KR102768423B1 - 표시 장치, 표시 모듈, 및 전자 기기 - Google Patents

표시 장치, 표시 모듈, 및 전자 기기 Download PDF

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KR102768423B1
KR102768423B1 KR1020217006677A KR20217006677A KR102768423B1 KR 102768423 B1 KR102768423 B1 KR 102768423B1 KR 1020217006677 A KR1020217006677 A KR 1020217006677A KR 20217006677 A KR20217006677 A KR 20217006677A KR 102768423 B1 KR102768423 B1 KR 102768423B1
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light
conductive layer
electrode
emitting diode
transistor
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Korean (ko)
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KR20210043604A (ko
Inventor
가즈노리 와타나베
고지 구수노키
다이키 노나카
히로키 아다치
고이치 다케시마
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H01L25/13
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D87/00Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30Active-matrix LED displays
    • H10H29/39Connection of the pixel electrodes to the driving transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30Active-matrix LED displays
    • H10H29/49Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80Constructional details
    • H10H29/85Packages

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of El Displays (AREA)
  • Led Devices (AREA)
KR1020217006677A 2018-09-07 2019-08-26 표시 장치, 표시 모듈, 및 전자 기기 Active KR102768423B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257004409A KR20250024132A (ko) 2018-09-07 2019-08-26 표시 장치, 표시 모듈, 및 전자 기기

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018167554 2018-09-07
JPJP-P-2018-167554 2018-09-07
PCT/IB2019/057136 WO2020049397A1 (ja) 2018-09-07 2019-08-26 表示装置、表示モジュール、及び電子機器

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KR20210043604A KR20210043604A (ko) 2021-04-21
KR102768423B1 true KR102768423B1 (ko) 2025-02-13

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KR1020257004409A Pending KR20250024132A (ko) 2018-09-07 2019-08-26 표시 장치, 표시 모듈, 및 전자 기기

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Country Status (6)

Country Link
US (3) US12033987B2 (https=)
JP (3) JP7313358B2 (https=)
KR (2) KR102768423B1 (https=)
CN (2) CN112673411B (https=)
TW (2) TWI846725B (https=)
WO (1) WO2020049397A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101422362B1 (ko) * 2009-07-10 2014-07-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 패널 및 전자 기기
WO2019230229A1 (ja) * 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
US11710760B2 (en) 2019-06-21 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, electronic device, and manufacturing method of display device
CN114641816A (zh) 2019-11-21 2022-06-17 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法
FR3112902B1 (fr) * 2020-07-22 2022-12-16 Aledia Dispositif optoélectronique flexible et son procédé de fabrication
US11476299B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
CN112038375B (zh) 2020-09-02 2022-11-15 昆山国显光电有限公司 显示面板和显示装置
US12355019B2 (en) 2020-10-01 2025-07-08 Semiconductor Energy Laboratory Co., Ltd. Display apparatus and electronic device
WO2022137015A1 (ja) * 2020-12-25 2022-06-30 株式会社半導体エネルギー研究所 表示装置、表示モジュール、及び、電子機器
KR20230145080A (ko) 2021-02-12 2023-10-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 전자 기기
CN116868261A (zh) * 2021-02-26 2023-10-10 株式会社半导体能源研究所 显示装置及电子设备
US20240257671A1 (en) 2021-05-13 2024-08-01 Semiconductor Energy Laboratory Co., Ltd. Electronic device
KR20230013669A (ko) * 2021-07-15 2023-01-27 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US20240258480A1 (en) * 2021-07-22 2024-08-01 Lg Electronics Inc. Display device comprising semiconductor light-emitting element
EP4182403B1 (en) * 2021-07-27 2024-09-18 Signify Holding B.V. A white light emitting device
TWI861592B (zh) 2022-01-17 2024-11-11 禾瑞亞科技股份有限公司 觸控結構及其觸控處理裝置、方法與電子系統
CN115083278B (zh) * 2022-06-24 2024-07-16 维沃移动通信有限公司 显示组件和电子设备
US20250098364A1 (en) * 2023-09-14 2025-03-20 Pixart Imaging Inc. Optical detection device
WO2025196181A1 (en) * 2024-03-20 2025-09-25 Ams-Osram International Gmbh Optoelectronic component and method of producing an optoelectronic component
CN119604106B (zh) * 2024-12-04 2026-01-16 华引芯(武汉)科技有限公司 光驱一体的叠层封装结构及其制备方法、灯板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137509A (ja) 2011-10-18 2013-07-11 Semiconductor Energy Lab Co Ltd 半導体装置
JP2016174143A (ja) 2015-01-26 2016-09-29 株式会社半導体エネルギー研究所 半導体装置およびその製造方法
JP2018101785A (ja) 2016-12-20 2018-06-28 エルジー ディスプレイ カンパニー リミテッド 発光ダイオードチップ及びこれを含む発光ダイオードディスプレイ装置

