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Micromachines (AREA)
  • Nozzles (AREA)
KR1020227018710A 2019-11-01 2020-10-30 분사 조립체를 포함한 비-접촉 침착 시스템 Active KR102950304B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962929271P 2019-11-01 2019-11-01
US62/929,271 2019-11-01
PCT/US2020/058136 WO2021087218A1 (en) 2019-11-01 2020-10-30 Non-contact deposition systems including jetting assemblies

Publications (2)

Publication Number Publication Date
KR20220151155A KR20220151155A (ko) 2022-11-14
KR102950304B1 true KR102950304B1 (ko) 2026-04-10

Family

ID=75688640

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227018710A Active KR102950304B1 (ko) 2019-11-01 2020-10-30 분사 조립체를 포함한 비-접촉 침착 시스템

Country Status (11)

Country Link
US (1) US12358014B2 (https=)
EP (1) EP4051931A4 (https=)
JP (1) JP7627540B2 (https=)
KR (1) KR102950304B1 (https=)
CN (1) CN114930058A (https=)
AU (1) AU2020376904B2 (https=)
BR (1) BR112022008418A2 (https=)
CA (1) CA3156779A1 (https=)
MX (1) MX2022005266A (https=)
TW (1) TW202133944A (https=)
WO (1) WO2021087218A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11479041B2 (en) 2018-05-11 2022-10-25 Matthews International Corporation Systems and methods for sealing micro-valves for use in jetting assemblies
US10994535B2 (en) 2018-05-11 2021-05-04 Matthews International Corporation Systems and methods for controlling operation of micro-valves for use in jetting assemblies
US11639057B2 (en) 2018-05-11 2023-05-02 Matthews International Corporation Methods of fabricating micro-valves and jetting assemblies including such micro-valves
WO2019215668A1 (en) 2018-05-11 2019-11-14 Matthews International Corporation Micro-valves for use in jetting assemblies

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030076649A1 (en) * 1997-10-14 2003-04-24 Stuart Speakman Method of forming an electronic device
US20110073188A1 (en) * 2009-09-30 2011-03-31 Marcus Michael A Microvalve for control of compressed fluids
US20160189494A1 (en) * 2014-12-31 2016-06-30 Immersion Corporation Systems and methods for providing enhanced haptic feedback
US20180056288A1 (en) * 2014-10-22 2018-03-01 The Regents Of The University Of California High Definition Microdroplet Printer

