JP7832199B2 - アライナ装置 - Google Patents

アライナ装置

Info

Publication number
JP7832199B2
JP7832199B2 JP2023529770A JP2023529770A JP7832199B2 JP 7832199 B2 JP7832199 B2 JP 7832199B2 JP 2023529770 A JP2023529770 A JP 2023529770A JP 2023529770 A JP2023529770 A JP 2023529770A JP 7832199 B2 JP7832199 B2 JP 7832199B2
Authority
JP
Japan
Prior art keywords
wafer
light
aligner
defects
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023529770A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270265A1 (https=
JPWO2022270265A5 (https=
Inventor
治彦 丹
アビッシュ アショック バロアニー
ジョージ チン
サイモン ジェイパラン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Kawasaki Robotics USA Inc
Original Assignee
Kawasaki Jukogyo KK
Kawasaki Robotics USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK, Kawasaki Robotics USA Inc filed Critical Kawasaki Jukogyo KK
Publication of JPWO2022270265A1 publication Critical patent/JPWO2022270265A1/ja
Publication of JPWO2022270265A5 publication Critical patent/JPWO2022270265A5/ja
Application granted granted Critical
Publication of JP7832199B2 publication Critical patent/JP7832199B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/201—Marks applied to devices, e.g. for alignment or identification located on the periphery of wafers, e.g. orientation notches or lot numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2023529770A 2021-06-24 2022-06-02 アライナ装置 Active JP7832199B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/357,354 US12148646B2 (en) 2021-06-24 2021-06-24 Aligner apparatus
US17/357,354 2021-06-24
PCT/JP2022/022447 WO2022270265A1 (ja) 2021-06-24 2022-06-02 アライナ装置

Publications (3)

Publication Number Publication Date
JPWO2022270265A1 JPWO2022270265A1 (https=) 2022-12-29
JPWO2022270265A5 JPWO2022270265A5 (https=) 2024-03-21
JP7832199B2 true JP7832199B2 (ja) 2026-03-17

Family

ID=84541233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529770A Active JP7832199B2 (ja) 2021-06-24 2022-06-02 アライナ装置

Country Status (6)

Country Link
US (1) US12148646B2 (https=)
JP (1) JP7832199B2 (https=)
KR (1) KR102870970B1 (https=)
CN (1) CN117795656A (https=)
TW (1) TWI843132B (https=)
WO (1) WO2022270265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521882B2 (en) * 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
JP2026019372A (ja) * 2024-07-26 2026-02-05 川崎重工業株式会社 アライナ、ロボットシステム及び基板のアライメント方法
TWM661429U (zh) * 2024-08-05 2024-10-01 三和技研股份有限公司 晶圓定位裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128440A (ja) 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
JP2006128423A (ja) 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP2015195328A (ja) 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

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US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
KR100389129B1 (ko) 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
KR20050120861A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 프리 얼라이너를 이용한 웨이퍼 에지 검사 장치 및 그의검사 방법
US7161667B2 (en) * 2005-05-06 2007-01-09 Kla-Tencor Technologies Corporation Wafer edge inspection
JP5022793B2 (ja) * 2007-07-02 2012-09-12 日東電工株式会社 半導体ウエハの欠陥位置検出方法
US9076342B2 (en) * 2008-02-19 2015-07-07 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
CN104407518B (zh) * 2008-06-20 2017-05-31 因文西斯系统公司 对用于过程控制的实际和仿真设施进行交互的系统和方法
WO2012134795A2 (en) * 2011-03-25 2012-10-04 Exxonmobile Upstream Research Company Immersive training environment
US9886029B2 (en) * 2013-12-02 2018-02-06 Daihen Corporation Workpiece processing apparatus and workpiece transfer system
AT520964B1 (de) 2018-02-28 2019-11-15 Tatiana Strapacova Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
KR102134034B1 (ko) * 2018-09-12 2020-07-14 블루테크코리아 주식회사 웨이퍼 치핑 검사 및 로봇 반복 정밀도 검사 가능한 얼라이너 및 상기 얼라이너에 의한 웨이퍼 치핑 검사방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128440A (ja) 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
JP2006128423A (ja) 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP2015195328A (ja) 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

Also Published As

Publication number Publication date
WO2022270265A1 (ja) 2022-12-29
TW202312339A (zh) 2023-03-16
KR20240041918A (ko) 2024-04-01
JPWO2022270265A1 (https=) 2022-12-29
CN117795656A (zh) 2024-03-29
US20220415690A1 (en) 2022-12-29
KR102870970B1 (ko) 2025-10-14
US12148646B2 (en) 2024-11-19
TWI843132B (zh) 2024-05-21

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