KR102826807B1 - 기판 처리의 조건 설정 지원 방법, 기판 처리 시스템, 기억 매체 및 학습 모델 - Google Patents

기판 처리의 조건 설정 지원 방법, 기판 처리 시스템, 기억 매체 및 학습 모델 Download PDF

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KR102826807B1
KR102826807B1 KR1020217017505A KR20217017505A KR102826807B1 KR 102826807 B1 KR102826807 B1 KR 102826807B1 KR 1020217017505 A KR1020217017505 A KR 1020217017505A KR 20217017505 A KR20217017505 A KR 20217017505A KR 102826807 B1 KR102826807 B1 KR 102826807B1
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KR20210092238A (ko
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다케시 시모아오키
유이치로 구누기모토
게이시 하마다
다카후미 하야마
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H01L21/67276—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/12—Computing arrangements based on biological models using genetic models
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Bioinformatics & Cheminformatics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Automation & Control Theory (AREA)
  • Coating Apparatus (AREA)
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KR1020217017505A 2018-11-21 2019-11-12 기판 처리의 조건 설정 지원 방법, 기판 처리 시스템, 기억 매체 및 학습 모델 Active KR102826807B1 (ko)

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JP2018218375 2018-11-21
JPJP-P-2018-218375 2018-11-21
PCT/JP2019/044429 WO2020105517A1 (ja) 2018-11-21 2019-11-12 基板処理の条件設定支援方法、基板処理システム、記憶媒体及び学習モデル

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KR20210092238A KR20210092238A (ko) 2021-07-23
KR102826807B1 true KR102826807B1 (ko) 2025-07-01

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JP (2) JP7594914B2 (https=)
KR (1) KR102826807B1 (https=)
CN (1) CN112997274B (https=)
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JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP7808940B2 (ja) 2021-09-22 2026-01-30 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法、レシピ決定方法及び学習プログラム
US12443153B2 (en) 2021-09-24 2025-10-14 Onto Innovation Inc. Deep learning model in high-mix semiconductor manufacturing
US12278101B2 (en) * 2021-11-11 2025-04-15 Applied Materials, Inc. Coded substrate material identifier communication tool
JP7709930B2 (ja) 2022-02-18 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理条件の設定方法、基板処理方法、基板処理条件の設定システム、及び、基板処理システム
JP2024165967A (ja) * 2023-05-18 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 予測アルゴリズム生成装置、情報処理装置、基板処理装置、予測アルゴリズム生成方法、予測アルゴリズム生成プログラム、処理条件決定方法、処理条件決定プログラムおよび予測アルゴリズム
WO2025154410A1 (ja) * 2024-01-16 2025-07-24 パナソニックＩｐマネジメント株式会社 推定システム、推定方法、データ選定システム、及びデータ選定方法
JP2025184266A (ja) * 2024-06-06 2025-12-18 株式会社Ｓｃｒｅｅｎホールディングス 学習モデル生成方法、学習モデル生成装置および学習モデル生成プログラム
KR102850431B1 (ko) * 2024-07-31 2025-08-27 (주)동주 인공지능 알고리즘을 이용하여 도장 제품의 불량률을 제어하는 장치 및 시스템

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CN112997274A (zh) 2021-06-18
CN112997274B (zh) 2024-08-30
KR20210092238A (ko) 2021-07-23
TW202024942A (zh) 2020-07-01
JP7699180B2 (ja) 2025-06-26
WO2020105517A1 (ja) 2020-05-28
JP7594914B2 (ja) 2024-12-05
TWI830812B (zh) 2024-02-01
JPWO2020105517A1 (ja) 2021-09-30
JP2023171555A (ja) 2023-12-01

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