Family Cites Families (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2527647C3 (de) 1975-06-20 1981-06-25 Siemens AG, 1000 Berlin und 8000 München Mit Flüssigkeitströpfchen arbeitendes Schreibgerät
US4340083A (en) 1978-11-30 1982-07-20 Carleton Controls Corporation Deflectable beam valve
DE3114192A1 (de) 1981-04-08 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Mit fluessigkeitstroepfchen arbeitendes schreibgeraet
JPS57197176A (en) 1981-05-30 1982-12-03 Konishiroku Photo Ind Co Ltd Ink feeding device in ink jet printer
US4450375A (en) 1982-11-12 1984-05-22 Kiwi Coders Corporation Piezoelectric fluid control device
DE3428969A1 (de) 1984-08-06 1986-02-13 Siemens AG, 1000 Berlin und 8000 München Steuervorrichtung zur luftklappenbetaetigung
US4564846A (en) 1984-10-26 1986-01-14 Kiwi Coders Corporation Drop on demand dot matrix printing head
GB8507688D0 (en) 1985-03-25 1985-05-01 Lane International Ltd John Fluid applicator
US4629926A (en) 1985-10-21 1986-12-16 Kiwi Coders Corporation Mounting for piezoelectric bender of fluid control device
DE3608550A1 (de) 1986-03-14 1987-09-17 Festo Kg Piezo-elektrisch betaetigbares ventil
EP0243249A1 (fr) 1986-04-18 1987-10-28 Maurice Carre Dispositif de distribution, notamment à usage médical, d'un produit suivant des quantités dosées prédéterminées
JPH0694014B2 (ja) 1986-11-07 1994-11-24 マークテック株式会社 小型高速スプレ−ガン
GB8700203D0 (en) 1987-01-07 1987-02-11 Domino Printing Sciences Plc Ink jet printing head
JPH0773913B2 (ja) 1987-07-14 1995-08-09 マークテック株式会社 高速スプレ−ガンの制御方法
EP0337429B1 (en) 1988-04-12 1993-07-07 Seiko Epson Corporation Ink jet head
JPH0233979A (ja) 1988-07-22 1990-02-05 Matsushita Electron Corp 光半導体装置
JP2819141B2 (ja) 1989-02-13 1998-10-30 株式会社エー・アンド・デイ 定速排気装置および定速排気装置の制御方法
JPH02273242A (ja) 1989-04-14 1990-11-07 Seiko Epson Corp インクジェットヘッド
DE3935474A1 (de) 1989-06-22 1991-01-03 Hoechst Ceram Tec Ag Piezoelektrischer biegewandler und seine verwendung
US5072959A (en) 1990-11-09 1991-12-17 Marullo Gaetano C Boat carrier
WO1992013664A1 (en) 1991-02-01 1992-08-20 Kaufman Sydney M Method of recycling scrap metal
US5126755A (en) 1991-03-26 1992-06-30 Videojet Systems International, Inc. Print head assembly for ink jet printer
DE4119955C2 (de) 1991-06-18 2000-05-31 Danfoss As Miniatur-Betätigungselement
AT396392B (de) 1991-09-30 1993-08-25 Hoerbiger Fluidtechnik Gmbh Piezo-ventil
US5441597A (en) 1992-12-01 1995-08-15 Honeywell Inc. Microstructure gas valve control forming method
GB9302170D0 (en) 1993-02-04 1993-03-24 Domino Printing Sciences Plc Ink jet printer
US5619177A (en) 1995-01-27 1997-04-08 Mjb Company Shape memory alloy microactuator having an electrostatic force and heating means
JPH0911471A (ja) 1995-04-26 1997-01-14 Canon Inc 液体吐出方法、液体吐出ヘッド、ヘッドカートリッジ、液体吐出装置、及び液体吐出ヘッドキット
GB9610819D0 (en) 1996-05-22 1996-07-31 Lucas Ind Plc Valve arrangement
US5810325A (en) 1996-06-25 1998-09-22 Bcam International, Inc. Microvalve
DE19626428A1 (de) 1996-07-01 1998-01-15 Heinzl Joachim Tröpfchenwolkenerzeuger
DE19648730C2 (de) 1996-11-25 1998-11-19 Fraunhofer Ges Forschung Piezoelektrisch betätigtes Mikroventil
US6024340A (en) 1996-12-04 2000-02-15 Active Control Experts, Inc. Valve assembly
US6557977B1 (en) 1997-07-15 2003-05-06 Silverbrook Research Pty Ltd Shape memory alloy ink jet printing mechanism
JPH11105274A (ja) 1997-10-03 1999-04-20 Marktec Corp マーキング装置
US5901939A (en) 1997-10-09 1999-05-11 Honeywell Inc. Buckled actuator with enhanced restoring force
DE29819856U1 (de) 1998-11-06 1999-01-14 Festo AG & Co, 73734 Esslingen Steuerglied eines Piezoventils
DE19857247C1 (de) 1998-12-11 2000-01-27 Bosch Gmbh Robert Piezoelektrischer Aktor
GB9828476D0 (en) 1998-12-24 1999-02-17 Xaar Technology Ltd Apparatus for depositing droplets of fluid
