JPWO2022270265A1 - - Google Patents

Info

Publication number
JPWO2022270265A1
JPWO2022270265A1 JP2023529770A JP2023529770A JPWO2022270265A1 JP WO2022270265 A1 JPWO2022270265 A1 JP WO2022270265A1 JP 2023529770 A JP2023529770 A JP 2023529770A JP 2023529770 A JP2023529770 A JP 2023529770A JP WO2022270265 A1 JPWO2022270265 A1 JP WO2022270265A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023529770A
Other languages
Japanese (ja)
Other versions
JP7832199B2 (ja
JPWO2022270265A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2022270265A1 publication Critical patent/JPWO2022270265A1/ja
Publication of JPWO2022270265A5 publication Critical patent/JPWO2022270265A5/ja
Application granted granted Critical
Publication of JP7832199B2 publication Critical patent/JP7832199B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/201—Marks applied to devices, e.g. for alignment or identification located on the periphery of wafers, e.g. orientation notches or lot numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2023529770A 2021-06-24 2022-06-02 アライナ装置 Active JP7832199B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/357,354 US12148646B2 (en) 2021-06-24 2021-06-24 Aligner apparatus
US17/357,354 2021-06-24
PCT/JP2022/022447 WO2022270265A1 (ja) 2021-06-24 2022-06-02 アライナ装置

Publications (3)

Publication Number Publication Date
JPWO2022270265A1 true JPWO2022270265A1 (https=) 2022-12-29
JPWO2022270265A5 JPWO2022270265A5 (https=) 2024-03-21
JP7832199B2 JP7832199B2 (ja) 2026-03-17

Family

ID=84541233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529770A Active JP7832199B2 (ja) 2021-06-24 2022-06-02 アライナ装置

Country Status (6)

Country Link
US (1) US12148646B2 (https=)
JP (1) JP7832199B2 (https=)
KR (1) KR102870970B1 (https=)
CN (1) CN117795656A (https=)
TW (1) TWI843132B (https=)
WO (1) WO2022270265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521882B2 (en) * 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
JP2026019372A (ja) * 2024-07-26 2026-02-05 川崎重工業株式会社 アライナ、ロボットシステム及び基板のアライメント方法
TWM661429U (zh) * 2024-08-05 2024-10-01 三和技研股份有限公司 晶圓定位裝置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
US5365672A (en) * 1993-01-26 1994-11-22 Mecs Corporation Positioning apparatus for a semiconductor wafer
JP2006128440A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
US20090208910A1 (en) * 2008-02-19 2009-08-20 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
US20090319058A1 (en) * 2008-06-20 2009-12-24 Invensys Systems, Inc. Systems and methods for immersive interaction with actual and/or simulated facilities for process, environmental and industrial control
US20140004487A1 (en) * 2011-03-25 2014-01-02 Joseph M. Cheben Immersive Training Environment
JP2015195328A (ja) * 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100389129B1 (ko) 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
KR20050120861A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 프리 얼라이너를 이용한 웨이퍼 에지 검사 장치 및 그의검사 방법
US7161667B2 (en) * 2005-05-06 2007-01-09 Kla-Tencor Technologies Corporation Wafer edge inspection
JP5022793B2 (ja) * 2007-07-02 2012-09-12 日東電工株式会社 半導体ウエハの欠陥位置検出方法
US9886029B2 (en) * 2013-12-02 2018-02-06 Daihen Corporation Workpiece processing apparatus and workpiece transfer system
AT520964B1 (de) 2018-02-28 2019-11-15 Tatiana Strapacova Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
KR102134034B1 (ko) * 2018-09-12 2020-07-14 블루테크코리아 주식회사 웨이퍼 치핑 검사 및 로봇 반복 정밀도 검사 가능한 얼라이너 및 상기 얼라이너에 의한 웨이퍼 치핑 검사방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
US5365672A (en) * 1993-01-26 1994-11-22 Mecs Corporation Positioning apparatus for a semiconductor wafer
JP2006128440A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
US7723211B2 (en) * 2007-07-02 2010-05-25 Nitto Denko Corporation Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer
US20090208910A1 (en) * 2008-02-19 2009-08-20 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
US20090319058A1 (en) * 2008-06-20 2009-12-24 Invensys Systems, Inc. Systems and methods for immersive interaction with actual and/or simulated facilities for process, environmental and industrial control
US20140004487A1 (en) * 2011-03-25 2014-01-02 Joseph M. Cheben Immersive Training Environment
JP2015195328A (ja) * 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

Also Published As

Publication number Publication date
WO2022270265A1 (ja) 2022-12-29
TW202312339A (zh) 2023-03-16
JP7832199B2 (ja) 2026-03-17
KR20240041918A (ko) 2024-04-01
CN117795656A (zh) 2024-03-29
US20220415690A1 (en) 2022-12-29
KR102870970B1 (ko) 2025-10-14
US12148646B2 (en) 2024-11-19
TWI843132B (zh) 2024-05-21

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