TWI843132B - 對準裝置 - Google Patents

對準裝置 Download PDF

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Publication number
TWI843132B
TWI843132B TW111123592A TW111123592A TWI843132B TW I843132 B TWI843132 B TW I843132B TW 111123592 A TW111123592 A TW 111123592A TW 111123592 A TW111123592 A TW 111123592A TW I843132 B TWI843132 B TW I843132B
Authority
TW
Taiwan
Prior art keywords
wafer
light
control device
sensor
defects
Prior art date
Application number
TW111123592A
Other languages
English (en)
Chinese (zh)
Other versions
TW202312339A (zh
Inventor
丹治彦
艾藢許 阿修可 巴瓦尼
甘源 陳
賽門 賈帕連
Original Assignee
日商川崎重工業股份有限公司
美商川崎機器人（美國）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商川崎重工業股份有限公司, 美商川崎機器人（美國）有限公司 filed Critical 日商川崎重工業股份有限公司
Publication of TW202312339A publication Critical patent/TW202312339A/zh
Application granted granted Critical
Publication of TWI843132B publication Critical patent/TWI843132B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/201—Marks applied to devices, e.g. for alignment or identification located on the periphery of wafers, e.g. orientation notches or lot numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW111123592A 2021-06-24 2022-06-24 對準裝置 TWI843132B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/357,354 US12148646B2 (en) 2021-06-24 2021-06-24 Aligner apparatus
US17/357,354 2021-06-24

Publications (2)

Publication Number Publication Date
TW202312339A TW202312339A (zh) 2023-03-16
TWI843132B true TWI843132B (zh) 2024-05-21

Family

ID=84541233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111123592A TWI843132B (zh) 2021-06-24 2022-06-24 對準裝置

Country Status (6)

Country Link
US (1) US12148646B2 (https=)
JP (1) JP7832199B2 (https=)
KR (1) KR102870970B1 (https=)
CN (1) CN117795656A (https=)
TW (1) TWI843132B (https=)
WO (1) WO2022270265A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521882B2 (en) * 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
JP2026019372A (ja) * 2024-07-26 2026-02-05 川崎重工業株式会社 アライナ、ロボットシステム及び基板のアライメント方法
TWM661429U (zh) * 2024-08-05 2024-10-01 三和技研股份有限公司 晶圓定位裝置

Citations (4)

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JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP2015195328A (ja) * 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

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US3560644A (en) * 1968-02-29 1971-02-02 Us Navy Multiple projection television system
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
KR100389129B1 (ko) 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
KR20050120861A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 프리 얼라이너를 이용한 웨이퍼 에지 검사 장치 및 그의검사 방법
JP2006128440A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体製造装置及び半導体装置の製造方法
US7161667B2 (en) * 2005-05-06 2007-01-09 Kla-Tencor Technologies Corporation Wafer edge inspection
JP5022793B2 (ja) * 2007-07-02 2012-09-12 日東電工株式会社 半導体ウエハの欠陥位置検出方法
US9076342B2 (en) * 2008-02-19 2015-07-07 Architecture Technology Corporation Automated execution and evaluation of network-based training exercises
CN104407518B (zh) * 2008-06-20 2017-05-31 因文西斯系统公司 对用于过程控制的实际和仿真设施进行交互的系统和方法
WO2012134795A2 (en) * 2011-03-25 2012-10-04 Exxonmobile Upstream Research Company Immersive training environment
US9886029B2 (en) * 2013-12-02 2018-02-06 Daihen Corporation Workpiece processing apparatus and workpiece transfer system
AT520964B1 (de) 2018-02-28 2019-11-15 Tatiana Strapacova Vorrichtung und Verfahren zur optischen Erfassung eines Randbereiches eines flachen Objektes
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
KR102134034B1 (ko) * 2018-09-12 2020-07-14 블루테크코리아 주식회사 웨이퍼 치핑 검사 및 로봇 반복 정밀도 검사 가능한 얼라이너 및 상기 얼라이너에 의한 웨이퍼 치핑 검사방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128423A (ja) * 2004-10-29 2006-05-18 Fujitsu Ltd 半導体製造装置
JP2008064595A (ja) * 2006-09-07 2008-03-21 Olympus Corp 基板検査装置
JP2009016438A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP2015195328A (ja) * 2014-03-28 2015-11-05 株式会社ダイヘン ワーク処理装置、ワーク搬送システム

Also Published As

Publication number Publication date
WO2022270265A1 (ja) 2022-12-29
TW202312339A (zh) 2023-03-16
JP7832199B2 (ja) 2026-03-17
KR20240041918A (ko) 2024-04-01
JPWO2022270265A1 (https=) 2022-12-29
CN117795656A (zh) 2024-03-29
US20220415690A1 (en) 2022-12-29
KR102870970B1 (ko) 2025-10-14
US12148646B2 (en) 2024-11-19

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