KR102896987B1 - 중공 수지 입자, 그 제조 방법, 및 그 용도 - Google Patents

중공 수지 입자, 그 제조 방법, 및 그 용도

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Publication number
KR102896987B1
KR102896987B1 KR1020237019183A KR20237019183A KR102896987B1 KR 102896987 B1 KR102896987 B1 KR 102896987B1 KR 1020237019183 A KR1020237019183 A KR 1020237019183A KR 20237019183 A KR20237019183 A KR 20237019183A KR 102896987 B1 KR102896987 B1 KR 102896987B1
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KR
South Korea
Prior art keywords
hollow
hollow resin
resin particles
monomer
compound
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KR1020237019183A
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English (en)
Korean (ko)
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KR20230104260A (ko
Inventor
하루히코 마츠우라
신야 마츠노
Original Assignee
세키스이가세이힝코교가부시키가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F12/36—Divinylbenzene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B01J13/18—In situ polymerisation with all reactants being present in the same phase
    • B01J13/185—In situ polymerisation with all reactants being present in the same phase in an organic phase
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/02—Homopolymers or copolymers of hydrocarbons
    • C09D125/16—Homopolymers or copolymers of alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR1020237019183A 2020-12-17 2021-12-09 중공 수지 입자, 그 제조 방법, 및 그 용도 Active KR102896987B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-209335 2020-12-17
JP2020209335 2020-12-17
PCT/JP2021/045347 WO2022131127A1 (ja) 2020-12-17 2021-12-09 中空樹脂粒子、その製造方法、およびその用途

Publications (2)

Publication Number Publication Date
KR20230104260A KR20230104260A (ko) 2023-07-07
KR102896987B1 true KR102896987B1 (ko) 2025-12-05

Family

ID=82059152

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237019183A Active KR102896987B1 (ko) 2020-12-17 2021-12-09 중공 수지 입자, 그 제조 방법, 및 그 용도

Country Status (6)

Country Link
US (1) US20230391900A1 (https=)
EP (1) EP4265647A4 (https=)
JP (4) JP7175447B1 (https=)
KR (1) KR102896987B1 (https=)
CN (1) CN116583544A (https=)
WO (1) WO2022131127A1 (https=)

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US20240059847A1 (en) * 2020-12-17 2024-02-22 Sekisui Kasei Co., Ltd. Hollow resin particles, production method therefor, and use thereof
EP4480976A4 (en) * 2022-02-18 2026-01-21 Sekisui Kasei Co Ltd HOLLOW RESIN PARTICLES, THEIR PRODUCTION PROCESS AND THEIR USES
JP7396735B1 (ja) * 2022-11-25 2023-12-12 三水株式会社 中空粒子の製造方法
JPWO2024172129A1 (https=) * 2023-02-17 2024-08-22
WO2024203876A1 (ja) * 2023-03-24 2024-10-03 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途
CN121532448A (zh) * 2023-07-21 2026-02-13 积水化成品工业株式会社 树脂粒子及半导体构件用树脂组合物
KR20260026590A (ko) * 2023-09-08 2026-02-26 세키스이가세이힝코교가부시키가이샤 중공 수지 입자, 그 제조 방법, 및 그 용도
WO2025135137A1 (ja) * 2023-12-21 2025-06-26 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途
WO2026070397A1 (ja) * 2024-09-30 2026-04-02 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Citations (3)

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JP2002080503A (ja) 2000-09-04 2002-03-19 New Industry Research Organization 中空高分子微粒子及びその製造法
JP2009120806A (ja) 2007-10-22 2009-06-04 Sekisui Chem Co Ltd 多孔質中空ポリマー粒子、多孔質中空ポリマー粒子の製造方法、香料担持ポリマー粒子、及び、香料担持ポリマー粒子の製造方法
JP2017160399A (ja) * 2016-03-11 2017-09-14 旭化成株式会社 微少空隙を有するポリフェニレンエーテル紛体と製造方法

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US4782098A (en) * 1987-06-12 1988-11-01 General Electric, Co. Expandable thermoplastic resin beads
NL8900497A (nl) * 1989-03-01 1990-10-01 Gen Electric Werkwijze voor het bereiden van korrels polyfenyleentherpolystyreen, gevormde korrels.
JPH10279725A (ja) * 1997-04-04 1998-10-20 Achilles Corp 耐熱性発泡樹脂粒子およびその製造方法
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP4409683B2 (ja) 1999-11-12 2010-02-03 ダイセル化学工業株式会社 光学的造形用樹脂組成物、その製造方法及び光学的造形物
JP4171489B2 (ja) 2003-01-28 2008-10-22 松下電工株式会社 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板
JP4445495B2 (ja) 2006-08-17 2010-04-07 積水化学工業株式会社 多孔質中空ポリマー粒子、多孔質中空ポリマー粒子の製造方法、多孔質セラミックフィルタおよび多孔質セラミックフィルタの製造方法
JP2008266504A (ja) * 2007-04-24 2008-11-06 Konica Minolta Business Technologies Inc 中空粒子の製造方法
KR101294925B1 (ko) * 2008-05-21 2013-08-08 도레이 카부시키가이샤 중합체 미립자의 제조 방법
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US11883790B2 (en) * 2018-03-14 2024-01-30 Sekisui Kasei Co., Ltd. Hollow particles, method for producing same, and usage of same
JP6513273B1 (ja) 2018-08-31 2019-05-15 三井化学株式会社 樹脂粒子
CN109836631A (zh) * 2019-02-02 2019-06-04 广东生益科技股份有限公司 乙烯基热固性树脂组合物、预浸料、层压板和印制电路板

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JP2002080503A (ja) 2000-09-04 2002-03-19 New Industry Research Organization 中空高分子微粒子及びその製造法
JP2009120806A (ja) 2007-10-22 2009-06-04 Sekisui Chem Co Ltd 多孔質中空ポリマー粒子、多孔質中空ポリマー粒子の製造方法、香料担持ポリマー粒子、及び、香料担持ポリマー粒子の製造方法
JP2017160399A (ja) * 2016-03-11 2017-09-14 旭化成株式会社 微少空隙を有するポリフェニレンエーテル紛体と製造方法

Also Published As

Publication number Publication date
JPWO2022131127A1 (https=) 2022-06-23
JP7175447B1 (ja) 2022-11-21
KR20230104260A (ko) 2023-07-07
EP4265647A4 (en) 2024-11-20
CN116583544A (zh) 2023-08-11
WO2022131127A1 (ja) 2022-06-23
US20230391900A1 (en) 2023-12-07
JP7656123B2 (ja) 2025-04-02
EP4265647A1 (en) 2023-10-25
JP2024109662A (ja) 2024-08-14
JP2023021971A (ja) 2023-02-14
TW202231714A (zh) 2022-08-16
JP2025094149A (ja) 2025-06-24

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