KR102845029B1 - 후막 저항 페이스트, 후막 저항체, 및 전자 부품 - Google Patents
후막 저항 페이스트, 후막 저항체, 및 전자 부품Info
- Publication number
- KR102845029B1 KR102845029B1 KR1020227035719A KR20227035719A KR102845029B1 KR 102845029 B1 KR102845029 B1 KR 102845029B1 KR 1020227035719 A KR1020227035719 A KR 1020227035719A KR 20227035719 A KR20227035719 A KR 20227035719A KR 102845029 B1 KR102845029 B1 KR 102845029B1
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- film resistor
- thick
- glass
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/14—Compositions for glass with special properties for electro-conductive glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
- C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2204/00—Glasses, glazes or enamels with special properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2205/00—Compositions applicable for the manufacture of vitreous enamels or glazes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-081113 | 2020-05-01 | ||
| JP2020081113 | 2020-05-01 | ||
| PCT/JP2021/017298 WO2021221172A1 (ja) | 2020-05-01 | 2021-04-30 | 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230004484A KR20230004484A (ko) | 2023-01-06 |
| KR102845029B1 true KR102845029B1 (ko) | 2025-08-11 |
Family
ID=78332025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227035719A Active KR102845029B1 (ko) | 2020-05-01 | 2021-04-30 | 후막 저항 페이스트, 후막 저항체, 및 전자 부품 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12024466B2 (https=) |
| JP (1) | JP7622736B2 (https=) |
| KR (1) | KR102845029B1 (https=) |
| CN (1) | CN115443513B (https=) |
| TW (1) | TWI869590B (https=) |
| WO (1) | WO2021221172A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115516579A (zh) * | 2020-05-01 | 2022-12-23 | 住友金属矿山株式会社 | 厚膜电阻糊、厚膜电阻体和电子部件 |
| CN115461825A (zh) * | 2020-05-01 | 2022-12-09 | 住友金属矿山株式会社 | 厚膜电阻糊、厚膜电阻体和电子部件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254195A (en) * | 1975-10-29 | 1977-05-02 | Hitachi Ltd | Resistor |
| JPS53100496A (en) * | 1977-02-15 | 1978-09-01 | Sumitomo Metal Mining Co | Method of manufacturing paste for resistance body |
| JPS5837963B2 (ja) * | 1977-07-09 | 1983-08-19 | 住友金属鉱山株式会社 | 抵抗体用ペ−ストの製造方法 |
| JPS6324601A (ja) * | 1986-07-17 | 1988-02-02 | 松下電器産業株式会社 | 描画用抵抗体組成物 |
| JPH04320003A (ja) | 1991-04-18 | 1992-11-10 | Tdk Corp | 厚膜抵抗体 |
| JP2970713B2 (ja) * | 1991-12-25 | 1999-11-02 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜抵抗体組成物 |
| JPH06140214A (ja) * | 1992-10-23 | 1994-05-20 | Sumitomo Metal Mining Co Ltd | 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法 |
| JPH06163202A (ja) | 1992-11-19 | 1994-06-10 | Tdk Corp | 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法 |
| US5379016A (en) * | 1993-06-03 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Chip resistor |
| JPH113801A (ja) * | 1997-06-11 | 1999-01-06 | Sumitomo Metal Mining Co Ltd | 厚膜抵抗ペーストおよびその製造方法 |
| JP3579836B2 (ja) * | 2002-02-28 | 2004-10-20 | 小島化学薬品株式会社 | 固定抵抗器 |
| JP2004320003A (ja) | 2003-03-31 | 2004-11-11 | Seiko Epson Corp | 液滴吐出装置によるパターン形成方法および液滴吐出装置 |
| CN100511496C (zh) * | 2004-09-01 | 2009-07-08 | Tdk株式会社 | 厚膜电阻浆料和厚膜电阻 |
| JP2006163202A (ja) | 2004-12-09 | 2006-06-22 | Agilent Technol Inc | アレイ基板の検査方法及び検査装置 |
| KR101138238B1 (ko) * | 2010-12-24 | 2012-04-24 | (주) 케이엠씨 테크놀러지 | 금속산화물 코팅을 이용한 저항체용 페이스트 조성물의 제조방법, 이를 이용한 후막 저항체 및 그 제조방법 |
| JP6931455B2 (ja) * | 2017-02-17 | 2021-09-08 | 住友金属鉱山株式会社 | 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体 |
| JP6966717B2 (ja) * | 2017-08-25 | 2021-11-17 | 住友金属鉱山株式会社 | 厚膜抵抗体組成物及びそれを含む厚膜抵抗ペースト |
| JP7135696B2 (ja) * | 2018-10-10 | 2022-09-13 | 住友金属鉱山株式会社 | 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体 |
-
2021
- 2021-04-30 CN CN202180030831.1A patent/CN115443513B/zh active Active
- 2021-04-30 JP JP2022518159A patent/JP7622736B2/ja active Active
- 2021-04-30 KR KR1020227035719A patent/KR102845029B1/ko active Active
- 2021-04-30 WO PCT/JP2021/017298 patent/WO2021221172A1/ja not_active Ceased
- 2021-04-30 US US17/922,096 patent/US12024466B2/en active Active
- 2021-05-03 TW TW110115856A patent/TWI869590B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021221172A1 (https=) | 2021-11-04 |
| CN115443513A (zh) | 2022-12-06 |
| JP7622736B2 (ja) | 2025-01-28 |
| KR20230004484A (ko) | 2023-01-06 |
| WO2021221172A1 (ja) | 2021-11-04 |
| US12024466B2 (en) | 2024-07-02 |
| CN115443513B (zh) | 2026-02-10 |
| TWI869590B (zh) | 2025-01-11 |
| TW202147353A (zh) | 2021-12-16 |
| US20230271874A1 (en) | 2023-08-31 |
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St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| R18-X000 | Changes to party contact information recorded |
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| P13-X000 | Application amended |
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