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW540251B (en) * 1999-09-24 2003-07-01 Semiconductor Energy Lab EL display device and method for driving the same
JP3973471B2 (ja) 2001-12-14 2007-09-12 三洋電機株式会社 デジタル駆動型表示装置
JP4120223B2 (ja) 2002-01-16 2008-07-16 ソニー株式会社 電子部品の製造方法、これを用いた画像表示装置
US7230374B2 (en) * 2003-09-22 2007-06-12 Samsung Sdi Co., Ltd. Full color organic light-emitting device having color modulation layer
KR101143005B1 (ko) * 2004-12-14 2012-05-08 삼성전자주식회사 마스크 및 이를 이용한 반도체 소자의 제조 방법 및 박막트랜지스터 표시판의 제조 방법
CN100448040C (zh) 2006-01-12 2008-12-31 聚鼎科技股份有限公司 具有温度控制功能的发光二极管装置
US8405318B2 (en) 2007-02-28 2013-03-26 Koa Corporation Light-emitting component and its manufacturing method
JP5268267B2 (ja) 2007-02-28 2013-08-21 コーア株式会社 発光部品およびその製造法
CN101060152A (zh) 2007-05-15 2007-10-24 佛山市国星光电科技有限公司 一种片式发光二极管
JP5317712B2 (ja) * 2008-01-22 2013-10-16 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
KR102187427B1 (ko) 2008-09-19 2020-12-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
TWI406589B (zh) 2008-10-28 2013-08-21 Ind Tech Res Inst Led光源控制電路與方法,及應用其之影像顯示裝置與照明設備
TWI389295B (zh) * 2009-02-18 2013-03-11 奇力光電科技股份有限公司 發光二極體光源模組
KR101422362B1 (ko) * 2009-07-10 2014-07-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 패널 및 전자 기기
KR101155903B1 (ko) * 2010-03-09 2012-06-21 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법
US12176356B2 (en) 2011-10-18 2024-12-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including transistor and light-emitting element
US20150014738A1 (en) * 2012-02-21 2015-01-15 Peiching Ling Light emitting diode package and method of fabricating the same
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
US9159700B2 (en) 2012-12-10 2015-10-13 LuxVue Technology Corporation Active matrix emissive micro LED display
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
JP6157178B2 (ja) 2013-04-01 2017-07-05 ソニーセミコンダクタソリューションズ株式会社 表示装置
TWI692108B (zh) * 2013-04-10 2020-04-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
CN203218328U (zh) * 2013-04-24 2013-09-25 佛山市国星光电股份有限公司 一种新型led器件及由其制造的led显示屏
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9318663B2 (en) * 2013-07-10 2016-04-19 Epistar Corporation Light-emitting element
US20150021634A1 (en) 2013-07-22 2015-01-22 Rohm Co., Ltd. Display unit using led light sources
JP2015023220A (ja) 2013-07-22 2015-02-02 ローム株式会社 表示装置
JP6280710B2 (ja) * 2013-09-02 2018-02-14 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
WO2015083042A1 (ja) * 2013-12-03 2015-06-11 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP6402017B2 (ja) * 2013-12-26 2018-10-10 株式会社半導体エネルギー研究所 半導体装置
KR102116986B1 (ko) * 2014-02-17 2020-05-29 삼성전자 주식회사 발광 다이오드 패키지
US9831387B2 (en) * 2014-06-14 2017-11-28 Hiphoton Co., Ltd. Light engine array
US9219197B1 (en) 2014-05-30 2015-12-22 Mikro Mesa Technology Co., Ltd. Micro-light-emitting diode
US9105813B1 (en) 2014-05-30 2015-08-11 Mikro Mesa Technology Co., Ltd. Micro-light-emitting diode
US10158043B2 (en) 2014-05-30 2018-12-18 Mikro Mesa Technolgy Co., Ltd. Light-emitting diode and method for manufacturing the same
TWI765679B (zh) * 2014-05-30 2022-05-21 日商半導體能源研究所股份有限公司 觸控面板
US9590137B2 (en) 2014-05-30 2017-03-07 Mikro Mesa Technology Co., Ltd. Light-emitting diode
US9231153B2 (en) 2014-05-30 2016-01-05 Mikro Mesa Technology Co., Ltd. Micro-light-emitting diode
CN111244141B (zh) 2014-05-30 2023-10-13 株式会社半导体能源研究所 发光装置、显示装置及电子设备
US9825202B2 (en) 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
TWI704706B (zh) 2015-03-09 2020-09-11 日商半導體能源研究所股份有限公司 發光元件、顯示裝置、電子裝置及照明設置