US6358021B1 (en) 1998-12-29 2002-03-19 Honeywell International Inc. Electrostatic actuators for active surfaces
DE19911399C2 (de) 1999-03-15 2001-03-01 Joachim Heinzl Verfahren zum Ansteuern eines Piezo-Druckkopfes und nach diesem Verfahren angesteuerter Piezo-Druckkopf
US6164621A (en) 1999-07-09 2000-12-26 Deka Products Limited Partnership Simplified piezoelectric valve
DE19957959C1 (de) 1999-12-02 2001-01-18 Festo Ag & Co Piezoventil und Verfahren zur Herstellung eines Piezoventils
EP1106882A3 (de) 1999-12-09 2002-11-13 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Piezoelektrisch betätigbares Ventil
US6676249B2 (en) 1999-12-17 2004-01-13 Eastman Kodak Company Continuous color ink jet print head apparatus and method
JP4288399B2 (ja) 2000-03-31 2009-07-01 富士フイルム株式会社 マルチノズルインクジェットヘッド及びその製造方法
KR100406939B1 (ko) 2000-07-25 2003-11-21 삼성전자주식회사 잉크젯 프린터 헤드
US6590267B1 (en) 2000-09-14 2003-07-08 Mcnc Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods
DE10048376C2 (de) 2000-09-29 2002-09-19 Fraunhofer Ges Forschung Mikroventil mit einem normalerweise geschlossenen Zustand
US6352337B1 (en) 2000-11-08 2002-03-05 Eastman Kodak Company Assisted drop-on-demand inkjet printer using deformable micro-acuator
ES2190393T3 (es) 2000-11-20 2003-08-01 Festo Ag & Co Valvula piezoelectrica.
DE10133939C2 (de) 2001-07-12 2003-11-06 Tally Computerdrucker Gmbh Verfahren zum Herstellen eines Tropfenerzeugers für Mikrotropfen, insbesondere eines Düsenkopfes für Tintendrucker und Tropfenerzeuger
US6464341B1 (en) 2002-02-08 2002-10-15 Eastman Kodak Company Dual action thermal actuator and method of operating thereof
EP1367307B1 (de) 2002-05-31 2004-07-21 FESTO AG & Co Piezoventil
US7083270B2 (en) 2002-06-20 2006-08-01 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus
AT412366B (de) 2002-10-15 2005-01-25 Hygrama Ag Ventil
US7159841B2 (en) 2002-11-07 2007-01-09 The United States Of America As Represented By The United States Department Of Energy Piezoelectric axial flow microvalve
JP2004308554A (ja) 2003-04-07 2004-11-04 Alps Electric Co Ltd 流体ポンプ
US6988706B2 (en) 2003-12-17 2006-01-24 General Electric Company Piezoelectric microvalve
DE102004008009A1 (de) 2003-12-23 2005-07-28 Robert Bosch Gmbh Integriertes Mikroventil und Verfahren zum Herstellen eines Mikroventils
DK1564464T3 (da) 2004-02-11 2006-05-29 Festo Ag & Co Piezoventil
DE502004006313D1 (de) * 2004-03-10 2008-04-10 Festo Ag & Co Pneumatisches Mikroventil
US7249823B2 (en) 2004-05-24 2007-07-31 Macronix International Co., Ltd. Fluid ejection device
EP1789707A2 (en) 2004-07-23 2007-05-30 AFA Controls, LLC Methods of operating microvalve assemblies and related structures and related devices
DE102004035844B3 (de) 2004-07-23 2005-10-20 Siemens Ag Servoventil
KR20060039111A (ko) 2004-11-02 2006-05-08 삼성전자주식회사 캔틸레버 액츄에이터를 구비한 잉크젯 프린트헤드
JP4022674B2 (ja) 2005-03-17 2007-12-19 富士フイルム株式会社 液体吐出ヘッド、画像形成装置及び液体吐出ヘッドの製造方法
WO2006122180A2 (en) 2005-05-10 2006-11-16 Par Technologies Llc Disposable fluid container with integrated pump motive assembly
JP5116284B2 (ja) 2005-11-08 2013-01-09 キヤノン株式会社 画像形成装置及びプリントジョブ処理装置
CN201022022Y (zh) 2006-11-09 2008-02-13 大连交通大学 一种电信号到气信号的转换装置
DE102007034049B3 (de) 2007-07-19 2008-06-12 Hoerbiger Automatisierungstechnik Holding Gmbh Piezoelektrisches Ventil
DE102007033529A1 (de) 2007-07-19 2009-01-22 Hoerbiger Automatisierungstechnik Holding Gmbh Piezoelektrisches Ventil
JP2009057207A (ja) 2007-08-07 2009-03-19 Seiko Epson Corp シート吸着装置、搬送装置および画像形成装置
JP2009243911A (ja) 2008-03-28 2009-10-22 Toray Ind Inc 欠陥検査システム
WO2010051247A2 (en) 2008-10-31 2010-05-06 Fujifilm Dimatix, Inc. Shaping a nozzle outlet
JP2010208049A (ja) 2009-03-06 2010-09-24 Seiko Epson Corp 流体噴射装置及びバルブユニット
