KR102845029B1 - 후막 저항 페이스트, 후막 저항체, 및 전자 부품 - Google Patents

후막 저항 페이스트, 후막 저항체, 및 전자 부품

Info

Publication number
KR102845029B1
KR102845029B1 KR1020227035719A KR20227035719A KR102845029B1 KR 102845029 B1 KR102845029 B1 KR 102845029B1 KR 1020227035719 A KR1020227035719 A KR 1020227035719A KR 20227035719 A KR20227035719 A KR 20227035719A KR 102845029 B1 KR102845029 B1 KR 102845029B1
Authority
KR
South Korea
Prior art keywords
mass
film resistor
thick
glass
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227035719A
Other languages
English (en)
Korean (ko)
Other versions
KR20230004484A (ko
Inventor
마사키 안도
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20230004484A publication Critical patent/KR20230004484A/ko
Application granted granted Critical
Publication of KR102845029B1 publication Critical patent/KR102845029B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00Compositions for glass with special properties
    • C03C4/14Compositions for glass with special properties for electro-conductive glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/108Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10Frit compositions, i.e. in a powdered or comminuted form containing lead
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003Thick film resistors
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2204/00Glasses, glazes or enamels with special properties
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2205/00Compositions applicable for the manufacture of vitreous enamels or glazes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
KR1020227035719A 2020-05-01 2021-04-30 후막 저항 페이스트, 후막 저항체, 및 전자 부품 Active KR102845029B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-081113 2020-05-01
JP2020081113 2020-05-01
PCT/JP2021/017298 WO2021221172A1 (ja) 2020-05-01 2021-04-30 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品

Publications (2)

Publication Number Publication Date
KR20230004484A KR20230004484A (ko) 2023-01-06
KR102845029B1 true KR102845029B1 (ko) 2025-08-11

Family

ID=78332025

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227035719A Active KR102845029B1 (ko) 2020-05-01 2021-04-30 후막 저항 페이스트, 후막 저항체, 및 전자 부품

Country Status (6)

Country Link
US (1) US12024466B2 (https=)
JP (1) JP7622736B2 (https=)
KR (1) KR102845029B1 (https=)
CN (1) CN115443513B (https=)
TW (1) TWI869590B (https=)
WO (1) WO2021221172A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115516579A (zh) * 2020-05-01 2022-12-23 住友金属矿山株式会社 厚膜电阻糊、厚膜电阻体和电子部件
CN115461825A (zh) * 2020-05-01 2022-12-09 住友金属矿山株式会社 厚膜电阻糊、厚膜电阻体和电子部件

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS5837963B2 (ja) * 1977-07-09 1983-08-19 住友金属鉱山株式会社 抵抗体用ペ−ストの製造方法
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JP2970713B2 (ja) * 1991-12-25 1999-11-02 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 厚膜抵抗体組成物
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
JPH06163202A (ja) 1992-11-19 1994-06-10 Tdk Corp 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
JPH113801A (ja) * 1997-06-11 1999-01-06 Sumitomo Metal Mining Co Ltd 厚膜抵抗ペーストおよびその製造方法
JP3579836B2 (ja) * 2002-02-28 2004-10-20 小島化学薬品株式会社 固定抵抗器
JP2004320003A (ja) 2003-03-31 2004-11-11 Seiko Epson Corp 液滴吐出装置によるパターン形成方法および液滴吐出装置
CN100511496C (zh) * 2004-09-01 2009-07-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻
JP2006163202A (ja) 2004-12-09 2006-06-22 Agilent Technol Inc アレイ基板の検査方法及び検査装置
KR101138238B1 (ko) * 2010-12-24 2012-04-24 (주) 케이엠씨 테크놀러지 금속산화물 코팅을 이용한 저항체용 페이스트 조성물의 제조방법, 이를 이용한 후막 저항체 및 그 제조방법
JP6931455B2 (ja) * 2017-02-17 2021-09-08 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
JP6966717B2 (ja) * 2017-08-25 2021-11-17 住友金属鉱山株式会社 厚膜抵抗体組成物及びそれを含む厚膜抵抗ペースト
JP7135696B2 (ja) * 2018-10-10 2022-09-13 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体

Also Published As

Publication number Publication date
JPWO2021221172A1 (https=) 2021-11-04
CN115443513A (zh) 2022-12-06
JP7622736B2 (ja) 2025-01-28
KR20230004484A (ko) 2023-01-06
WO2021221172A1 (ja) 2021-11-04
US12024466B2 (en) 2024-07-02
CN115443513B (zh) 2026-02-10
TWI869590B (zh) 2025-01-11
TW202147353A (zh) 2021-12-16
US20230271874A1 (en) 2023-08-31

Similar Documents

Publication Publication Date Title
JP6931455B2 (ja) 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
JP6708093B2 (ja) 抵抗ペースト及びその焼成により作製される抵抗体
JP2018092730A (ja) 抵抗体用組成物及びこれを含んだ抵抗体ペーストさらにそれを用いた厚膜抵抗体
KR102845029B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
KR102820136B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
JP7794036B2 (ja) 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品
KR102851511B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
JP7622739B2 (ja) 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品
JP7139691B2 (ja) 厚膜抵抗体用組成物、厚膜抵抗ペースト及び厚膜抵抗体
JP7279551B2 (ja) 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体
JP7390103B2 (ja) 抵抗体用組成物、抵抗ペースト、厚膜抵抗体
JP2023064822A (ja) 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
JP2023077053A (ja) 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
JP2005209748A (ja) 抵抗体及びその製造方法、電子部品
JP2006202925A (ja) 厚膜抵抗体及びその製造方法、並びに電子部品

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)