JPWO2022270265A5 - - Google Patents

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Publication number
JPWO2022270265A5
JPWO2022270265A5 JP2023529770A JP2023529770A JPWO2022270265A5 JP WO2022270265 A5 JPWO2022270265 A5 JP WO2022270265A5 JP 2023529770 A JP2023529770 A JP 2023529770A JP 2023529770 A JP2023529770 A JP 2023529770A JP WO2022270265 A5 JPWO2022270265 A5 JP WO2022270265A5
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JP
Japan
Prior art keywords
wafer
aligner
defects
control device
edge
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JP2023529770A
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English (en)
Japanese (ja)
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JP7832199B2 (ja
JPWO2022270265A1 (https=
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Priority claimed from US17/357,354 external-priority patent/US12148646B2/en
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Publication of JPWO2022270265A1 publication Critical patent/JPWO2022270265A1/ja
Publication of JPWO2022270265A5 publication Critical patent/JPWO2022270265A5/ja
Application granted granted Critical
Publication of JP7832199B2 publication Critical patent/JP7832199B2/ja
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JP2023529770A 2021-06-24 2022-06-02 アライナ装置 Active JP7832199B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/357,354 US12148646B2 (en) 2021-06-24 2021-06-24 Aligner apparatus
US17/357,354 2021-06-24
PCT/JP2022/022447 WO2022270265A1 (ja) 2021-06-24 2022-06-02 アライナ装置

Publications (3)

Publication Number Publication Date
JPWO2022270265A1 JPWO2022270265A1 (https=) 2022-12-29
JPWO2022270265A5 true JPWO2022270265A5 (https=) 2024-03-21
JP7832199B2 JP7832199B2 (ja) 2026-03-17

Family

ID=84541233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529770A Active JP7832199B2 (ja) 2021-06-24 2022-06-02 アライナ装置

Country Status (6)

Country Link
US (1) US12148646B2 (https=)
JP (1) JP7832199B2 (https=)
KR (1) KR102870970B1 (https=)
CN (1) CN117795656A (https=)
TW (1) TWI843132B (https=)
WO (1) WO2022270265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521882B2 (en) * 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
JP2026019372A (ja) * 2024-07-26 2026-02-05 川崎重工業株式会社 アライナ、ロボットシステム及び基板のアライメント方法
TWM661429U (zh) * 2024-08-05 2024-10-01 三和技研股份有限公司 晶圓定位裝置

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
KR100389129B1 (ko) 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
KR20050120861A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 프리 얼라이너를 이용한 웨이퍼 에지 검사 장치 및 그의검사 방법
JP2006128440A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
JP4450720B2 (ja) 2004-10-29 2010-04-14 富士通マイクロエレクトロニクス株式会社 欠陥検査方法
US7161667B2 (en) * 2005-05-06 2007-01-09 Kla-Tencor Technologies Corporation Wafer edge inspection
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP5022793B2 (ja) * 2007-07-02 2012-09-12 日東電工株式会社 半導体ウエハの欠陥位置検出方法
JP4693817B2 (ja) * 2007-07-02 2011-06-01 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
US9076342B2 (en) * 2008-02-19 2015-07-07 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
CN104407518B (zh) * 2008-06-20 2017-05-31 因文西斯系统公司 对用于过程控制的实际和仿真设施进行交互的系统和方法
WO2012134795A2 (en) * 2011-03-25 2012-10-04 Exxonmobile Upstream Research Company Immersive training environment
US9886029B2 (en) * 2013-12-02 2018-02-06 Daihen Corporation Workpiece processing apparatus and workpiece transfer system
JP6348789B2 (ja) 2014-03-28 2018-06-27 株式会社ダイヘン ワーク処理装置、ワーク搬送システム
AT520964B1 (de) 2018-02-28 2019-11-15 Tatiana Strapacova Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
KR102134034B1 (ko) * 2018-09-12 2020-07-14 블루테크코리아 주식회사 웨이퍼 치핑 검사 및 로봇 반복 정밀도 검사 가능한 얼라이너 및 상기 얼라이너에 의한 웨이퍼 치핑 검사방법

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