KR102870970B1 - 얼라이너 장치 - Google Patents

얼라이너 장치

Info

Publication number
KR102870970B1
KR102870970B1 KR1020247002815A KR20247002815A KR102870970B1 KR 102870970 B1 KR102870970 B1 KR 102870970B1 KR 1020247002815 A KR1020247002815 A KR 1020247002815A KR 20247002815 A KR20247002815 A KR 20247002815A KR 102870970 B1 KR102870970 B1 KR 102870970B1
Authority
KR
South Korea
Prior art keywords
wafer
light
control device
defect
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247002815A
Other languages
English (en)
Korean (ko)
Other versions
KR20240041918A (ko
Inventor
하루히코 탄
아비시 아쇽 바르와니
조지 친
사이먼 제야팔란
Original Assignee
카와사키 주코교 카부시키가이샤
카와사키 로보틱스 (유에스에이), 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카와사키 주코교 카부시키가이샤, 카와사키 로보틱스 (유에스에이), 인코포레이티드 filed Critical 카와사키 주코교 카부시키가이샤
Publication of KR20240041918A publication Critical patent/KR20240041918A/ko
Application granted granted Critical
Publication of KR102870970B1 publication Critical patent/KR102870970B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/67288—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H01L21/681—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H01L2223/54493—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/201—Marks applied to devices, e.g. for alignment or identification located on the periphery of wafers, e.g. orientation notches or lot numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020247002815A 2021-06-24 2022-06-02 얼라이너 장치 Active KR102870970B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/357,354 US12148646B2 (en) 2021-06-24 2021-06-24 Aligner apparatus
US17/357,354 2021-06-24
PCT/JP2022/022447 WO2022270265A1 (ja) 2021-06-24 2022-06-02 アライナ装置

Publications (2)

Publication Number Publication Date
KR20240041918A KR20240041918A (ko) 2024-04-01
KR102870970B1 true KR102870970B1 (ko) 2025-10-14

Family

ID=84541233

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002815A Active KR102870970B1 (ko) 2021-06-24 2022-06-02 얼라이너 장치

Country Status (6)

Country Link
US (1) US12148646B2 (https=)
JP (1) JP7832199B2 (https=)
KR (1) KR102870970B1 (https=)
CN (1) CN117795656A (https=)
TW (1) TWI843132B (https=)
WO (1) WO2022270265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521882B2 (en) * 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
JP2026019372A (ja) * 2024-07-26 2026-02-05 川崎重工業株式会社 アライナ、ロボットシステム及び基板のアライメント方法
TWM661429U (zh) * 2024-08-05 2024-10-01 三和技研股份有限公司 晶圓定位裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置

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US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
KR100389129B1 (ko) 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
KR20050120861A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 프리 얼라이너를 이용한 웨이퍼 에지 검사 장치 및 그의검사 방법
JP2006128440A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
US7161667B2 (en) * 2005-05-06 2007-01-09 Kla-Tencor Technologies Corporation Wafer edge inspection
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP5022793B2 (ja) * 2007-07-02 2012-09-12 日東電工株式会社 半導体ウエハの欠陥位置検出方法
JP4693817B2 (ja) * 2007-07-02 2011-06-01 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
US9076342B2 (en) * 2008-02-19 2015-07-07 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
CN104407518B (zh) * 2008-06-20 2017-05-31 因文西斯系统公司 对用于过程控制的实际和仿真设施进行交互的系统和方法
WO2012134795A2 (en) * 2011-03-25 2012-10-04 Exxonmobile Upstream Research Company Immersive training environment
US9886029B2 (en) * 2013-12-02 2018-02-06 Daihen Corporation Workpiece processing apparatus and workpiece transfer system
JP6348789B2 (ja) 2014-03-28 2018-06-27 株式会社ダイヘン ワーク処理装置、ワーク搬送システム
AT520964B1 (de) 2018-02-28 2019-11-15 Tatiana Strapacova Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
KR102134034B1 (ko) * 2018-09-12 2020-07-14 블루테크코리아 주식회사 웨이퍼 치핑 검사 및 로봇 반복 정밀도 검사 가능한 얼라이너 및 상기 얼라이너에 의한 웨이퍼 치핑 검사방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置

Also Published As

Publication number Publication date
WO2022270265A1 (ja) 2022-12-29
TW202312339A (zh) 2023-03-16
JP7832199B2 (ja) 2026-03-17
KR20240041918A (ko) 2024-04-01
JPWO2022270265A1 (https=) 2022-12-29
CN117795656A (zh) 2024-03-29
US20220415690A1 (en) 2022-12-29
US12148646B2 (en) 2024-11-19
TWI843132B (zh) 2024-05-21

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