WO2010144343A2 (en) 2009-06-09 2010-12-16 Videojet Technologies Inc. Stream printing method
US8556373B2 (en) 2009-06-19 2013-10-15 Burkhard Buestgens Multichannel-printhead or dosing head
US20110073788A1 (en) 2009-09-30 2011-03-31 Marcus Michael A Microvalve for control of compressed fluids
JP5688140B2 (ja) 2010-06-29 2015-03-25 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 同一平面上の電極を有した圧電アクチュエータ
US8529021B2 (en) 2011-04-19 2013-09-10 Eastman Kodak Company Continuous liquid ejection using compliant membrane transducer
JP2012241824A (ja) 2011-05-20 2012-12-10 Nsk Ltd パックシール付軸受ユニット
CN103056367B (zh) * 2012-12-29 2015-07-29 大连理工大学 一种基于脉冲小孔液滴喷射三维快速成型的方法及装置
US20140333703A1 (en) 2013-05-10 2014-11-13 Matthews Resources, Inc. Cantilevered Micro-Valve and Inkjet Printer Using Said Valve
GB2517904A (en) * 2013-07-31 2015-03-11 Ingegneria Ceramica S R L An Improved Obturator and Method of Fabrication Thereof
GB2516845A (en) * 2013-07-31 2015-02-11 Ingegneria Ceramica S R L An Improved Actuator and Method of Driving Thereof
ES2561727B1 (es) 2014-08-29 2017-03-24 Kerajet S.A. Dispositivo, método y máquina de deposición de fluidos sobre una superficie
JP2016132188A (ja) 2015-01-20 2016-07-25 セイコーエプソン株式会社 圧力調整弁、液体噴射ヘッド及び液体噴射装置
JP2016132189A (ja) 2015-01-20 2016-07-25 セイコーエプソン株式会社 圧力調整弁、液体噴射ヘッド及び液体噴射装置
EP3325611B1 (en) * 2015-07-22 2020-03-18 Inventia Life Science Pty Ltd. Process for printing 3d tissue culture models
US9790883B2 (en) * 2015-07-23 2017-10-17 Caterpillar Inc. System for sensing and controlling fuel gas constituent levels
GB2546097B (en) * 2016-01-08 2020-12-30 Xaar Technology Ltd Droplet deposition head
US9975347B2 (en) 2016-01-08 2018-05-22 Canon Kabushiki Kaisha Liquid ejection apparatus and liquid ejection method
JP2017174985A (ja) 2016-03-24 2017-09-28 キヤノン株式会社 シリコン基板の加工方法
US9902152B2 (en) * 2016-06-30 2018-02-27 Intel Corporation Piezoelectric package-integrated synthetic jet devices
JP6776685B2 (ja) 2016-07-21 2020-10-28 セイコーエプソン株式会社 流体吐出装置
JP2018083385A (ja) 2016-11-25 2018-05-31 キヤノン株式会社 膜の形成方法
JP2018094845A (ja) 2016-12-15 2018-06-21 キヤノン株式会社 液体吐出ヘッド
JP6873836B2 (ja) 2017-06-19 2021-05-19 キヤノン株式会社 液体吐出ヘッドの製造方法
JP2019005988A (ja) 2017-06-23 2019-01-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置
US11448958B2 (en) 2017-09-21 2022-09-20 Canon Kabushiki Kaisha System and method for controlling the placement of fluid resist droplets
US11479041B2 (en) * 2018-05-11 2022-10-25 Matthews International Corporation Systems and methods for sealing micro-valves for use in jetting assemblies
US10994535B2 (en) 2018-05-11 2021-05-04 Matthews International Corporation Systems and methods for controlling operation of micro-valves for use in jetting assemblies
WO2019215668A1 (en) 2018-05-11 2019-11-14 Matthews International Corporation Micro-valves for use in jetting assemblies
CN112352123B (zh) * 2018-05-11 2023-05-12 马修斯国际公司 用于在喷射组件中使用的微型阀的电极结构
US11639057B2 (en) 2018-05-11 2023-05-02 Matthews International Corporation Methods of fabricating micro-valves and jetting assemblies including such micro-valves
CN110301938A (zh) 2019-07-15 2019-10-08 无锡海斯凯尔医学技术有限公司 探头和组织弹性检测系统

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030076649A1 (en) * 1997-10-14 2003-04-24 Stuart Speakman Method of forming an electronic device
US20110073188A1 (en) * 2009-09-30 2011-03-31 Marcus Michael A Microvalve for control of compressed fluids
US20180056288A1 (en) * 2014-10-22 2018-03-01 The Regents Of The University Of California High Definition Microdroplet Printer
US20160189494A1 (en) * 2014-12-31 2016-06-30 Immersion Corporation Systems and methods for providing enhanced haptic feedback

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