KR20160141301A (ko) * 2015-05-29 2016-12-08 삼성전자주식회사 반도체 발광 소자 패키지
CN104979326B (zh) 2015-07-09 2017-12-05 深圳市晶泓科技有限公司 Led发光组件、led发光面板和led显示屏
US20170062749A1 (en) 2015-09-01 2017-03-02 Semiconductor Energy Laboratory Co., Ltd. Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device
CN107924653B (zh) 2015-09-11 2020-02-28 夏普株式会社 图像显示装置以及图像显示元件的制造方法
US20170090246A1 (en) 2015-09-25 2017-03-30 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
KR102741547B1 (ko) 2015-12-11 2024-12-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR102617041B1 (ko) 2015-12-28 2023-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 장치, 텔레비전 시스템, 및 전자 기기
KR20170087091A (ko) 2016-01-19 2017-07-28 삼성디스플레이 주식회사 표시 장치
JP2017157724A (ja) 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
KR20180002123A (ko) 2016-06-28 2018-01-08 삼성디스플레이 주식회사 표시장치
WO2018003027A1 (ja) 2016-06-29 2018-01-04 三菱電機株式会社 表示装置および表示装置の製造方法
US10332949B2 (en) 2016-07-06 2019-06-25 Seoul Semiconductor Co., Ltd. Display apparatus
KR101964934B1 (ko) 2016-07-29 2019-04-04 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102393565B1 (ko) 2016-08-17 2022-05-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR102651097B1 (ko) 2016-10-28 2024-03-22 엘지디스플레이 주식회사 발광 다이오드 디스플레이 장치
JP2018077376A (ja) 2016-11-10 2018-05-17 株式会社半導体エネルギー研究所 表示装置
JP7050460B2 (ja) 2016-11-22 2022-04-08 株式会社半導体エネルギー研究所 表示装置
US10756118B2 (en) 2016-11-30 2020-08-25 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, and electronic device
JP7143278B2 (ja) 2017-03-24 2022-09-28 株式会社半導体エネルギー研究所 半導体装置
KR102374754B1 (ko) * 2017-09-27 2022-03-15 엘지디스플레이 주식회사 터치 구조물을 포함하는 디스플레이 장치
TWI798308B (zh) 2017-12-25 2023-04-11 日商半導體能源研究所股份有限公司 顯示器及包括該顯示器的電子裝置
CN108538890A (zh) * 2018-04-20 2018-09-14 深圳市华星光电技术有限公司 一种有机发光显示装置
US12087741B2 (en) 2018-05-17 2024-09-10 Semiconductor Energy Laboratory Co., Ltd. Display device
JP7289294B2 (ja) 2018-05-18 2023-06-09 株式会社半導体エネルギー研究所 表示装置、表示モジュール、電子機器、及び、表示装置の作製方法
CN112639937B (zh) 2018-09-05 2023-06-23 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法
US11710760B2 (en) 2019-06-21 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, electronic device, and manufacturing method of display device
CN110504282B (zh) * 2019-08-27 2021-11-23 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
KR102827179B1 (ko) * 2019-12-23 2025-07-01 삼성디스플레이 주식회사 표시 장치 및 제조 방법
KR102929690B1 (ko) * 2020-05-25 2026-02-20 삼성전자주식회사 발광 소자, 광원 모듈 및 발광 소자 제조 방법
US12148857B2 (en) * 2020-12-15 2024-11-19 Samsung Electronics Co., Ltd. Method of manufacturing micro-LED display
CN112669714B (zh) * 2020-12-22 2022-09-20 业成科技(成都)有限公司 发光二极体显示器及其制作方法
CN113160758B (zh) * 2021-03-03 2022-12-02 华源智信半导体(深圳)有限公司 直下式mini-LED背光模组及显示装置的亮度补偿方法和校正系统
US11961822B2 (en) * 2022-01-17 2024-04-16 Samsung Display Co., Ltd. Display device, and tiled display device including the display device
KR102889726B1 (ko) * 2022-01-21 2025-11-24 삼성디스플레이 주식회사 표시 장치 및 이를 포함하는 타일형 표시 장치
US20230238496A1 (en) * 2022-01-21 2023-07-27 Samsung Display Co., Ltd. Display device and tiled display device
KR102950151B1 (ko) * 2022-01-21 2026-04-10 삼성디스플레이 주식회사 표시 장치 및 타일형 표시 장치
US12588337B2 (en) * 2022-01-28 2026-03-24 Samsung Display Co., Ltd. Display device and tiled display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137509A (ja) 2011-10-18 2013-07-11 Semiconductor Energy Lab Co Ltd 半導体装置
JP2016174143A (ja) 2015-01-26 2016-09-29 株式会社半導体エネルギー研究所 半導体装置およびその製造方法
JP2018101785A (ja) 2016-12-20 2018-06-28 エルジー ディスプレイ カンパニー リミテッド 発光ダイオードチップ及びこれを含む発光ダイオードディスプレイ装置

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